JPH0255224B2 - - Google Patents
Info
- Publication number
- JPH0255224B2 JPH0255224B2 JP60143307A JP14330785A JPH0255224B2 JP H0255224 B2 JPH0255224 B2 JP H0255224B2 JP 60143307 A JP60143307 A JP 60143307A JP 14330785 A JP14330785 A JP 14330785A JP H0255224 B2 JPH0255224 B2 JP H0255224B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thermosetting resin
- transfer
- decorative board
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001187 thermosetting polymer Polymers 0.000 claims description 37
- 238000012546 transfer Methods 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 21
- 239000011231 conductive filler Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 239000011342 resin composition Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000004641 Diallyl-phthalate Substances 0.000 description 4
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000010354 integration Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920004552 POLYLITE® Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、最上層に導電層を有する化粧板の製
造法に関するものである。DETAILED DESCRIPTION OF THE INVENTION "Industrial Application Field" The present invention relates to a method for manufacturing a decorative board having a conductive layer on the top layer.
「従来の技術」
従来から、チタン紙等の紙３１の表面に、印刷
層３２を設け、その後この印刷層を設けた紙にジ
アリルフタレート等の熱硬化性樹脂３３を含浸せ
しめて乾燥し、この熱硬化性樹脂含浸紙３の裏面
側を適宜基材の表面へ重ね合わせ、その後、130
〜140℃、５〜20Kg／cm2、４〜20分の加熱加圧処
理により、各層を積層一体化して化粧板とする方
法が知られている（第３図参照）。"Prior Art" Conventionally, a printed layer 32 is provided on the surface of a paper 31 such as titanium paper, and then the paper provided with this printed layer is impregnated with a thermosetting resin 33 such as diallyl phthalate and dried. The back side of the thermosetting resin-impregnated paper 3 is appropriately overlapped with the surface of the base material, and then 130
A method is known in which each layer is laminated and integrated to form a decorative board by heat-pressing treatment at ~140°C, 5-20 kg/cm 2 , and 4-20 minutes (see Fig. 3).
「発明が解決しようとする問題点」
前述従来法の化粧板における印刷層中に導電性
フイラーを含有させ、これをもつて、導電層を有
する化粧板とする試みは、当然考えられる。"Problems to be Solved by the Invention" It is naturally conceivable to incorporate a conductive filler into the printed layer of the decorative board of the conventional method described above, and use this to create a decorative board having a conductive layer.
しかしながら、従来法の印刷層中に導電性フイ
ラーを含有させ製造される化粧板は、最上層が導
電層とならないため化粧板としての利用時に、導
電層を設けた点を殆んど生かすことができなかつ
た。 However, in the case of decorative laminates manufactured by conventional methods containing conductive fillers in the printed layer, the top layer is not a conductive layer, so when used as a decorative laminate, the advantage of having a conductive layer cannot be fully utilized. I couldn't do it.
本発明者は、上記した問題に鑑み、最上層に導
電層を有する化粧板の製法につき種々研究をおこ
なつた結果、化粧板としての利用を考える場合に
有利な熱硬化性樹脂の使用はそのままにして、し
かも、いたずらに煩雑な作業を要することなく、
最上層に導電層を有する本発明の製法に到達した
ものである。 In view of the above-mentioned problems, the present inventor conducted various studies on the manufacturing method of decorative laminates having a conductive layer on the top layer, and found that the use of thermosetting resin, which is advantageous when considering use as a decorative laminate, is as it is. Moreover, it does not require any unnecessarily complicated work.
The manufacturing method of the present invention having a conductive layer as the uppermost layer has been achieved.
「問題点を解決するための手段」と「作用」
即ち、本発明は、転写用ベースフイルム１面
に、導電性フイラーを含有する熱硬化性樹脂組成
物の塗膜２１を第１層目とする転写層２を形成
し、この転写層２を、基材４上にあらかじめ重ね
合わせた熱硬化性樹脂含浸紙３の上面へ熱圧転写
することにより、転写と同時に基材４と熱硬化性
樹脂含浸紙３との積層一体化をなすことを特徴と
する、最上層に導電層を有する化粧板の製造法を
提供するものである。"Means for Solving the Problems" and "Operation" That is, the present invention provides a coating film 21 of a thermosetting resin composition containing a conductive filler as a first layer on one surface of a base film for transfer. By forming a transfer layer 2 with a heat-pressure transfer layer 2 onto the upper surface of a thermosetting resin-impregnated paper 3 that has been superimposed on the base material 4 in advance, the transfer layer 2 is transferred to the base material 4 and the thermosetting resin at the same time as the transfer. The present invention provides a method for manufacturing a decorative board having a conductive layer as the uppermost layer, characterized in that it is laminated and integrated with resin-impregnated paper 3.
