JPH0262747U - - Google Patents
Info
- Publication number
- JPH0262747U JPH0262747U JP14094688U JP14094688U JPH0262747U JP H0262747 U JPH0262747 U JP H0262747U JP 14094688 U JP14094688 U JP 14094688U JP 14094688 U JP14094688 U JP 14094688U JP H0262747 U JPH0262747 U JP H0262747U
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin body
- receiving
- lead
- emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988140946U JPH0745967Y2 (ja) | 1988-10-27 | 1988-10-27 | 光結合装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988140946U JPH0745967Y2 (ja) | 1988-10-27 | 1988-10-27 | 光結合装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0262747U true JPH0262747U (US06826419-20041130-M00005.png) | 1990-05-10 |
| JPH0745967Y2 JPH0745967Y2 (ja) | 1995-10-18 |
Family
ID=31405573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988140946U Expired - Fee Related JPH0745967Y2 (ja) | 1988-10-27 | 1988-10-27 | 光結合装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0745967Y2 (US06826419-20041130-M00005.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001326113A (ja) * | 2000-05-15 | 2001-11-22 | Oizumi Seisakusho:Kk | 電子部品実装用リードフレームおよび電子部品 |
| JP2008172183A (ja) * | 2007-01-15 | 2008-07-24 | Yiguang Electronic Ind Co Ltd | フォトインタラプタ及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62149177A (ja) * | 1985-12-23 | 1987-07-03 | Sharp Corp | コネクタ付光結合素子の製法 |
-
1988
- 1988-10-27 JP JP1988140946U patent/JPH0745967Y2/ja not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62149177A (ja) * | 1985-12-23 | 1987-07-03 | Sharp Corp | コネクタ付光結合素子の製法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001326113A (ja) * | 2000-05-15 | 2001-11-22 | Oizumi Seisakusho:Kk | 電子部品実装用リードフレームおよび電子部品 |
| JP2008172183A (ja) * | 2007-01-15 | 2008-07-24 | Yiguang Electronic Ind Co Ltd | フォトインタラプタ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0745967Y2 (ja) | 1995-10-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |