JPH0256172B2 - - Google Patents

Description

[Detailed Description of the Invention] [Table of Contents] Overview Industrial Field of Application Conventional Technology Problems to be Solved by the Invention Means for Solving the Problems Working Examples (1) IC automatic cutting and forming device (No. Figures 22 to 25) (2) IC cutting press (Figures 1 to 21) (a) IC sheet and IC cutting process (Figures 20 and 21) (b) Lower mold (Figures 2 to 21) (Figure 5) (c) Upper die (Figures 7 to 1) (d) IC sheet feeding mechanism *Sheet guide assembly (Figures 2 to 6) *Feeding rod assembly (Figures 11 to 6) Figure 17) *Ejector (Figure 11, Figure 18, Figure 1)
Figure 9) (e) Effects of the invention of IC cutting process [Summary] This is an IC cutting press that sequentially feeds an IC sheet and performs a series of press cutting processes using a plurality of press dies each performing a different process to separate the ICs individually. The plurality of press dies and IC sheet feeding mechanisms are individually and removably assembled to a common die set to form a single press die unit, and the press die unit is collectively attached to the IC cutting press body. By making it removable, the press mold unit can be warped and replaced when processing different types of IC sheets, which reduces the spacing between press molds and
This eliminates various adjustment work such as adjusting the IC sheet feed pitch, improves the operating efficiency of the cutting press, and improves its versatility. By replacing them, they can be easily modified to process different types of ICs, reducing press mold production costs.

[Industrial application field]

The present invention relates to an IC (integrated circuit) manufacturing device, particularly a device for manufacturing an IC (integrated circuit) in which multiple ICs are interconnected with a lead frame.
The present invention relates to an IC sheet processing device, and more specifically relates to a press type of an IC cutting press that separates ICs from an IC sheet.

A typical IC sheet processing process is an IC cutting and forming process (so-called progressive process) in which the ICs are individually separated from the IC sheet and then the lead terminals are bent. An IC cutting press is used to cut ICs from IC sheets in such progressive processing.

[Conventional technology]

When using an IC cutting press, due to the structure of the IC sheet,
It is difficult to cut an IC in one press process, and requires multiple press processes. For this reason, IC cutting presses are generally configured to have a series of multiple types of press dies (cutting dies) arranged in sequence along the IC sheet feeding path, and perform a series of press processing while sequentially feeding the IC sheets. .

[Problem that the invention seeks to solve]

In conventional IC cutting presses, the press dies for each stage of press processing are independent dies, and are individually positioned and attached to the press table. The IC sheet feeding mechanism is also an independent mechanism from the press die, and is positioned and attached to the frame of the press separately from the cutting die.

Furthermore, as is well known, there are many different types of ICs, and therefore, there are also many different types of IC sheets. When converting an IC cutting press to process different types of IC sheets,
Various adjustment work is required, such as changing the press die, changing the arrangement interval of the press die, and changing the feed pitch of the IC sheet.

However, in conventional IC cutting presses, each press die and IC sheet feeding mechanism are constructed independently of each other, so the adjustment work described above is extremely complicated and requires a great deal of effort and time even for skilled workers.
Therefore, the IC cutting press is forced to stop operating for a long time, resulting in a decrease in operating efficiency and productivity. For this reason, even if the IC cutting press is a general-purpose type, in reality, it has to be used exclusively for processing a type of IC sheet, and it is essentially not versatile.

On the other hand, as a type of press die, there is a so-called progressive press, in which multiple types of dies, punches, and a mechanism for progressively feeding the material to be pressed are assembled into a single die set so that a series of press operations can be performed continuously while feeding the material to be pressed in sequence. Dies (progressive feed type, multistage feed type) are well known. Progressive molds have the advantage of not requiring complicated adjustment work because the molds are warped and replaced when processing different types of workpieces. However, on the other hand, the die, punch, and material feeding mechanism are structured so that they cannot be attached or detached or modified individually, so even if it is only necessary to replace or modify a part of them, it is necessary to create a new mold. It is necessary to create and create. Therefore, in IC cutting presses for processing IC sheets, which come in a wide variety of types, it is disadvantageous in terms of die manufacturing costs to employ such a progressive die.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an IC cutting press using a press die that has the advantages of a progressive type and is advantageous in terms of manufacturing cost.

[Means for solving problems]

In order to solve the above problems, the present invention provides a plurality of
IC with IC interconnected by lead frame
In an IC cutting press, a sheet is fed sequentially and a series of press cutting processes are performed using multiple press dies each performing a different process to separate the ICs individually.
A plurality of press dies for performing the series of press cutting processes and IC sheet feeding mechanisms for sequentially feeding the IC sheet are individually and removably assembled to a common die set to form a single press die unit, and the press die unit is assembled into a single press die unit. The present invention provides an IC cutting press characterized in that the IC cutting press is configured such that it can be attached to and detached from the IC cutting press body all at once.

[Effect]

The above press type unit has an IC sheet feeding mechanism.
IC is processed using multiple press dies while sequentially feeding the IC sheet.
The sheet is then subjected to a series of press cuts to cut the individual ICs from the lead frame.

When processing different types of IC sheets, it is possible to make a press mold unit and replace it with another press mold unit, and since there is no need to individually position each press mold and IC sheet feeding mechanism, the replacement work can be done easily and in a short time. . In this case, if the fixed part of the press die unit to the press table and the part connected to the press ram have a common structure between different types of units, the replacement work can be standardized and can be easily performed even by unskilled workers. can. As a result,
By shortening the downtime of the IC cutting press, it is possible to minimize the decline in operating efficiency and achieve high productivity. As a result, it is also easy to convert the IC sheet cutting press to one for processing different types of IC sheets, and high versatility can be achieved.

