JPH0261211B2 - - Google Patents

Info

Publication number
JPH0261211B2
JPH0261211B2 JP60284597A JP28459785A JPH0261211B2 JP H0261211 B2 JPH0261211 B2 JP H0261211B2 JP 60284597 A JP60284597 A JP 60284597A JP 28459785 A JP28459785 A JP 28459785A JP H0261211 B2 JPH0261211 B2 JP H0261211B2
Authority
JP
Japan
Prior art keywords
solder
core wire
wire
core
electric wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60284597A
Other languages
Japanese (ja)
Other versions
JPS62144516A (en
Inventor
Ryoji Watanabe
Takaharu Oono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YUUKOO KK
Original Assignee
YUUKOO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YUUKOO KK filed Critical YUUKOO KK
Priority to JP60284597A priority Critical patent/JPS62144516A/en
Publication of JPS62144516A publication Critical patent/JPS62144516A/en
Publication of JPH0261211B2 publication Critical patent/JPH0261211B2/ja
Granted legal-status Critical Current

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  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Processing Of Terminals (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、電線端末部の絶縁被覆を除去して、
露出された芯線に予備半田付けをする電線の端末
処理方法に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for removing the insulation coating from the terminal portion of the electric wire.
The present invention relates to an electric wire terminal processing method in which the exposed core wire is preliminarily soldered.

[従来の技術] 電線の端末部を接続し易くするため、その端末
部の絶縁被覆を除去して、芯線に予備半田付をす
ることは従来から実施されている。しかし、一般
に電線の芯線は多数の細線を撚り合せて形成され
ているため、絶縁被覆を除去した場合は芯線の端
末部がほぐれ易いという厄介な問題がある。従つ
て、予備半田付を行う前に、ほぐれた芯線の端末
部を再び撚り合わさなければならない面倒な工程
が必要であり、また撚り合わせたところで一旦ほ
ぐれたものを元の細い小径にすることが難しく、
例えば芯線の端末をプリント基板のスルーホール
等に通し難くなる欠点がある。
[Prior Art] In order to make it easier to connect the terminal portions of electric wires, it has been conventionally practiced to remove the insulation coating from the terminal portions and pre-solder the core wires. However, since the core wire of an electric wire is generally formed by twisting a large number of fine wires together, there is a troublesome problem that the end portion of the core wire tends to come undone when the insulation coating is removed. Therefore, before pre-soldering, it is necessary to go through the troublesome process of re-twisting the ends of the unraveled core wires, and once they are twisted together, it is difficult to return the unraveled wires to their original small diameter. difficult,
For example, there is a drawback that it becomes difficult to pass the end of the core wire through a through hole of a printed circuit board.

特に、長く露出した芯線の先端にのみ半田を付
着する場合には、半田が付着しない露出芯線部分
にフラツクスが付着し、さびが発生し易くなり後
に電気的な障害が生ずる虞れが多分にある。
In particular, when applying solder only to the tip of a long exposed core wire, there is a high risk that flux will adhere to the exposed core wire portion to which solder does not adhere, which will easily cause rust and cause electrical failure later. .

[発明の目的] 本発明の目的は、電線端末部の絶縁被覆を除去
して、芯線の端末部に予備半田付を行う場合にお
いて、芯線の端末部を良好に処理できる電線の端
末処理方法を提供することにある。
[Object of the Invention] An object of the present invention is to provide a method for processing the end of a wire, which can properly treat the end of the core wire when the insulation coating of the end of the wire is removed and the end of the core wire is pre-soldered. It is about providing.

[発明の概要] 上述の目的を達成するための本発明の要旨は、
電線の端末部の絶縁被覆を芯線がほぐれない程度
の長さだけ剥離する第1の工程と、該第1の工程
により露出された前記芯線の端末部を半田槽に浸
漬して芯線に半田を付着する第2の工程と、必要
な長さだけ更に前記絶縁被覆を剥離すると共に、
前記芯線の半田の付着している部分の先端を切断
する第3の工程とを有することを特徴とする電線
の端末処理方法である。
[Summary of the invention] The gist of the present invention for achieving the above object is as follows:
A first step of peeling off the insulation coating on the terminal end of the electric wire to a length that prevents the core wire from unraveling, and immersing the end section of the core wire exposed in the first step in a solder bath to apply solder to the core wire. a second step of adhering, and further peeling off the insulating coating to a required length;
A method for processing an end of an electric wire, comprising a third step of cutting the tip of the portion of the core wire to which solder is attached.

