JPH0257002B2 - - Google Patents
Info
- Publication number
- JPH0257002B2 JPH0257002B2 JP18413883A JP18413883A JPH0257002B2 JP H0257002 B2 JPH0257002 B2 JP H0257002B2 JP 18413883 A JP18413883 A JP 18413883A JP 18413883 A JP18413883 A JP 18413883A JP H0257002 B2 JPH0257002 B2 JP H0257002B2
- Authority
- JP
- Japan
- Prior art keywords
- master
- group
- mold release
- mold
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 40
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- 230000003287 optical effect Effects 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 33
- 238000011282 treatment Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 23
- 150000001412 amines Chemical class 0.000 claims description 19
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 5
- 125000001183 hydrocarbyl group Chemical class 0.000 claims 2
- 239000006082 mold release agent Substances 0.000 description 30
- 239000000243 solution Substances 0.000 description 17
- 238000000465 moulding Methods 0.000 description 16
- 238000000576 coating method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 13
- -1 perfluoro group Chemical group 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical compound FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000007864 aqueous solution Substances 0.000 description 7
- 150000002430 hydrocarbons Chemical class 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000004506 ultrasonic cleaning Methods 0.000 description 6
- 229910020175 SiOH Inorganic materials 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000004203 carnauba wax Substances 0.000 description 3
- 235000013869 carnauba wax Nutrition 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 150000003141 primary amines Chemical class 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 150000003335 secondary amines Chemical class 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000001845 vibrational spectrum Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 239000011260 aqueous acid Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000003301 hydrolyzing effect Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001240 Maraging steel Inorganic materials 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910003849 O-Si Inorganic materials 0.000 description 1
- 229910003872 OâSi Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- BAPZCSMFCUVUHW-UHFFFAOYSA-N dichloro(fluoro)methane Chemical compound F[C](Cl)Cl BAPZCSMFCUVUHW-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- DKAGJZJALZXOOV-UHFFFAOYSA-N hydrate;hydrochloride Chemical compound O.Cl DKAGJZJALZXOOV-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012184 mineral wax Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000011328 necessary treatment Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
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The present invention relates to a method of manufacturing an optical component. Conventionally, many optical components such as lenses, mirrors, and filters have been made of glass. This is because there are many types of glass, and in addition to being able to form optical parts having optical properties that meet requirements, flat or spherical optical surfaces can be formed with high precision by polishing. However, polishing takes a long time and
Another disadvantage is that the processing cost is high. Moreover, especially when forming an aspherical optical element, there is a drawback that the processing cost becomes higher. Another method for manufacturing optical components that overcomes these drawbacks is to manufacture so-called plastic lenses by injecting a transparent resin into a mold and molding it. This method does not require polishing, and if appropriate molding conditions are selected, mass production is possible at low cost. However, it is not easy to make optical components with high optical precision, and they are inferior to glass materials in terms of physical and chemical properties, especially in terms of thermal expansion coefficient and thermal refractive index. The disadvantage is that the change is large, and internal distortion and sink marks are likely to occur during processing. As a method of compensating for the drawbacks of both glass materials and resin materials, there is a method of manufacturing optical components using a combination of both materials. In this method, a master having an optical surface of an optical component to be formed and a glass substrate are placed close to each other, and a resin is sandwiched or injected into the gap between the two and solidified. By forming a resin layer having an optical surface therebetween, and then separating the master and the glass substrate, an optical component consisting of the glass substrate and the resin layer is formed. in this way,
In many cases, it is necessary to polish the glass substrate to a certain degree of precision, but since the resin layer allows the optical precision to be achieved as an optical component, the polishing process of the glass itself can be largely omitted. Since the layer is a thin film, it is less affected by thermal expansion and changes in the refractive index due to heat, and the occurrence of distortion and sink marks can be kept to a minimum. Optical parts with an aspherical surface such as an aspherical lens can also be easily formed in the same way as in the case of a spherical surface by making the shape of the master aspherical. The biggest problem with this method using a master is that after forming a resin layer between the master and the glass substrate, when separating the master and the glass substrate, the resin layer and the master damage the optical surface of the resin layer. The problem is that it is not easy to separate. Therefore, in order to deal with this problem,