On the other hand, in the press mold unit according to the present invention, each press mold and the IC sheet feeding mechanism are individually and removably assembled to the die set, and only a part of them can be replaced. Therefore, it is possible to prepare multiple types of die sets, press dies, and IC sheet feeding mechanisms, and selectively combine them to assemble various press die units. It is advantageous in terms of mold manufacturing costs because there is no need to make a mold.

〔Example〕

EMBODIMENT OF THE INVENTION Hereinafter, a cutting press of an IC automatic cutting and forming apparatus (progress apparatus) will be explained as an example of the present invention.

(1) IC automatic cutting and forming device (Figures 22 to 25) First, a brief explanation of the progressive device.As shown in Figures 22 to 25, it basically consists of an IC sheet loader A, cutting Press B,
It consists of a bending press C and an IC unloader D, and it can handle multiple ICs as shown in Figure 20.
are interconnected by lead frame F.
Place the IC sheet S in the magazine M (Fig. 23, 25)
) and stored in large numbers in the magazine stock section A1 of the IC sheet loader A. and IC sheet supply head A of IC sheet loader A.
At step 2, the IC sheets are taken out one by one from the magazine M and fed to the cutting press B, where the ICs are individually cut, and the lead terminals L (Fig. 20) of each IC are bent and formed using the bending press C. I C
It is configured to be discharged to an unloader D and stored there.

In FIGS. 23 and 24, the symbol E indicates a dust collector for suctioning and collecting the punching scum or cut layer produced during IC cutting in the cutting press B.

(2) Cutting press (Figs. 1 to 21) As shown in Fig. 1, the cutting press B has a frame having a table B3 and a ram housing B4, and the press type unit B1 has a frame having a table B3 and a ram housing B4.
and is driven by a press ram B2 (FIG. 24) mounted within a ram housing B4.

The press mold unit B1 basically has a lower mold 1 and
It consists of an upper mold 2 and an IC sheet feeding mechanism 3, and a series of press working is performed with the lower mold 1 and the upper mold 2 while the IC sheet S (Fig. 20) is sequentially fed by the IC sheet feeding mechanism 3. From IC sheet S
Cut the ICs in order. Hereinafter, the structure and operation of each part of the press mold unit B1 will be explained in detail in separate sections.

(a) IC sheet and IC cutting process (Figures 20 and 21) The IC sheet S shown in Figure 20 is a resin mold dual inline package (DIP) type.
A plurality of ICs are interconnected by a lead frame F. Lead frame F has lead terminal L, Yokogi F1, dam bar F2,
A tie bar F3 is integrally formed. The dam bar F2 prevents resin leaking from the mold during resin molding of the IC from flowing to the tip of the lead terminal. In addition, the tie bar F3 directly connects the IC package to the lead frame F, and is connected to a series of
It serves to hold the IC on the lead frame F until the final step of the IC cutting process.
The lead frame F also has a large number of holes of different shapes and sizes used for feeding and detecting the position of the IC sheet, which will be described later.

To cut the ICs from the IC sheet S, as shown in FIG. 21, the IC sheet S is sequentially fed along the IC sheet feeding path T at a pitch equal to the IC arrangement pitch p (FIG. 20), and a series of pressing steps are carried out. That is, this is done by performing the following processes: resin cutting, dam bar cutting, lead cutting, tie bar pinch formation, and punching.

In the resin punching process, resin leaked into the air space surrounded by the lead terminal L and the dam bar F2 during resin molding (shown in black in FIGS. 20 and 21) is punched out.

Dam bar cut cuts out dam bar F2.

In the lead cut, the frame side frame F1 is cut out to separate the lead terminal L from the lead frame F. In addition, in the case of an IC sheet in which there is no frame horizontal arm F1 and the lead terminals L of adjacent ICs are directly connected to each other, the process is simply to separate the lead terminals from each other. Moreover, in the case of such an IC sheet, the lead terminals L at the start and end ends of the IC sheet are already separated from the frame F, so there is no need to perform lead cutting; It is better not to do this as it may cause burrs.

Forming a tie bar pinch is to form a pinch (squeezing) in the tie bar F3 that connects the IC to the frame F. However, this processing is not essential and can be omitted.

The final punching is to remove the IC connected to the frame F by the tie bar F3 from the frame F by punching. In this case, if the tie bar pinch formation is performed in the first stage, the tie bar F3 is easily cut with a small punching force, and it is possible to prevent burrs from forming on the tie bar F3 and damage to the resin mold.

The positions where each of the above press processes are performed are 1.5p or 2p (p is the IC arrangement pitch or the IC sheet feeding pitch) as shown in Figure 21.
The interval is as follows.

(b) Lower die (Figs. 2 to 6) As shown in Figs. 2 to 5, the lower die 1 is assembled into a single common die holder 10 through the above-mentioned series of press processes (i.e., resin removal, dam bar cutting, Each press die DE1 performs lead cutting, tie bar pinch formation, punching)
~DE5 are assembled in a removable manner.