[発明の実施例] 本発明に係る方法を図示の実施例に基づいて詳
細に説明する。
[Embodiments of the Invention] The method according to the present invention will be explained in detail based on illustrated embodiments.

第1図a〜fは、電線1が一対2本の芯線2
a,2bから成る場合の端末処理工程を例示した
ものである。先ず、aに示すように電線1の端末
部の絶縁被覆3に、ナイフ刃により芯線2a,2
bを分離するような切込み4を入れて股裂きを行
う。
In Figure 1 a to f, a wire 1 is paired with two core wires 2.
This is an example of the terminal processing process in the case where the terminal is composed of a and 2b. First, as shown in a, the core wires 2a, 2 are inserted into the insulation coating 3 at the end of the electric wire 1 using a knife blade.
Make a cut 4 to separate b and perform the crotch split.

次にbに示すように、絶縁被覆3の端末部を少
しだけ削除して芯線2a,2bの端末部を僅かに
露出する。この露出長さは僅かであるため、芯線
2a,2bは殆どほぐれない状態が保持される。
Next, as shown in b, the terminal portions of the insulating coating 3 are slightly removed to slightly expose the terminal portions of the core wires 2a and 2b. Since this exposed length is small, the core wires 2a and 2b are maintained in a state in which they are hardly unraveled.

ここでcに示すように、芯線2a,2bの露出
した端末部にフラツクス5を滴下により付着し、
更にこの部分を半田槽中の溶融半田に浸漬してd
に示すように予備半田6を付着する。
Here, as shown in c, the flux 5 is attached to the exposed end portions of the core wires 2a and 2b by dropping,
Furthermore, this part is dipped in molten solder in a solder bath.
Preliminary solder 6 is applied as shown in FIG.

次にeに示すように、予備半田6の付着してい
る部分の端末部に近い切断線C1−C1で示す部
分を切断する。
Next, as shown in e, a portion indicated by the cutting line C1-C1 near the end of the portion to which the preliminary solder 6 is attached is cut.

更にfに示すように、絶縁被覆3を必要な長さ
だけ例えばeに示す切断線C2−C2から切断し
て皮むきを行う。
Further, as shown in f, the insulation coating 3 is cut to a required length, for example, from the cutting line C2-C2 shown in e, and then peeled.

かくすることにより、芯線2a,2bはfに示
すように予備半田6の付いている端末部と半田の
付着していない部分とが露出することになる。
By doing this, the end portions of the core wires 2a and 2b to which the preliminary solder 6 is attached and the portions to which no solder is attached are exposed as shown in f.

なお、以上の工程で、aの股裂き用切込み4を
入れる工程は、eのカツト工程後で行つてもよ
い。勿論、芯線が1本だけの場合にはこの股裂き
工程は不要である。
In addition, in the above steps, the step of making the slit 4 in step a may be performed after the cutting step in e. Of course, if there is only one core wire, this splitting step is not necessary.

第2図は第1図に示すa〜fの工程を連続的に
処理するための電線端末処理機械の一例を示し、
無限キヤタピラ10上に順次に載置した電線を、
順次に工程部Aにおいて股裂きをし、次に工程部
Bにおいて第1図bのような僅かな皮むきを行
い、次いで工程部Cにおいて滴下ノズル11から
芯線2a,2bの端末部にフラツクスを滴下した
後に、工程部Dにおいて予備半田6を付着し、更
に工程部Eにおいて半田6の付着した芯線2a,
2bの端末部を切断し、次いで工程部Fにおいて
必要な長さの皮むきを行うようにしたものであ
る。なお図中において、12は半田槽、13はコ
ントロールパネルを示している。
FIG. 2 shows an example of a wire end processing machine for continuously processing steps a to f shown in FIG.
The electric wires placed one after another on the infinite caterpillar 10,
Sequentially, splitting is performed in process section A, then slight peeling is performed in process section B as shown in FIG. After dropping, preliminary solder 6 is attached in process section D, and core wire 2a, to which solder 6 is attached, is further attached in process section E.
The terminal portion of 2b is cut off, and then, in process section F, the skin is peeled to the required length. In the figure, 12 indicates a solder bath, and 13 indicates a control panel.

