JPH0260240U - - Google Patents
Info
- Publication number
- JPH0260240U JPH0260240U JP1988139620U JP13962088U JPH0260240U JP H0260240 U JPH0260240 U JP H0260240U JP 1988139620 U JP1988139620 U JP 1988139620U JP 13962088 U JP13962088 U JP 13962088U JP H0260240 U JPH0260240 U JP H0260240U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor device
- coating film
- softer
- packaged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/50—
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- H10W72/522—
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- H10W72/551—
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- H10W72/5524—
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- H10W72/5525—
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- H10W72/555—
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- H10W74/00—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988139620U JPH0260240U (esLanguage) | 1988-10-26 | 1988-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988139620U JPH0260240U (esLanguage) | 1988-10-26 | 1988-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260240U true JPH0260240U (esLanguage) | 1990-05-02 |
Family
ID=31403044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988139620U Pending JPH0260240U (esLanguage) | 1988-10-26 | 1988-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260240U (esLanguage) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014082368A (ja) * | 2012-10-17 | 2014-05-08 | Nippon Micrometal Corp | ボンディングワイヤ |
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1988
- 1988-10-26 JP JP1988139620U patent/JPH0260240U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014082368A (ja) * | 2012-10-17 | 2014-05-08 | Nippon Micrometal Corp | ボンディングワイヤ |