Since the three dies DE1 to DE3 in the previous stage have almost the same mounting structure, taking the resin removing die DE1 in the first stage as an example, the die DE1 is particularly mounted on the die plate 11 as shown in FIG. The die plate 11 is positioned by a key groove 12 on the bottom surface, a guide key 13 (FIG. 3) of the die holder 10, a tapered metal fitting 14 and a fastening metal fitting 15 on one end of the die plate 11, and the opposite end is fixed with a bolt 16. is tightened and fixed to the die holder 10. As is clear from FIG. 2, the fastening fitting 15 is common to each die plate of the three dies DE1 to DE3. In addition, as shown in FIGS. 2 to 5, the die plate 11 has a guide bush 1 with a pair of dust seals.
7 is provided, into which a pilot pin 47 (FIGS. 8 and 10) of the upper mold 2, which will be described later, is fitted. On the other hand, the two latter dies DE4 and DE
5 are attached to a common die plate 18 as shown in FIGS. 2 and 3. The die plate 18 has a key groove 19 and a guide key 20 as in the case of the die plate 11 described above.
(FIG. 3), the tapered metal fitting 21 and the tightening metal fitting 22 (FIGS. 2, 4, and 5) are used to position the die holder 10, and then fixed to the die holder 10 with bolts. The die plate 18 also has a pair of dust seal guide bushes 2 at both ends.
3 (Fig. 2), and an upper mold 2 to be described later.
The pilot pin 58 (FIGS. 8 and 9) is fitted. Furthermore, as shown in FIG. 2 and FIG.
The air cylinder 24 and guide rail 25 for feeding the IC cut from the IC sheet in PH5) to the aforementioned bending press C (Figures 22 to 25) are arranged and assembled at right angles to the IC sheet feeding path T. It will be done. In addition, in this way, the tie bar pinch forming die DE4 and the punching die
The reason why the DE 5 and the DE 5 are assembled to the common die plate 18 is to enable them to be attached and detached at the same time since they are always used in pairs.

The above dies DE1 to DE5 are IC sheet feeding path T
They are arranged at predetermined intervals along the line, that is, at intervals of 1.5p or 2p as shown in FIG.

Next, as shown in FIG. 2, the die holder 10 is provided with four guide posts 30, which are fitted into guide bushes 59 (FIG. 7) of the upper mold 2, which will be described later, so that the upper mold 2
is assembled to the lower die 1 so as to be vertically movable. As shown in FIG. 5, the lower end of the guide post 30 is fitted into a hole in the die plate 10, and the guide post 30 includes a flange 31, a retainer plate 32, and a bolt 3.
Fixed by 3. Furthermore, stopper pins 35 are provided near the three guide posts 30. This abuts against a stopper pin 60 (FIGS. 8 and 9) of the upper mold 2, which will be described later, to define the bottom dead center of the upper mold 2. Further, another stopper pin 36 is provided near each guide post 30. This abuts against a spring-loaded stopper pin 61 (FIGS. 8 and 9) of the upper die 2, which will be described later.

In addition, on one end side of the die holder 10 (on the left side in Figure 2), there is a die cut with a punching die DE5.
Vacuum pressure to adsorb IC and the aforementioned IC
An air joint block 37 is provided to supply air pressure to the delivery air cylinder 24. Furthermore, the die holder 10 is equipped with a large number of optical sensors and the like for position detection during IC sheet feeding, but a detailed explanation of these will be omitted.

2 to 5 show the sheet guide assembly 3A of the IC sheet feeding mechanism 3 (FIG. 1) assembled to the die holder 10, and the sheet guide assembly 3A will be described later.

The lower mold 1 above is table B3 of cutting press B.
It is removably attached to the In other words, Figure 2,
As shown in FIGS. 3 and 5, the die holder 10
A keyway 38 is formed on the bottom surface of the holder, and a pair of left and right tapered metal fittings 39 are provided on one end side.
On the other hand, as shown in FIG. 1, a guide key B3a and a fastening fitting B3b are fixedly installed on the table B3 of the cutting press B at right angles to each other.
Guide key B to guide key groove 38 of die holder 10
3a, and tighten the tapered metal fitting 39 with the tightening metal fitting B3.
The lower mold 1 is positioned by engaging the bolts 10a and 10b, respectively, and a bolt (not shown) is inserted into the tap hole B3 of the table B3 from the bolt hole 10a of the die holder 10 (upper left corner in FIG. 2).
It is fixed by tightening it to c. still,
The structure for fixing the lower mold 1 to the press table B3 described above is a common structure and is compatible even if the types of press mold units B1 are different.

In addition, in Fig. 1, the holes B3d formed in the press table B3 are the dies DE1 to DE of the lower die 1.
This is a dust collection port formed to correspond to No. 3. As shown in Fig. 24, this dust collection port B3d communicates with the dust collector E through a hose or tube E1, and the punched scum and cutting debris generated in the dies DE1 to DE3 are collected through this dust collection port B3d. .

The press B has a transparent safety cover B5, and when this cover is opened, the operation of the cutting press B as well as the entire progressing device is automatically stopped.

(c) Upper die (Figs. 7 to 10) As shown in Figs. 7 to 10, the upper die 2 is used for each punch of the press die that performs the above-mentioned series of pressing operations on a single common punch holder 40. PH
1 to PH5 are each removably assembled.