There is a method of mixing into the resin material a substance that prevents adhesion to the master and facilitates mold release, such as silicone oil and various waxes. These substances often have no or low compatibility with the resin material, and ooze out onto the surface of the molded resin layer to exert a mold release effect. Therefore, the mechanical properties, transparency,
Often causes deterioration of surface properties, etc. Further, secondary processing such as adhering other optical components to the surface of the molded resin layer is not preferable because it reduces the adhesive properties of the adhesive. On the other hand, another commonly used method is to coat the surface of the master as a release layer without mixing the mold release agent into the resin material to prevent adhesion between the resin material and the master. As such a release layer, silicone oil,
Silicone grease, silicone varnish, carnauba wax, mineral wax, fluororesin powder or coating film, water-soluble resin, glycerin, various oils and fats, stearate, etc. are used. However, with these mold release agents,
A sufficient mold release effect could not be expected.
In particular, in conventional mold release agents, liquid monomers or oligomers such as acrylic resins and epoxy resins are often used as molding materials in precision molding of optical components such as lenses and mirrors. When such a liquid material is injected, especially in the case of a material with particularly good adhesive properties such as an epoxy resin, adhesion to the master is likely to occur. In addition, in the case of optical components, the molding precision of the surface of the resin layer is an issue, so it is desirable that the mold release layer be as thin as possible, but it may not be possible to make it thin with conventional mold release agents, or if it is made thin, it will partially release the mold. There was a problem with the layers peeling off. As one method for avoiding such difficulties, a method is conventionally known in which a vapor-deposited film of metal such as gold, silver, or copper is used as a release layer. To do this, first, these metals are formed as an extremely thin film on the master surface using methods such as sputtering or vacuum evaporation. A desired resin material is poured onto this by casting, for example, and the mold is released. At this time, the metal vapor deposition layer for mold release adheres to the surface of the molded product and is removed from the mold. Therefore, as the next step, it is necessary to remove the metal film of the mold release layer that adheres to the surface of the molded product.
Mechanical means such as chemically dissolving with alkali, etc., or peeling off using adhesive tape, etc. are used. As a result, the surface of the molded product is affected by the chemicals, causing problems such as roughness and scratches, as well as the need for a step to remove the mold release layer. Accordingly, the present invention provides a method for manufacturing an optical component having a surface with high optical precision by using a mold release layer that has good mold release properties, excellent sustainability of mold release action, and is formed thinly. The main purpose is to The present invention involves forming a resin layer on the surface of the glass substrate by interposing a resin in the gap formed between the master having a release layer on the surface and the glass substrate, and then separating the master and separating the glass substrate and the resin. In a method for manufacturing an optical component consisting of layers, after applying a compound having a fluorine-substituted hydrocarbon group and an alkoxysilane group or a halogenated silane group to the master surface, at least the compound chemically bonded to the master surface is coated on the master surface. It is characterized by being a release layer formed by leaving the rest uniformly on the entire surface and removing the rest. Typical embodiments of the method for manufacturing an optical component according to the present invention are shown in FIGS. 1 to 5. FIG. 1 shows a member on which a master 2 is fixed on a substrate 1 made of glass, metal, or the like. The surface of the master 2 has the optical surface precision to be molded, and is made of glass, metal, or the like. A release layer 3 is formed on this master 2 as shown in FIG. This release layer is formed of a compound having a fluorine-substituted hydrocarbon group and an alkoxysilane group or a halogenated silane group. On the other hand, as shown in FIG. 3, a glass substrate 4 is fixedly mounted on a support member 5, and a small amount of resin 6 is dropped onto the glass substrate 4. Next, as shown in FIG. 4, by stacking the master 2 on top of the glass substrate 4, the gap between the master 2 and the glass substrate 4 is filled with resin and solidified to form a resin layer 8. The desired gap between the master and the glass substrate is determined by spacer 7.
