JPH0258333U - - Google Patents
Info
- Publication number
- JPH0258333U JPH0258333U JP13661288U JP13661288U JPH0258333U JP H0258333 U JPH0258333 U JP H0258333U JP 13661288 U JP13661288 U JP 13661288U JP 13661288 U JP13661288 U JP 13661288U JP H0258333 U JPH0258333 U JP H0258333U
- Authority
- JP
- Japan
- Prior art keywords
- land
- circuit board
- sub
- type
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13661288U JPH0258333U (en, 2012) | 1988-10-19 | 1988-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13661288U JPH0258333U (en, 2012) | 1988-10-19 | 1988-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258333U true JPH0258333U (en, 2012) | 1990-04-26 |
Family
ID=31397283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13661288U Pending JPH0258333U (en, 2012) | 1988-10-19 | 1988-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258333U (en, 2012) |
-
1988
- 1988-10-19 JP JP13661288U patent/JPH0258333U/ja active Pending