The three punches PH1 to PH3 in the previous stage have almost the same mounting structure, so if we take the resin removal punch PH1 in the first stage as an example,
As shown in FIG.
4 and can be removably attached. Further, a sheet press plate (or stripper plate) 45 is attached to the punch plate 41 so as to be movable up and down by a pair of spring-loaded slide pins 46, and a pair of pilot pins 46 are attached to the punch plate 41.
7 is fixed. The pilot pin 47 fits into the guide bush 17 (FIGS. 2 and 5) of the die holder 11 of the dies DE1 to DE1 of the lower die 1 described above. On the other hand, the two latter punches PH4 and PH5 are attached to a punch plate 51 as shown in FIG.
It is removably attached to the holder with a bolt 54 (FIG. 7). Note that the base plate 53 is the eighth
As shown in the figure, this is common to punches PH4 and PH5, and this is the die DE of lower mold 1 mentioned above.
4. This corresponds to the fact that the die plate 18 of DE5 is made common. Further, a sheet presser plate (or stripper plate) 55 is attached to the punch plate 51 by two spring biased slide pins 56 and two guide pins 57 so as to be vertically movable. Further, a pair of pilot pins 58 are fixed to the common base plate 53, and these are fitted into the guide bushes 23 of the lower mold 1 mentioned above.

Further, the punch holder 40 is provided with four guide bushes 59, three stopper pins 60, and four stopper pins 61 with springs. As mentioned above, the guide bush 59
is fitted with the guide post 30 of the lower mold 1, and the stopper pin 60 and the spring-loaded stopper pin 61
are the stopper pins 35 and 3 of the lower mold 1, respectively.
collides with 6.

The punch holder 40 is further provided with a ram connector 62 on its upper surface, which engages with a flange B2a (FIGS. 8 and 10) at the tip of the piston rod of the press ram B2 (FIG. 24) of the cutting press B. As a result, the upper die 2 is driven up and down by the press ram B2, and the dies DE1 to
IC cutting is performed using DE5 and punches PH1 to PH5.

Furthermore, an L-shaped push-down lever 63 is fixed to one end of the die holder 40. This lever 63 uses the downward movement of the upper mold 2 to
Sheet feed lever 120 of the sheet feed mechanism
(See especially FIG. 13) is pressed down, and this will be described later.

Incidentally, a large number of optical sensors and the like for position detection during IC sheet feeding are also installed in the upper die 2, but a detailed explanation thereof will be omitted.

(d) IC sheet feeding mechanism As shown in FIG. 1, the IC sheet feeding mechanism 3 basically consists of a sheet guide assembly 3A (shown assembled to the lower die 1) and It consists of a feed rod assembly 3B that sequentially feeds ICs along a feed rod assembly that sequentially feeds IC sheets, and an ejector 3C that discharges sheet waste after cutting the ICs.

*Sheet guide assembly (Figs. 2 to 6) The sheet guide assembly 3A consists of a pair of sheets arranged on both sides of the IC sheet feeding path T (Fig. 2) as shown in Figs. 2 to 6. Each sheet guide 70 has a guide rail 70, and each sheet guide 70 is composed of a support rail 71 with a rectangular cross section and a cover plate 72 screwed to the top surface of the support rail 71. The edge is configured to be fed into a guide groove between the support rail 71 and the cover plate 72 in an engaged state. On the other hand, one end of the support rail 71 of the guide rail 70 protrudes from the lower die holder 10, and the support rail 71 of the guide rail 70 protrudes from the lower die holder 10.
Supplied by sheet supply head A1
It constitutes a sheet supply section on which the IC sheet is placed. That is, as shown in FIGS. 2, 3, and 6, a guide block 73 is attached to the protruding end of the support rail 71.
The IC sheet S is pushed between these guide blocks 73 from above and is placed on the support rail 71 at the side edge of the lead frame. The guide lock 73 is also provided with two sheet pressing plates 74 made of spring plates on each side (only one on each side is shown). This sheet holding plate 74 normally protrudes inward, and when the IC sheet S is pushed in from above, it is pushed outward to allow the pushing, and after being pushed in, it projects inward again to prevent the IC sheet S from popping out. Acts as a deterrent. Note that the IC sheet S is warped (curved) during its manufacturing process, and the sheet pressing plate 74 also has the function of suppressing the warping of the IC sheet and holding it flat. Further, the warping of the IC sheet is suppressed by the guide grooves of the guide rail 70 even during the subsequent sequential feeding, thus making it possible to perform a good press cutting process.

As shown in FIGS. 2 and 3, the guide rails 70 are vertically movably mounted on the lower die holder 10 by lifters 80 at positions near each end. The lifter 80 has a body 81 that is fixed to the die holder 10, as shown in the right part of FIG.
1, a lift pin 82 is mounted on a linear ball bearing 83 so as to be vertically movable. The upper end of the lift pin 82 is inserted into a hole in the support rail 71 of the guide rail 70, and the lower end is inserted into a hole in the die holder 10, and the lift pin 82 constantly pushes the guide rail 70 upward by the action of the compression coil spring 84. ing. On the other hand, a stopper plate 85 is fixed to the upper surface of the lifter body 81, and the guide rail 7
A claw 86 fixed to the lower surface of the stopper plate 85 engages with the lower surface of the stopper plate 85 to define the upper limit lift position (top dead center) of the guide rail 70.
As a result, the guide rail 70
is held at a position higher than the upper surface of the dies DE1 to DE5 in the non-pressing state when the upper die 2 is in the upper position, and is pushed down by the upper die 2 to the level of the dies DE1 to DE5 during the pressing stroke in which the upper die 2 descends. IC cutting processing will be performed. This lifting operation of the guide rail 70 is related to the IC sheet feeding operation by the feeding rod assembly 3B, which will be described later.

