JPH0256185B2 - - Google Patents
Info
- Publication number
- JPH0256185B2 JPH0256185B2 JP17372587A JP17372587A JPH0256185B2 JP H0256185 B2 JPH0256185 B2 JP H0256185B2 JP 17372587 A JP17372587 A JP 17372587A JP 17372587 A JP17372587 A JP 17372587A JP H0256185 B2 JPH0256185 B2 JP H0256185B2
- Authority
- JP
- Japan
- Prior art keywords
- support member
- lower support
- carrier
- support members
- legs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 210000005069 ears Anatomy 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17372587A JPS6418566A (en) | 1987-07-10 | 1987-07-10 | Device for holding electrical or electronic part during soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17372587A JPS6418566A (en) | 1987-07-10 | 1987-07-10 | Device for holding electrical or electronic part during soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6418566A JPS6418566A (en) | 1989-01-23 |
| JPH0256185B2 true JPH0256185B2 (OSRAM) | 1990-11-29 |
Family
ID=15965985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17372587A Granted JPS6418566A (en) | 1987-07-10 | 1987-07-10 | Device for holding electrical or electronic part during soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418566A (OSRAM) |
-
1987
- 1987-07-10 JP JP17372587A patent/JPS6418566A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6418566A (en) | 1989-01-23 |
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