JPH0262735U - - Google Patents
Info
- Publication number
- JPH0262735U JPH0262735U JP14127088U JP14127088U JPH0262735U JP H0262735 U JPH0262735 U JP H0262735U JP 14127088 U JP14127088 U JP 14127088U JP 14127088 U JP14127088 U JP 14127088U JP H0262735 U JPH0262735 U JP H0262735U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- groove
- hole
- round bar
- bar lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14127088U JPH0262735U (no) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14127088U JPH0262735U (no) | 1988-10-28 | 1988-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262735U true JPH0262735U (no) | 1990-05-10 |
Family
ID=31406198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14127088U Pending JPH0262735U (no) | 1988-10-28 | 1988-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262735U (no) |
-
1988
- 1988-10-28 JP JP14127088U patent/JPH0262735U/ja active Pending