Although it is not clearly shown in the diagram, the guide rail 7
0 support rail 71 and cover plate 72
A large number of sensor light transmission holes are formed for optical sensors for detecting the position of the IC sheet, and in particular, the cover plate 72 has a feed pin 96 of the feed rod assembly 3B.
A number of elongated holes are formed to enable the IC sheet (FIG. 11) to engage with the feed holes of the IC sheet.

*Feeding rod assembly (FIGS. 11 to 17) The feeding rod assembly 3B has a feeding rod 90 extending parallel to the guide rail 70 (shown by imaginary lines), as shown in FIG. 11. This feed rod 90 has a feed arm 91 projecting from it at right angles.
~95 are installed. One or two downwardly protruding feed pins 96 are provided on the lower surface of these feed arms, and these feed pins 96 are connected to the lead frame F of the IC sheet S.
The sheet is fed by fitting into the hole (see Fig. 20).

The feed rod 90 is fixed at both ends to one end of a double-arm lever 101 and a single-arm lever 102, respectively, and these levers 101,
102 is supported on a support shaft 103 so as to be able to swing relative thereto, but not to move in the axial direction thereof. In other words, the feed rod 90, the levers 101, 102, and the support shaft 103 are basically rectangular frames in which the feed rod 90 and the support shaft 103 are swingable around the support shaft 103. (hereinafter referred to as the "feeding rod frame").

The feed rod frame has a pair of bearings 104 and 10.
5 to the lower die holder 10. These bearings 104 and 105 are the 12th bearings.
As shown in the drawings and FIG. 14, the lower part is fixed to the die holder 10, and the upper linear ball bearing 106 supports the support shaft 103 of the feed rod frame so as to be able to reciprocate in the axial direction. Also,
A drive rod 107 (see especially FIG. 15) is attached to the support shaft 103 at a position near the one-arm lever 102 and is rotatable by a pair of flanged bearings 108, but cannot be moved in the axial direction of the support shaft 103. Possibly installed. A direct mount type air cylinder 110 is attached to the bearing 105 of the support shaft 103 (see especially FIG. 14), and its piston rod is connected to the drive rod 1 via a floating joint 111.
It is connected to one end of 07. Therefore, when the air cylinder 110 is operated, the feed rod frame moves into the IC sheet feed path T as shown in FIG.
It is driven back and forth in the directions of arrows T ₁ and T ₂ along the arrows T 1 and T 2 . Note that the bearing 105 also has a stopper plate 10.
9 (FIGS. 11 and 15) is fixed, and when the drive rod 107 abuts against this, the movement stroke p of the feed rod frame body (right side in FIG. 12) is defined. This movement stroke p corresponds to the feed pitch of the IC sheet, as will be described later.

Furthermore, as shown in FIG. 16 in particular, a tension coil spring 113 is stretched between the horizontal arm of the double-armed lever 101 of the feed rod frame and a bracket 112 fixed to the lower die holder 10, so that the feed rod A rotational force in the direction of arrow R ₁ (FIG. 16) about the support shaft 103 of the frame is always applied to the frame. On the other hand, a roller 11 is attached to the lower end of the vertical arm of the double-arm lever 101.
4 is rotatably provided, and when this roller 114 comes into contact with the front surface of a horizontally extending stopper rail 115 (see FIGS. 11 and 12) fixed to the bearing 104 of the support shaft 103, the arrow R of the feed rod frame body is moved. Rotation in _one direction is restricted to hold it in a horizontal normal position at approximately the same height as the guide rail 70. When the feed rod frame reciprocates in the directions of arrows T ₁ and T ₂ , the roller 114 rolls while in contact with the rail 115 .

As shown in FIG. 17, an insulating bushing 116 made of an electrical insulator is embedded in the stopper rail 115, and a screw-shaped contact terminal 117 made of a conductive material is attached to the stopper rail 115.
It is screwed through to the roller contact surface. Further, a touch limit TL is fixed to the back surface of the bearing 104, and its terminal TLa is connected to a contact terminal 117 with a lead wire (not shown). On the other hand, the roller 114 is made of a conductive material, and the lever 101 and the support shaft 10
3. Tatsu limit TL via bearing 104
and is in electrical continuity. Therefore, when the roller 114 is in contact with the contact terminal 117, an electrical closed circuit is formed, and the roller 11
4 is in contact with the rail 115, that is, it is detected that the feed rod frame body is held in a horizontal normal position. However, as will be described later, if the feed pin 96 of the feed rod 90 is not properly inserted into the feed hole of the IC sheet when feeding the IC sheet and the feed rod frame is lifted in the direction of arrow _R2 , the double-arm lever 101 Due to the rotation, the roller 114 separates from the rail 115, that is, the contact terminal 117, and the electric circuit is opened, and it is detected that the feed pin 96 and the feed hole of the IC sheet are not properly fitted. ing.

Next, as shown in FIGS. 11 and 12, the support shaft 103 of the feed rod frame is connected to the single arm lever 10.
2, and a sheet feed lever 120 is attached to the protruding portion of the lever 120 so that it can be rotated freely by a pair of flanged bearings 121 (see especially FIG. 11), but cannot be moved in the axial direction of the support shaft 103. Impossibly attached. As shown in FIGS. 11 and 13, the lever 12
A bracket 122 is fixed near the tip of the IC sheet in line with the IC sheet feeding path T.
Two sheet feeding plates 123 are provided in parallel on the upper surface thereof. This sheet feeding plate 123
is in frictional contact with the lower surface of the IC resin mold of the IC sheet S (FIG. 11) placed on the sheet supply section of the guide rail 70, and as described later, the lever 1
20 acts to feed the IC sheet S when it is driven in the direction of arrow _T1 together with the feed rod frame.