ensured by Next, by separating the master 2 from the glass substrate, an optical component consisting of the resin layer 8 and the glass substrate 4 having an optical surface as shown in FIG. 5 can be formed. When the master surface is flat, spherical, and aspheric, filters, spherical lenses, and aspheric lenses, or mirrors, spherical mirrors,
Optical parts such as aspherical mirrors can be molded. In the case of a mirror, it can be formed by forming a resin layer and then depositing a metal such as Al or Ag on it. Typical mold release agents used in the present invention have a fluorine-substituted hydrocarbon group and an alkoxysilane group (1) or a halogenated silane group (2) represented by the following general formula. -Si(ORã)nRã(3-n) -(1) -SiXmRã(3-m) -(2) Here, Rã and Rã are alkyl groups (e.g.
methyl group, ethyl group, propyl group, butyl group, etc.), n and m are 1, 2 or 3, and R is an alkyl group (e.g. methyl group, ethyl group, propyl group, butyl group, etc.) or an alkoxy group (e.g. ,
(methoxy group, ethoxy group, butoxy group, etc.). X is a halogen atom (e.g. Cl, Br, I)
It is. Furthermore, if two or more Rã, Rã, Rã or X are bonded to Si, within the range of the above groups or atoms, for example, two Rã are an alkyl group and an alkoxy group. They can be different. As a fluorine-substituted hydrocarbon group, especially CF 3 (CF 2 ) at one end of the molecular structure.
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è¡šé¢ã®åå°åã§ã¿ããããIt may have a branched structure as shown in [Formula]. In this case, a' is preferably 4 or more. As described above, the mold releasability in the present invention is exerted by this perfluoro group. One end of the mold release agent used in the present invention that does not have a perfluoro group has at least one alkoxysilane group or halogenated silane group. The alkoxysilane group -SiORã and the halogenated silane group -SiX react with moisture to form -SiOH,
This is further bonded by dehydration condensation or hydrogen bonding with the -OH group present on the surface of the mold material such as glass or metal. In other words, the mold release agent used in the present invention chemically bonds to the surface of the molding master at one end, and the perfluoro group is oriented at the other end to cover the master surface, resulting in a thin, durable, and uniform molding agent. A release layer can be formed. The perfluoro group and the silicon atom of the alkoxysilane group or halogenated silane group may be directly bonded, or as a structural unit, -( CH2 )l-, -O
-( CH2 )l-O-, -NH-( CH2 )l-NH-,
-( CH2 )-O-( CH2 )l-, -( CH2 )l-NH
-( CH2 )l-, -CONH-( CH2 )l-, -COO
They may be bonded via a structure such as (CH 2 )l-. These structures should be as short as possible.
