JPH0262743U - - Google Patents
Info
- Publication number
- JPH0262743U JPH0262743U JP14125988U JP14125988U JPH0262743U JP H0262743 U JPH0262743 U JP H0262743U JP 14125988 U JP14125988 U JP 14125988U JP 14125988 U JP14125988 U JP 14125988U JP H0262743 U JPH0262743 U JP H0262743U
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- semiconductor image
- package
- mounting part
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14125988U JPH0262743U (de) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14125988U JPH0262743U (de) | 1988-10-28 | 1988-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262743U true JPH0262743U (de) | 1990-05-10 |
Family
ID=31406176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14125988U Pending JPH0262743U (de) | 1988-10-28 | 1988-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262743U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7448861B2 (en) | 2003-06-26 | 2008-11-11 | Nec Electronics Corporation | Resin molded semiconductor device and mold |
| CN106463515A (zh) * | 2014-06-25 | 2017-02-22 | 京瓷株式会社 | 摄像元件安装用基板及摄像装置 |
-
1988
- 1988-10-28 JP JP14125988U patent/JPH0262743U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7448861B2 (en) | 2003-06-26 | 2008-11-11 | Nec Electronics Corporation | Resin molded semiconductor device and mold |
| CN106463515A (zh) * | 2014-06-25 | 2017-02-22 | 京瓷株式会社 | 摄像元件安装用基板及摄像装置 |
| JPWO2015199134A1 (ja) * | 2014-06-25 | 2017-06-08 | 京セラ株式会社 | 撮像素子実装用基板および撮像装置 |
| US10319759B2 (en) | 2014-06-25 | 2019-06-11 | Kyocera Corporation | Image pickup element mounting substrate and image pickup device |
| CN106463515B (zh) * | 2014-06-25 | 2020-01-14 | 京瓷株式会社 | 摄像元件安装用基板及摄像装置 |