In particular, as shown in FIG.
A tension coil spring 1 is installed between the bracket 124 fixed at the base end of the die holder 10 and the lower die holder 10.
25 is stretched, thereby applying an upward rotational force to the lever 120 in the direction of arrow _R3 .
On the other hand, as shown in FIGS. 11 and 13, there is a bracket 1 fixed at the center of the lever 120.
A roller 127 is rotatably provided at 26,
This contacts the lower surface of the guide rail 70 and defines the upper limit position (top dead center) of the lever 120. Further, a roller 128 is rotatably provided at the bent end portion of the lever 120.
This roller 128 is provided corresponding to the push-down lever 63 of the upper die 2 described above, and when the roller 128 is pushed down by the push-down lever 63 during the lowering stroke of the upper die 2, the lever 128 is pushed down.
20 can be rotated in _{the four} directions of arrow R. In addition, the rollers 127, 128
When the sheet feed lever 120 is driven together with the feed rod frame in the directions of arrows T ₁ and T ₂ , the sheet feed lever 120 contacts and rolls against the drive rod 63 and the guide rail 70, respectively.

Next, the operation of the IC sheet feeding mechanism 3 will be explained. First, the feed rod frame body of the feed rod assembly 3B and the sheet feed lever 120 are normally in a position where they are driven in the direction of arrow _T2 by the air cylinder 110 (see FIGS. 11 and 12).
The figure shows the position driven in the direction of arrow _T1 ). In this state, when the upper die 2 is in its upper position (non-pressing position), the guide rail 70 of the sheet guide assembly 3A is connected to the lifter 80.
The feed pins 9 of the feed arms 91 to 95 are lifted to an upper position that is almost flat with the feed rod 90.
6 is fitted into a predetermined feed hole of the IC sheet S. Meanwhile, the sheet feeding lever 120 of the feeding rod assembly 3B also rotates to the upper position, and its sheet feeding plate 123 comes into frictional contact with the IC of the IC sheet S of the sheet feeding section of the guide rail 70.
In this state, use the air cylinder 110 to move the feed rod 90.
When the feed lever 120 is driven in the direction of arrow _T1 , the IC sheet S is fed by one pitch p in the same direction. And after sending the IC sheet,
The upper mold 2 is lowered and press working is performed. At this time, the lowering of the upper mold 2 causes the guide rail 7 to
0 is pushed down and IC sheet S is moved to feed rod 9
0, and the sheet feeding lever 120 is also rotated downward.
The IC sheet feed plate 123 separates from the IC. In this state, the air cylinder 110 moves backward, and the feed rod 90 and the feed lever 120 are driven back in the direction of arrow _T2 . After that, the upper die 2 rises and returns to the non-pressing position, and along with this, the guide rail 70 and the feed lever 120 rise,
The feeding pin 96 and the IC sheet feeding hole are fitted, and the IC and the feeding plate 123 are brought into contact, and the next IC sheet feeding is performed. However, in this case, if the feeding pin 96 and the IC sheet feeding hole are not properly fitted due to poor feeding of the IC sheet, etc., the feeding rod 90 may move upward around the support shaft 103 (as shown in FIG. 16), as described above. It is lifted up in the direction of arrow R ₂ ).
When the roller 114 separates from the stopper rail 115, it is detected by the touch limit TL. As a result, the operation of not only the cutting press B but also the entire progressing device is stopped.

*Ejecta (Fig. 11, Fig. 18, Fig. 1)
Figure 9) Ejecta 3C is especially suitable for Figures 18 and 19.
As shown in the figure, an ejector roller 130 and a pair of press rollers 1 are arranged above and below each other.
31. As shown in FIG. 19b, the ejector roller 130 is supported by a cantilever bearing on a bracket 132 fixed to the lower die holder 10, and is driven by a motor 133 with a speed reducer. Although not shown, a one-way clutch is incorporated in the ejector roller 130, and the ejector roller 130 is rotatably driven only in the forward direction, and is freely rotatable in the reverse direction. On the other hand, as shown in FIG. 19a, the pressing roller 130 is rotatably attached to the tips of a pair of swinging arms 135 attached to a support shaft 134 supported by a bracket 132 in a cantilevered manner. and the 18th
As shown in the figure, the pressing roller 131 is pressed against the ejector roller 130 by the elastic force of a pressing spring 136 similarly fixed to the bracket 132. As a result, as shown in FIG. 21, the lead frame (sheet scraps) remaining after IC punching out is held between the ejector roller 130 and the pressing roller 131, and the sheet scrap shooter B6 (FIG. 23,
Figure 5).

(e) IC cutting process IC cutting process using the above IC cutting press B is as follows.

(i) First, the press mold unit B1 is assembled integrally by assembling and adjusting the lower mold 1, upper mold 2, and IC sheet feeding mechanism 3 to suit the IC sheet to be cut. Then, this press mold unit B1 is attached to a press table B2. Incidentally, during this attachment, the upper die 2 is automatically connected to the press ram B2. Then, the preparation is completed by connecting the air line and the vacuum pressure line to the air joint block 37 of the lower mold 1, and connecting the electric wire for the optical sensor to a connector (not shown). Incidentally, initially, the upper die 2 is raised and in a non-pressing position, and the feed rod frames 90, 101, 102, 103 of the feed rod assembly 3B of the sheet feed mechanism 3 and the sheet feed lever 120 are moved in the direction of the arrow T. It is assumed that the feed rod frame body and the sheet feed lever are in a position where they are driven in _two directions (hereinafter, the driving of the feed rod frame body and the sheet feed lever will be simply referred to as "driving of the feed rod assembly 3B").

