JPH0262734U - - Google Patents

Info

Publication number
JPH0262734U
JPH0262734U JP13993388U JP13993388U JPH0262734U JP H0262734 U JPH0262734 U JP H0262734U JP 13993388 U JP13993388 U JP 13993388U JP 13993388 U JP13993388 U JP 13993388U JP H0262734 U JPH0262734 U JP H0262734U
Authority
JP
Japan
Prior art keywords
lead
metal conductor
semiconductor device
integrated
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13993388U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0755003Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988139933U priority Critical patent/JPH0755003Y2/ja
Publication of JPH0262734U publication Critical patent/JPH0262734U/ja
Application granted granted Critical
Publication of JPH0755003Y2 publication Critical patent/JPH0755003Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1988139933U 1988-10-28 1988-10-28 半導体素子用セラミックパッケージ Expired - Lifetime JPH0755003Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988139933U JPH0755003Y2 (ja) 1988-10-28 1988-10-28 半導体素子用セラミックパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988139933U JPH0755003Y2 (ja) 1988-10-28 1988-10-28 半導体素子用セラミックパッケージ

Publications (2)

Publication Number Publication Date
JPH0262734U true JPH0262734U (US07122547-20061017-C00224.png) 1990-05-10
JPH0755003Y2 JPH0755003Y2 (ja) 1995-12-18

Family

ID=31403649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988139933U Expired - Lifetime JPH0755003Y2 (ja) 1988-10-28 1988-10-28 半導体素子用セラミックパッケージ

Country Status (1)

Country Link
JP (1) JPH0755003Y2 (US07122547-20061017-C00224.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242743A (ja) * 2006-03-07 2007-09-20 Hitachi Ltd 鉛フリーはんだを用いたリード付き電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142546A (ja) * 1983-12-29 1985-07-27 Matsushita Electronics Corp 半導体集積回路用パツケ−ジ
JPS62232949A (ja) * 1986-04-02 1987-10-13 Nec Corp 半導体装置用パツケ−ジ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142546A (ja) * 1983-12-29 1985-07-27 Matsushita Electronics Corp 半導体集積回路用パツケ−ジ
JPS62232949A (ja) * 1986-04-02 1987-10-13 Nec Corp 半導体装置用パツケ−ジ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242743A (ja) * 2006-03-07 2007-09-20 Hitachi Ltd 鉛フリーはんだを用いたリード付き電子部品
JP4595835B2 (ja) * 2006-03-07 2010-12-08 株式会社日立製作所 鉛フリーはんだを用いたリード付き電子部品

Also Published As

Publication number Publication date
JPH0755003Y2 (ja) 1995-12-18

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