is preferably 3 or less. Specific examples of compounds include the following. (1) CF 3 â (CF 2 ) 7 â (CH 2 ) 3 âNHâ (CH 2 ) 3 âSi
(OCH 3 ) 3 (2) CF 3 â(CF 2 ) 7 âOâ(CH 2 ) 3 âOâSi
(OCH 3 ) 3 (3) CF 3 â (CF 2 ) 7 âNHâ (CH 2 ) 3 âNHâSi
(OCH 3 ) 3 (4) CF 3 â(CF 2 ) 7 â(CH 2 ) 3 âOâ(CH 2 ) 3 âSi
(OCH 3 ) 3 (5) CF 3 â (CF 2 ) 6 âCONHâ (CH 2 ) 3 âSi
(OC 2 H 5 ) 3 (6) CF 3 â (CF 2 ) 7 â (CH 2 ) 3 âSi(OCH 3 ) 3 (7) CF 3 â (CF 2 ) 6 âCOOâ (CH 2 ) 3 âSi(OCH 3 ) 3 (8) CF 3 â(CF 2 ) 7 â(CH 2 ) 3 âNHâ(CH 2 ) 3 â
SiCl 3 (9) CF 3 â(CF 2 ) 7 âOâ(CH 2 ) 3 âOâSiCl 3 The above-mentioned fluorine mold release agent is usually solid, but in order to apply it to the master surface, it needs to be dissolved in an organic solvent. Although it varies depending on the molecular structure of the mold release agent, in most cases, a fluorinated hydrocarbon solvent or a mixture thereof with some organic solvent is suitable. For example, CCl 2 Fâ
CCl2F , CCl2F - CClF2 , or a mixture thereof with a compatible organic solvent such as methanol, ethanol, acetone, or trichlorethylene can be used. The concentration of the solvent is not particularly limited, but since the required release film is particularly thin, a low concentration is sufficient;
Weight % is sufficient. To apply this solution to the surface of the master, conventional coating methods such as dip coating, spray coating, brush coating, etc. can be used. It is particularly undesirable for optical parts to have dust and dirt attached to them, so it is necessary to remove dust from the coating solution, coating atmosphere, mold itself, etc. After coating, the solvent is usually air-dried to evaporate to form a dry coating.The thickness of the coated film at this time is not particularly specified, but it is ultimately 1Ό or less after the thinning process described below. It is preferable to The release layer is treated to bond the release agent to the master surface so as to form a strong bond with the master surface. Examples of treatments for this include treatment with amines or acids. For example, a master coated with a release agent is heat-treated in a treatment solution containing an amine. The amine used here may be any of primary amines, secondary amines, and tertiary amines, but primary amines and secondary amines are particularly effective. Specifically, for example, primary amines such as ethylamine, propylamine, butylamine, amylamine, and hexylamine, and diethylamine and the like are examples of secondary amines. All of these amines are water-soluble amines, soluble in water up to at least 20% by weight. These amines diffuse into the mold release layer from the treatment solution, react with the alkoxysilane or halogenated silane groups of the mold release agent, and cause -
Since its purpose is to promote dehydration condensation with OH, it is suitable that the molecular structure is as simple as possible, has a small molecular weight, and can easily diffuse into the mold release agent layer. The concentration of these amines is 15% by weight
Desirably, the amount is about 0.5 to 3% by weight. Another effect of this treatment liquid is the -
Since the purpose of this process is to hydrolyze Si-OR or SiX to -SiOH, it is necessary that this treatment liquid contains water. Therefore, an aqueous solution of amine is used as the treatment liquid. The treatment in this treatment solution is 0.5 at a temperature of 60-95â.
