JPH0258399U - - Google Patents
Info
- Publication number
- JPH0258399U JPH0258399U JP13802788U JP13802788U JPH0258399U JP H0258399 U JPH0258399 U JP H0258399U JP 13802788 U JP13802788 U JP 13802788U JP 13802788 U JP13802788 U JP 13802788U JP H0258399 U JPH0258399 U JP H0258399U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- shield
- frame plate
- plate
- edges
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 239000005357 flat glass Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の実施例の構成図で、ａは一部
破断斜視図、ｂは要部断面図、第２図は電子機器
の斜視図、第３図は従来例の構成図で、ａはシー
ルド透明板の斜視図、ｂは窓部の側断面図である
。
図において、１は筐体、２は窓、３，３０はシ
ールド透明板、４は枠板、４―１，４―２は枠板
部材、１０は透明基板、１１は金属メツシユ、１
１Ａは素線端末、２０は正面板、４０はスリツト
、４０Ａはテーパ形底面、４１は導電性ゴム、４
２は導電性接着剤をそれぞれ示す。
Fig. 1 is a block diagram of an embodiment of the present invention, a is a partially cutaway perspective view, b is a sectional view of the main part, Fig. 2 is a perspective view of an electronic device, and Fig. 3 is a block diagram of a conventional example. A is a perspective view of the shield transparent plate, and b is a side sectional view of the window portion. In the figure, 1 is a housing, 2 is a window, 3 and 30 are shield transparent plates, 4 is a frame plate, 4-1 and 4-2 are frame plate members, 10 is a transparent substrate, 11 is a metal mesh, 1
1A is a wire end, 20 is a front plate, 40 is a slit, 40A is a tapered bottom surface, 41 is a conductive rubber, 4
2 represents a conductive adhesive.
Claims (1)
着して成るシールド透明板を、窓硝子として用い
る電子機器において、 先端部に該金属メツシユ１１の素線端末１１Ａ
が裸出し並列する如くに、４辺の端面をテーパ形
エツジ３１に形成した該シールド透明板３０と、 それぞれの内側端面に、該テーパ形エツジ３１
が嵌入するスリツト４０を有する４枚の金属板よ
りなる枠板部材４―１，４―２を、枠形に組合わ
せて構成した枠板４とを備え、 該テーパ形エツジ３１が導電性ゴム４１を介し
て、対応する該スリツト４０の底面に密着して、
該シールド透明板３０が該枠板４に組み込まれ、
該枠板４が筐体の窓枠に密着・取着されたことを
特徴とする電子機器のシールド型窓構造。[Scope of Claim for Utility Model Registration] In an electronic device that uses a shield transparent plate formed by spreading a metal mesh 11 on the intermediate layer of a transparent substrate 10 as a window glass, a wire terminal 11A of the metal mesh 11 is provided at the tip end.
The shield transparent plate 30 has tapered edges 31 on its four sides so that the edges are exposed and parallel to each other, and the tapered edges 31 are formed on each inner end surface.
The frame plate 4 is constructed by combining frame plate members 4-1 and 4-2 made of four metal plates into a frame shape, each having a slit 40 into which the tapered edge 31 is made of conductive rubber. 41, in close contact with the bottom surface of the corresponding slit 40,
The shield transparent plate 30 is incorporated into the frame plate 4,
A shield type window structure for an electronic device, characterized in that the frame plate 4 is closely attached and attached to a window frame of a housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13802788U JPH0258399U (en) | 1988-10-21 | 1988-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13802788U JPH0258399U (en) | 1988-10-21 | 1988-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258399U true JPH0258399U (en) | 1990-04-26 |
Family
ID=31399988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13802788U Pending JPH0258399U (en) | 1988-10-21 | 1988-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258399U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2018186041A1 (en) * | 2017-04-04 | 2020-02-13 | パナソニックＩｐマネジメント株式会社 | Electronics |
-
1988
- 1988-10-21 JP JP13802788U patent/JPH0258399U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2018186041A1 (en) * | 2017-04-04 | 2020-02-13 | パナソニックＩｐマネジメント株式会社 | Electronics |
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