JPH0262739U - - Google Patents
Info
- Publication number
- JPH0262739U JPH0262739U JP14217088U JP14217088U JPH0262739U JP H0262739 U JPH0262739 U JP H0262739U JP 14217088 U JP14217088 U JP 14217088U JP 14217088 U JP14217088 U JP 14217088U JP H0262739 U JPH0262739 U JP H0262739U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- fixed
- region
- sealed
- mesa
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14217088U JPH0617318Y2 (ja) | 1988-10-31 | 1988-10-31 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14217088U JPH0617318Y2 (ja) | 1988-10-31 | 1988-10-31 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0262739U true JPH0262739U (enrdf_load_stackoverflow) | 1990-05-10 |
JPH0617318Y2 JPH0617318Y2 (ja) | 1994-05-02 |
Family
ID=31407892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14217088U Expired - Lifetime JPH0617318Y2 (ja) | 1988-10-31 | 1988-10-31 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0617318Y2 (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001345417A (ja) * | 2000-06-01 | 2001-12-14 | Aisin Aw Co Ltd | 電子部品ユニット |
JP2024038738A (ja) * | 2022-09-08 | 2024-03-21 | 三菱電機株式会社 | 半導体装置 |
-
1988
- 1988-10-31 JP JP14217088U patent/JPH0617318Y2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001345417A (ja) * | 2000-06-01 | 2001-12-14 | Aisin Aw Co Ltd | 電子部品ユニット |
JP2024038738A (ja) * | 2022-09-08 | 2024-03-21 | 三菱電機株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0617318Y2 (ja) | 1994-05-02 |