It is preferable to carry out the treatment under conditions of about 3 hours. A high temperature is better in terms of promoting the reaction, but 95
If the temperature exceeds .degree. C., the water will boil and bubbles will be generated violently, attacking the master surface and mechanically causing the release agent layer to fall off, so as mentioned above, the appropriate temperature is 60 to 95.degree. In a preferred embodiment of the present invention, an aqueous solution of an amine compound is applied to the surface of the master in advance, and after drying, a release agent having at least a perfluoro group and an alkoxysilane group or a halogenated silane group as described above is applied. A mold release film can also be formed by applying a molding agent. The amine is applied to the surface of the master in advance during the mold release process, and at this time, it forms a hydrogen bond or simply adsorbs with the -OH group present on the surface of the glass or metal used as the master material. and bond to the master surface. Next, a mold release agent is applied on top of this, and when the hot water treatment described below is performed, the terminal -SiORã or -
SiX is hydrolyzed to âSiOH, and â
These amines exhibit a catalytic effect when dehydration condensation occurs with OH. Therefore, since the presence of water is essential, it is appropriate to use the amine used in advance as an aqueous solution. However, the mold release agent used next is not compatible with water, so if the surface of the master is wet with liquid water or amine after this amine treatment, it must be separated from the solution when applying the mold release agent. The molding agent precipitates and a uniform coating cannot be obtained. Therefore, it is necessary to dry the master after applying the amine solution. However, it is pointless to completely eliminate amines from the mold surface, so drying should be done in the air or at a temperature of about 60 to 70°C for a short period of time. Then pre-apply the amine like this,
The process of applying the above-mentioned mold release agent onto the dried master is used. After the release agent has been applied to the master, it is then treated in hot water. In this treatment, water is diffused onto the master surface through the mold release agent layer, hydrolyzing the alkoxysilane groups or halogenated silane groups in the mold release agent mentioned above together with the pre-applied amine, and hydrolyzing the -OH of the master surface. This is a necessary treatment to promote the chemical reaction that bonds with the group. Therefore, a higher temperature is preferable for the purpose of promoting the reaction, but care must be taken because if the water boils, the mold release layer will be destroyed by bubbles and pinholes will occur. Therefore, a preferable treatment temperature is 60 to 95°C, and a preferable treatment time is about 0.5 to 3 hours to obtain good results. In another preferred embodiment of the present invention, a mold release treatment agent having at least a perfluoro group and an alkoxysilane group or a halogenated silane group is applied onto the master, and then the mold is released by immersion in an aqueous acid solution. layers can be formed. The mold after application of the mold release agent is heat-treated, especially in an aqueous acid solution. As the acid used here, inorganic acids such as hydrochloric acid, nitric acid, sulfuric acid, and phosphoric acid, and organic acids such as formic acid, acetic acid, oxalic acid, and toluenesulfonic acid can be used. These acids diffuse through the mold release agent coating from the treatment solution, reach the interface with the master surface, react with the alkoxysilane groups or halogenated silane groups of the mold release agent, and hydrolyze them to form -SiOH. It also acts as a catalyst to cause condensation with the -OH groups present on the master surface. At this time, the presence of water is necessary to convert -SiORã or -SiX to -SiOH, so these acids are used as an aqueous solution, the concentration of which is 5% by weight or less, and the pH of the treatment liquid is It is desirable that the concentration be 3.0 or lower. The processing conditions in this processing solution are 60 to 90°C for about 0.5 to 50 hours. A high temperature is preferable for the purpose of promoting the reaction, but if the temperature exceeds 95°C, boiling will occur and the mold release agent may fall off due to bubbles, which is not preferable. The mold release layer thus formed is subjected to a thinning process. This thin film treatment is performed by the above-mentioned amine or acid treatment to leave at least the mold release agent that is in close contact with the master surface through chemical bonds uniformly on the master surface and remove other mold release agents. To do something. The removal method may be selected as appropriate, such as rubbing the release layer or dissolving the surface of the release layer with a solvent, but in particular, ultrasonic cleaning by placing it in a fluorinated hydrocarbon solvent or the like may be used. It is preferable to dissolve the excess mold release agent with a step or to cure the resin once on the surface of the mold release layer and then separate it, leaving only the thin mold release layer bonded to the master surface without being removed. . In some cases, a layer may be added after this to promote bonding with the master surface and create an even stronger release layer.
Heat treatment may be performed at a temperature of 100 to 150°C for 1 to 2 hours. Examples of the resin for forming the resin layer include acrylic monomers or oligomers such as methyl methacrylate, styrene or mixtures of comonomers for the purpose of copolymerization mainly based on styrene, or oligomers thereof, epoxy resins, unsaturated polyester resins, etc. Materials such as prepolymers can be used. Example 1 A master member whose surface has been polished to an aspherical surface is adhered to a circular substrate of BK-7 glass having a diameter of approximately 50 mm and a thickness of approximately 10 mm. Add this to the fluorine-based mold release agent FS-116 (manufactured by Daikin Industries, Ltd.).