(ii) First, one IC sheet S is supplied from the IC sheet loader A to the sheet supply position of the guide rail 70 of the IC sheet feeding mechanism 3 by the IC sheet supply head A2. At this time, as described above, the IC sheet S is prevented from flying out by the sheet pressing plate 74, and the warpage is removed.

(iii) When the IC sheet is fed, the air cylinder 110 of the IC sheet feeding mechanism 3 is activated to drive the feeding rod assembly 3B in the direction of arrow _T1 , and the IC sheet S of the sheet feeding section is moved to the feeding lever 120. One pitch is sent in. Next, the upper die 2 is driven downward by the press ram B2, and thereby the guide rail 70
and sheet feed lever 120 are both pushed down. In this state, feed rod assembly 3B
is driven in the direction of arrow _T2 by the air cylinder 110 and returns to the initial position. Thereafter, the upper mold 2 rises, and the guide rail 70 and feed lever 120 return to the upward position. In the illustrated example, the position where the sheet supply part of the guide rail 70 and the feed pin 96 of the feed rod 90 first fit into the feed hole of the IC sheet S is 2p.
Therefore, feeding by the feeding lever 120 is performed twice.

(iv) At the end of the above two feedings,
Pin 9 of the first feed arm 91 of the feed rod 90
6 is now fitted into the sprocket hole of the IC sheet. In this state, the feed rod assembly 3B is
The IC sheet S is driven in the _T1 direction and is sent by the feed rod 90. After the feeding is finished, the upper die 2 descends, and the guide rail 7
0 descends, the IC sheet S separates from the feed pin 96. In this state, the feed rod assembly 3B is driven in the direction of arrow _T2 and returns to the initial position. Then upper mold 2
As the IC sheet S rises, the guide rail 70 rises, and in conjunction with this, the next feed hole of the IC sheet S fits into the feed pin 96, and the next feed is performed. As the IC sheets are sequentially fed, the second and subsequent feeding arms 92~
The feed pin 96 of 95 also performs a feed action in sequence. In addition, in the case of the illustrated example, feed rod 9
The feed start position and resin removal position due to 0 are
2p apart, therefore IC sheet S
The sheet is fed two more times (a total of four times from the sheet supply section) before the leading IC is sent to the resin removal position.

(v) When the first IC reaches the resin removal position,
During the press stroke of the upper mold 2, the leaking resin is punched out by the die DE1 and the punch PH1 as shown in FIG. From then on, each time the IC sheet is sent 2p, 1p, 2p, 2p, dies DE2 to DE5 and punch PH are
Dam bar cutting, lead cutting, tie bar pinch formation, and punching are performed by steps 2 to PH5, and the IC is separated from the lead frame F. The cut off IC is die DE
After being vacuum-adsorbed into the inside of the bending press C, it is pushed out to the guide rail 25 by the air cylinder 24 and supplied to the bending press C.

(vi) In this way, when the IC sheet S is sequentially cut and processed, and the terminal end is sent out from the sheet supply section of the guide rail 70,
The next IC sheet is supplied from IC sheet loader A, and the IC sheet is fed sequentially in the same manner as above.
The cutting process is performed continuously.

(vii) On the other hand, the sheet waste (lead frame F) after all the ICs have been cut is removed immediately after the last IC is cut (that is, the upper die 2 is raised and the feed hole of the lead frame F is aligned with the feed pin 96).
before being fitted into the sheet waste), the ejector 3C quickly discharges the sheet waste to the shunter B6.

In addition, in the above IC cutting process, check the supply of IC sheets to the sheet supply section (that is, the presence or absence of IC sheets), and check the supply of IC sheets along the guide rail.
Detection of IC sheet feeding position, cut IC
Feeding the sheet to a bending press and discharging sheet waste are mostly performed using optical sensors. Although these optical sensors and other various sensors are not clearly shown in the figure, most of them are incorporated into the press type unit B1.
Those that can be provided at a fixed position regardless of the type of IC sheet, that is, the type of press mold unit, are provided on the table B3 of the press B or other parts.

〔Effect of the invention〕

The IC cutting press according to the invention has many advantages, such as:

(b) By configuring multiple types of press dies (dies and punches) that perform a series of press processing for IC cutting and an IC sheet feeding mechanism that sequentially feeds IC sheets as an integrated unit, the press can be used to cut different types of ICs. When converting to processing, the press die unit can be replaced with another unit, eliminating the need for various complicated adjustment operations such as positioning between each press die and changing sheet feed pitches, which can be done in an extremely short time. Easy to implement. In particular, if the fixing part of the press mold unit to the press table or the connecting part to the press ram is made common among different types of units as in the above embodiment, the replacement work of the press mold unit can be standardized and made easy even by less skilled workers. It is possible to implement

(b) Replacing the press mold unit in such a short time makes it possible to shorten press down time, that is, improve operating efficiency, and achieve high productivity.

(c) Achieving this high productivity also makes it easy to convert the cutting press to processing different types of IC sheets.
Therefore, high versatility of the press is ensured.