[発明の効果] 以上説明したように本発明に係る電線の端末処
理方法は、絶縁被覆の端末部を芯線がほぐれない
程度に短く剥離し、露出した芯線の端末部を予備
半田で固めた上で必要な長さの皮むきを行うよう
にしたため芯線がほぐれることがなく、従来のよ
うなほぐれた芯線の端末部を撚り合わせる工程を
省略することができる。また、芯線の端末はほぐ
れない状態で半田により固化された後に、半田の
付着している部分の途中を切断するために、芯線
の直径をそのまま細く維持することができ、次工
程における配線作業に極めて有利である。
[Effects of the Invention] As explained above, the method for treating the ends of electric wires according to the present invention involves peeling off the end portion of the insulation coating short enough to prevent the core wire from coming undone, solidifying the exposed end portion of the core wire with preliminary solder, and then Since the core wire is peeled to the required length, the core wire does not come undone, and the conventional step of twisting together the ends of the unraveled core wire can be omitted. In addition, since the end of the core wire is hardened with solder without unraveling and is then cut in the middle of the part where the solder is attached, the diameter of the core wire can be maintained as thin as it is, making it easier for wiring work in the next process. Extremely advantageous.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明に係る電線の端末処理方法の一実
施例を示すものであり、第1図a〜fは端末処理
方法の各工程における電線の状態の説明図、第2
図は本発明方法を実施する電線端末処理機の正面
図である。 1は電線、2a,2bは芯線、3,3aは絶縁
被覆、4は切り込み、5はフラツクス、6は予備
半田である。
The drawings show an embodiment of the method for treating the ends of electric wires according to the present invention, and FIGS.
The figure is a front view of a wire end treatment machine that implements the method of the present invention. 1 is an electric wire, 2a and 2b are core wires, 3 and 3a are insulation coatings, 4 is a notch, 5 is a flux, and 6 is a preliminary solder.

Claims (1)

【特許請求の範囲】 1 電線の端末部の絶縁被覆を芯線がほぐれない
程度の長さだけ剥離する第1の工程と、該第1の
工程により露出された前記芯線の端末部を半田槽
に浸漬して芯線に半田を付着する第2の工程と、
必要な長さだけ更に前記絶縁被覆を剥離すると共
に、前記芯線の半田の付着している部分の先端を
切断する第3の工程とを有することを特徴とする
電線の端末処理方法。 2 前記第1の工程の前に、複数の前記芯線の絶
縁被覆間の股裂きを行う工程を設けた特許請求の
範囲第1項に記載の電線の端末処理方法。 3 前記第3の工程の後に、複数の前記芯線の絶
縁被覆間の股裂きを行う工程を設けた特許請求の
範囲第1項に記載の電線の端末処理方法。
[Scope of Claims] 1. A first step of peeling off the insulation coating at the end of the electric wire by a length that does not loosen the core wire, and placing the end portion of the core wire exposed in the first step in a solder bath. a second step of applying solder to the core wire by dipping;
A method for processing an end of an electric wire, comprising a third step of further peeling off the insulating coating to a required length and cutting off the tip of the portion of the core wire to which solder is attached. 2. The electric wire end treatment method according to claim 1, further comprising a step of splitting the insulation coatings of the plurality of core wires before the first step. 3. The electric wire terminal treatment method according to claim 1, further comprising a step of splitting the insulation coatings of the plurality of core wires after the third step.
JP60284597A 1985-12-18 1985-12-18 Wire termination Granted JPS62144516A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60284597A JPS62144516A (en) 1985-12-18 1985-12-18 Wire termination

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60284597A JPS62144516A (en) 1985-12-18 1985-12-18 Wire termination

Publications (2)

Publication Number Publication Date
JPS62144516A JPS62144516A (en) 1987-06-27
JPH0261211B2 true JPH0261211B2 (en) 1990-12-19

Family

ID=17680515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60284597A Granted JPS62144516A (en) 1985-12-18 1985-12-18 Wire termination

Country Status (1)

Country Link
JP (1) JPS62144516A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01102813A (en) * 1987-10-15 1989-04-20 Niigata Eng Co Ltd Method and device for termination of wire bundle

Also Published As

Publication number Publication date
JPS62144516A (en) 1987-06-27

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