(trade name) is immersed in a solution diluted approximately 3 times with Daiflon S-3 (trade name, Daikin Industries, Ltd.), FS-116 is evenly applied to the surface, and air-dried. Next, this master is immersed in an aqueous solution of about 1% by weight n-propylamine and treated at 90°C for about 1 hour. Next, it is immersed in Daiflon S-3 (manufactured by Daikin Industries, Ltd., trade name) and subjected to ultrasonic cleaning for about 3 minutes. Before ultrasonic cleaning, the FS-116 coating showed a blue-purple interference color, but after cleaning, the FS-116 coating showed a blue-purple interference color.
The interference color of the â116 coating became invisible, making it completely indistinguishable from the untreated surface. In this way, a mold release layer 3 as shown in FIG. 2 was formed. Next, as shown in FIG.
A glass substrate 4 made of SF-4 is placed, and a spacer 7 is placed between the master placed thereon and the glass substrate 4 so as to create a gap of about 0.3 mm at the maximum part and about 0.1 mm at the minimum part. Next, a small amount of transparent epoxy resin Epotec 301-2 (manufactured by Epoxy Technology Co., Ltd., trade name) was placed in the concave part of the glass substrate.
Insert the master from above as shown in FIG. This is placed in a constant temperature bath and heated to harden at 80°C for 3 hours, then slowly cooled and then taken out. Next, when the master is pulled out from the support member 5, the glass substrate is attached to the surface of the master via the hardened epoxy resin, and the master is taken out. When a razor blade is applied along the surface of the master and a slight impact is applied, the glass substrate can be easily released from the master along with the hardened resin layer, and the fifth
A lens consisting of a glass substrate and a resin layer as shown in the figure was molded. The surface of this lens has the same aspherical surface as the highly accurate master,
It was of high quality as an optical member. Figure 6 shows the infrared absorption spectrum of FS-116. As is clear from this chart, FS-116 is
It can be seen that this is a compound having CF 3 -(CF 2 )n groups and 3 Si(OCH 3 ) groups. In the figure, 11 shows the vibration spectrum of C-F, 12 shows the vibration spectrum of SiOCH 3 , and 13 shows the vibration spectrum of SiO. Example 2 Special silane LP-8T for liquid crystal alignment (manufactured by Shin-Etsu Chemical Co., Ltd., trade name) having a chemical structure of n - C8F17CH2CH2Si ( OCH3 ) 3 was blown with Daiflon S - 3. When a solution with a concentration of 2% by weight was used in place of FS-116 in Example 1 and the same experiment as in Example 1 was conducted, the master and molded lens were easily separated as in Example 1. It was possible to mold a lens with a highly accurate aspherical resin surface. Furthermore, when the above molding was repeated without performing mold release treatment, it was possible to release the mold up to four times. Example 3 Using YSS maraging steel YAG (manufactured by Hitachi Metals Co., Ltd., trade name) as a metal material for all molds, the master member shown in FIG. 1 was made into one piece by grinding. The surface of this master was given an aspherical polished finish. This master is the same as the LP-8T mentioned above.
of about 2% by weight of Daiflon S-3 solution, and then dipping this in an aqueous n-amylamine solution at 90% by weight.