(d) Furthermore, the press mold unit is equipped with each press mold and
Since the IC sheet feeding mechanism is assembled into the die set so that it can be removed individually,
A desired press type unit can be constructed by preparing the minimum required types of press type IC sheet feeding mechanisms and die sets and combining them appropriately.
Therefore, there is no need to create a complete press mold unit for each different type of IC sheet, which is extremely advantageous in terms of manufacturing costs.

In addition, the lower mold, upper mold and IC of the press mold unit
The detailed configuration of the sheet feeding mechanism is not limited to the illustrated embodiment, and various configurations are possible. However, the particular IC sheet feeding mechanism of the illustrated embodiment has the following advantages.

The feed rod assembly basically only moves back and forth along the IC sheet feeding path, and the guide rail of the sheet guide assembly moves up and down to engage and disengage the IC sheet from the feed pin. In other words
Since the IC sheet feed hole only moves relative to the feed pin in its axial direction, the two can be smoothly engaged and disengaged, and the occurrence of misfitting is extremely rare. Therefore, the accuracy of the fit between the feed hole and the feed pin can be improved, and highly accurate sheet feeding can be achieved.

Since the guide rail and the sheet feeding lever are driven by the lowering movement of the upper die and the spring, no special drive is required for this purpose, and complete synchronization with the press processing can be achieved.

If a misfit between the feed pin and the feed hole occurs, the feed rod frame lifts up and is detected by the tachi limit.

Warpage of the IC sheet is automatically removed, allowing for good IC cutting processing.

Furthermore, although the illustrated embodiment is an example in which an IC cutting press is incorporated into a progressive device, the IC of the present invention
It goes without saying that the cutting press can be used alone.

[Brief explanation of the drawing]

Fig. 1 is an exploded perspective view of essential parts of an embodiment of an IC cutting press according to the present invention, Fig. 2 is a plan view of the lower die with the sheet guide assembly assembled, and Fig. 3 is a partial cross-section of the lower die. 4 is a partially cutaway left side view of the lower mold, 5th is a partially sectional right side view of the lower mold, and 6th is a front view.
The figures are a sectional view taken along the - arrow in FIG. 3, FIG. 7 is a plan view of the upper mold, FIG. 8 is a partially sectional front view of the upper mold, FIG. Figure 10 is a partially sectional right side view of the upper die, Figure 11 is a plan view of the feed rod assembly and ejector of the IC sheet feed mechanism, and Figure 12 is a top view of the feed rod assembly and ejector of the IC sheet feed mechanism.
The figure is a partially sectional front view of the feed rod assembly, FIG. 13 is a right side view of the feed rod assembly, FIG. 14 is a partially sectional side view taken along the - arrow in FIG.
FIG. 16 is a left side view of the feed rod assembly, FIG. 17 is an enlarged sectional side view as viewed from FIG. 12, and FIG. 18 is a front view of the ejector. Fig. 19 is an exploded plan view of the ejector, Fig. 20 is a plan view of an example of an IC sheet,
Fig. 21 is an IC cutting process diagram, Fig. 22 is an external perspective view of the IC automatic cutting and forming device, Fig. 23 is a plan view of the IC automatic cutting and forming device, and Fig. 24 is the partially omitted left side of the IC automatic cutting and forming device. FIG. 25 is a front view of the automatic IC cutting and forming apparatus. Figures 1 to 25
In the figure, B is a cutting press, B1 is a press type unit, and B
2 is a press ram, B3 is a press table, 1 is a lower mold, 2 is an upper mold, 3 is an IC sheet feeding mechanism, 3A
3 is the sheet guide assembly, 3B is the feed rod assembly, 3
C is ejector, 10 is die holder, DE1 to DE
5 is a die, 30 is a guide post, 40 is a punch holder, PH1 to PH5 are punches, 59 is a guide bush, 63 is a push-down lever, 70 is a guide rail, 80 is a lifter, 90 is a feed rod, 96 is a feed pin, 110 is a An air cylinder, 120 a sheet feeding lever, and S an IC sheet.

Claims (1)

[Scope of Claims] 1. An IC sheet (S) in which a plurality of ICs are interconnected by a lead frame is sequentially fed, and a series of press cutting processes are performed using a plurality of press dies each performing a different process to individually cut the ICs. In the IC cutting press for cutting the IC, a plurality of press dies DE1, PH1; DE5, PH5 and the IC for performing the series of press cutting processes are used.
The IC sheet feeding mechanism 3 that sequentially feeds sheets is individually and removably assembled to a common die set 10 and 40 to form a single press type unit B1.
An IC cutting press characterized in that the press type unit B1 is configured to be removable from the main body of the IC cutting press B at once. 2. The press die unit B1 includes a lower die 1 configured by removably attaching each die DE1; DE5 of the press die to a single common die holder 10, and each punch PH1 of the press die. ;
It has an upper mold 2 configured by removably attaching the PH5 to a single common punch holder 40, the lower mold 1 is removably fixed to the press table B3 of the IC cutting press main body, and the upper mold 2 comprises: The IC sheet feeding mechanism 3 is attached to the lower die 1 in a vertically movable and detachable manner, and is detachably connected to the press ram B2 of the IC cutting press body, and the IC sheet feeding mechanism 3 is detachably attached to the lower die 2. According to claim 1, which is characterized in that:
IC sheet cutting press. 3. The method according to claim 2, characterized in that a fixed portion of the lower die 1 to the press table B3 and a connecting portion of the upper die 2 to the press ram B2 are common to different types of press die units.
IC sheet cutting press.