JPH0258893B2 - - Google Patents
Info
- Publication number
- JPH0258893B2 JPH0258893B2 JP58100489A JP10048983A JPH0258893B2 JP H0258893 B2 JPH0258893 B2 JP H0258893B2 JP 58100489 A JP58100489 A JP 58100489A JP 10048983 A JP10048983 A JP 10048983A JP H0258893 B2 JPH0258893 B2 JP H0258893B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- rotary body
- fertilizer
- protruding piece
- discharge port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000843 powder Substances 0.000 claims description 22
- 239000008187 granular material Substances 0.000 claims description 19
- 238000003860 storage Methods 0.000 claims description 5
- 239000003337 fertilizer Substances 0.000 description 20
- 210000000078 claw Anatomy 0.000 description 3
- 230000004720 fertilization Effects 0.000 description 3
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000009331 sowing Methods 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Fertilizing (AREA)
- Sowing (AREA)
- Transplanting Machines (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58100489A JPS59224604A (ja) | 1983-06-06 | 1983-06-06 | 農用粉粒体繰出装置 |
| KR1019830004902A KR850000183A (ko) | 1983-06-06 | 1983-10-17 | 농업용 분입체 도출장치 |
| KR2019880007213U KR880002822Y1 (ko) | 1983-06-06 | 1988-05-14 | 농업용 분입체 도출장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58100489A JPS59224604A (ja) | 1983-06-06 | 1983-06-06 | 農用粉粒体繰出装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59224604A JPS59224604A (ja) | 1984-12-17 |
| JPH0258893B2 true JPH0258893B2 (fr) | 1990-12-11 |
Family
ID=14275341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58100489A Granted JPS59224604A (ja) | 1983-06-06 | 1983-06-06 | 農用粉粒体繰出装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS59224604A (fr) |
| KR (1) | KR850000183A (fr) |
-
1983
- 1983-06-06 JP JP58100489A patent/JPS59224604A/ja active Granted
- 1983-10-17 KR KR1019830004902A patent/KR850000183A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR850000183A (ko) | 1985-02-26 |
| JPS59224604A (ja) | 1984-12-17 |
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