JPH0260277U - - Google Patents
Info
- Publication number
- JPH0260277U JPH0260277U JP13973288U JP13973288U JPH0260277U JP H0260277 U JPH0260277 U JP H0260277U JP 13973288 U JP13973288 U JP 13973288U JP 13973288 U JP13973288 U JP 13973288U JP H0260277 U JPH0260277 U JP H0260277U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- lead
- board
- hole
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000013058 crude material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13973288U JPH0260277U (sk) | 1988-10-26 | 1988-10-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13973288U JPH0260277U (sk) | 1988-10-26 | 1988-10-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0260277U true JPH0260277U (sk) | 1990-05-02 |
Family
ID=31403266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13973288U Pending JPH0260277U (sk) | 1988-10-26 | 1988-10-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0260277U (sk) |
-
1988
- 1988-10-26 JP JP13973288U patent/JPH0260277U/ja active Pending