Heat treatment was performed at â for 1 hour. Next, this was subjected to ultrasonic cleaning in Daiflon S-3 for about 5 minutes to form a release layer, and the surface of the master was finished cleanly and appeared as if nothing had been attached to it. Using this, mold a lens in the same manner as in Example 1,
When the mold was released using a razor blade, it was extremely easy to release the mold, and an aspherical lens with high precision could be produced. When molding was carried out using this mold material without performing mold release treatment again, the mold could be released up to four times and a lens with sufficient accuracy as an optical member could be molded. Example 4 FS-116 (manufactured by Daikin Industries, Ltd., product name)
A glass master on which a release layer had been formed by dip coating in the same manner as in Example 1 was immersed in about 3% HCl water and heat-treated at 90°C for about 1 hour. When this is ultrasonically cleaned in Daiflon S-3, FS-116
Most of the coating was removed by dissolution, leaving the surface with a finish that looked exactly like the untreated surface. When a molding experiment was conducted using this master in the same manner as in Example 1,
The lens having the aspherical resin layer could be released from the mold very easily, and its surface precision was extremely good. Furthermore, when molding was continued without additional mold release treatment, sufficient mold release was possible up to 4 times. Example 5 Fluorine-based organosiloxane compound
The master used in Example 1 was coated using a Daiflon S-3 solution containing about 2% by weight of C 7 F 15 CONHCH 2 CH 2 CH 2 Si(OCH 3 ) 3 to form a release layer. Next, it was immersed in an aqueous solution containing 1% by weight of n-butylamine and heat-treated at 90°C for 1 hour. Thereafter, this was placed in Daiflon S-3 and subjected to ultrasonic cleaning for about 3 minutes to wash off the above-mentioned compound adhering to the master surface, and the appearance was exactly the same as when nothing had adhered. When a lens similar to that in Example 1 was molded using this master, the lens could be released from the mold very easily. This mold release effect remained effective up to four times of molding. Example 6 Fluorine-based organosiloxane compound
C 7 F 15 COOCH 2 CH 2 CH 2 Si (OCH 3 ) Approximately 2% by weight of 3
A release layer was formed by coating the master used in Example 1 using Daiflon S-3 solution. Next, this was immersed in an aqueous solution containing 1% by weight of n-butylamine and heat-treated at 90°C for 1 hour. Thereafter, this was placed in Daiflon S-3 and subjected to ultrasonic cleaning for about 5 minutes to wash off the compound adhering to the master surface, and the appearance was exactly the same as when nothing had adhered. When a lens similar to that in Example 1 was molded using this master, the lens could be released from the mold very easily. Furthermore, when molding was carried out without additional mold release treatment, it was possible to perform molding up to four times. Comparative Example 1 A silicone paste mold release agent KS-61 (manufactured by Shin-Etsu Chemical Co., Ltd., trade name) was applied to the surface of the master used in Example 1 using a nonwoven fabric. At this time, the master was heated to about 60°C to soften the mold release agent and wiped to make the master surface as smooth as possible. Using this master, lenses were molded by the process shown in Example 1. After the resin had hardened, an attempt was made to release the mold using a razor blade, but although some peeling occurred, the lens could not be removed. Comparative Example 2 Silicone varnish mold release agent KS-700 (manufactured by Shin-Etsu Chemical Co., Ltd.,
(trade name) diluted approximately 10 times with n-hexane was applied. This was wiped clean using a non-woven cloth so as not to impair the precision of the optically curved surface, then baked at 270°C for 1 hour and then slowly cooled. Next, when a lens molding experiment similar to that in Example 1 was carried out using this master, the lens had insufficient mold releasability and cracks appeared in the glass substrate of the striking part of the razor blade. Comparative Example 3 The master used in Example 1 is heated to about 80°C, and carnauba wax (melting point about 65°C) is rubbed onto the surface of the master and applied while melting. Next, use a non-woven cloth to wipe off any excess carnauba wax that has adhered and melted, and wipe the surface to a smooth treated surface, then return it to room temperature. Lenses were molded using this master in the same manner as in Example 1, but the mold release was insufficient and some of the lenses were broken. On the resin surface of the lens in the part where the mold was released, minute irregularities due to uneven wiping of the mold release agent were seen in the reflected image of the surface.
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FIG. 1 is a sectional view of a master used in the present invention. FIG. 2 is a sectional view of a master with a release layer formed on its surface. FIG. 3 is a sectional view of a glass substrate placed on a support member to form an optical component. FIG. 4 is a cross-sectional view of the glass substrate and master stacked together. FIG. 5 is a cross-sectional view of the formed optical component. FIG. 6 is a graph showing the infrared absorption spectrum characteristics of the mold release agent used in Examples. 1...Substrate, 2...Master, 3...Release layer,
4...Glass substrate, 5...Supporting member, 6...Resin, 7...Spacer, 8...Resin layer.
Claims (1)
ãšã®éã«åœ¢æãããééã«æš¹èãä»åšãããããš
ã«ããã¬ã©ã¹åºæ¿è¡šé¢ã«æš¹èå±€ã圢æããåŸãã
ã¹ã¿ãŒãåé¢ããŠã¬ã©ã¹åºæ¿ãšæš¹èå±€ãããªãå
åŠéšåã補é ããæ¹æ³ã«ãããŠããã¹ã¿ãŒè¡šé¢ã«
ããçŽ çœ®æçåæ°ŽçŽ åºãšã¢ã«ã³ãã·ã·ã©ã³åºè¥ã
ãã¯ããã²ã³åã·ã©ã³åºãšãæããååç©ãå¡åž
åŸãå°ããªããšããã¹ã¿ãŒè¡šé¢ã«ååŠçµåããåœ
該ååç©ããã¹ã¿ãŒè¡šé¢å šäœã«åäžã«æ®ããŠä»ã
é€å»ããããšã«ãã圢æããé¢åå±€ã§ããããšã
ç¹åŸŽãšããå åŠéšåã®è£œé æ¹æ³ã ïŒ é¢åå±€ã圢æããååç©ã®ãã¹ã¿ãŒè¡šé¢ãžã®
ååŠçµåãã¢ãã³åã¯é žã®åŠçã§åœ¢æããç¹èš±è«
æ±ã®ç¯å²ç¬¬ïŒé èšèŒã®å åŠéšåã®è£œé æ¹æ³ã[Claims] 1. After forming a resin layer on the surface of the glass substrate by interposing a resin in the gap formed between the master having a release layer on the surface and the glass substrate, the master is separated and the glass substrate is removed. In a method for manufacturing an optical component consisting of a substrate and a resin layer, after applying a compound having a fluorine-substituted hydrocarbon group and an alkoxysilane group or a halogenated silane group to the master surface, at least the compound having a fluorine-substituted hydrocarbon group and an alkoxysilane group or a halogenated silane group is applied. A method for manufacturing an optical component, characterized in that the release layer is formed by leaving a compound uniformly on the entire master surface and removing the other. 2. The method for manufacturing an optical component according to claim 1, wherein the chemical bond of the compound forming the release layer to the master surface is formed by treatment with an amine or acid.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18413883A JPS6073817A (en) | 1983-09-30 | 1983-09-30 | Manufacture of optical parts |
US06/653,727 US4566930A (en) | 1983-09-30 | 1984-09-24 | Process for producing optical members |
GB08424543A GB2148783B (en) | 1983-09-30 | 1984-09-28 | Process for producing optical members |
DE19843436004 DE3436004A1 (en) | 1983-09-30 | 1984-10-01 | METHOD FOR PRODUCING OPTICAL COMPONENTS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18413883A JPS6073817A (en) | 1983-09-30 | 1983-09-30 | Manufacture of optical parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6073817A JPS6073817A (en) | 1985-04-26 |
JPH0257002B2 true JPH0257002B2 (en) | 1990-12-03 |
Family
ID=16148031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18413883A Granted JPS6073817A (en) | 1983-09-30 | 1983-09-30 | Manufacture of optical parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6073817A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1535712B1 (en) * | 2003-11-28 | 2009-01-14 | Xenocs S.A. | Method for producing a replication master, and replication master |
-
1983
- 1983-09-30 JP JP18413883A patent/JPS6073817A/en active Granted
Also Published As
Publication number | Publication date |
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JPS6073817A (en) | 1985-04-26 |
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