本発明の熱圧転写は、従来の転写が、通常適宜
材料への模様の付与を目的としてなされていたの
とは趣きを異にし、あくまでも、表面の導電性に
優れ、また、他の諸性質においてもすぐれた化粧
板を製造するための手段として利用される。 The heat-pressure transfer of the present invention is different from conventional transfer, which is usually done for the purpose of imparting patterns to materials as appropriate. It is also used as a means to produce superior decorative laminates.
即ち、本発明の熱圧転写は、具体的には、転写
層２と熱硬化性樹脂含浸紙３との積層一体化を、
両層に夫々含まれている熱硬化性樹脂の硬化を通
じてなすと共に、熱硬化性樹脂含浸紙３と基材４
との積層一体化を、熱硬化性樹脂含浸紙３中の熱
硬化性樹脂の硬化を通じてなすものであり、転写
層２の第１層目（転写用ベースフイルム面側）に
導電性フイラーを含有する塗膜２１を配するとい
う構成との結合によつて、表面導伝性の優れた化
粧板の提供を可能にし、また、熱硬化性樹脂の硬
化を通じて各層の積層一体化を達成する構成との
結合によつて、耐溶剤性、耐熱性、機械的強度等
にすぐれた化粧板の提供を可能にするものであ
る。 That is, the heat-pressure transfer of the present invention specifically involves laminating and integrating the transfer layer 2 and the thermosetting resin-impregnated paper 3,
Through curing of the thermosetting resin contained in both layers, the thermosetting resin-impregnated paper 3 and the base material 4
This is achieved by curing the thermosetting resin in the thermosetting resin-impregnated paper 3, and the first layer of the transfer layer 2 (on the side of the base film for transfer) contains a conductive filler. In combination with the structure of disposing the coating film 21, it is possible to provide a decorative board with excellent surface conductivity, and also with a structure that achieves lamination and integration of each layer through curing of the thermosetting resin. By combining these, it is possible to provide a decorative board with excellent solvent resistance, heat resistance, mechanical strength, etc.
ここにおいて、基材４及び熱硬化性樹脂含浸紙
３としては、前述従来例の場合と同様のものを使
用することができる。 Here, as the base material 4 and the thermosetting resin-impregnated paper 3, the same materials as in the conventional example described above can be used.
また導電性フイラーとしては、周知のカーボン
系、グラフアイト系、金属系の粉末、繊維状物
を、単独で又は混合して用いることができる。こ
の導電性フイラーを含有する熱硬化性樹脂として
は、メラミン系、ポリエステル系、ジアリルフタ
レート系等、各種の熱硬化性樹脂を使用すること
ができる。 Further, as the conductive filler, well-known carbon-based, graphite-based, metal-based powders and fibrous materials can be used alone or in combination. As the thermosetting resin containing the conductive filler, various thermosetting resins such as melamine type, polyester type, diallyl phthalate type, etc. can be used.
この様に、本発明の熱圧転写は、模様の付与を
目的としてなされる従来の転写とは趣きを異にす
るが、転写層２の第２層目を印刷層２２となし
（第２図参照）、この印刷層２２の模様を、目的物
である化粧板の模様として生かすことも、本発明
では可能である。 As described above, the thermopressure transfer of the present invention is different from the conventional transfer performed for the purpose of imparting a pattern, but the second layer of the transfer layer 2 is not the printing layer 22 (see Fig. 2). In the present invention, it is also possible to make use of the pattern of the printed layer 22 as a pattern of the desired decorative board.
上記の実施態様が、本発明で可能となるのは、
次の理由による。 The above embodiments are made possible by the present invention.
Due to the following reasons.
即ち、先ず第１に、本発明では、導電性フイラ
ーを含有する熱硬化性樹脂組成物の塗膜２１が、
後に化粧板の最上層に位置して導電層を形成する
ため、前記塗膜２１中の導電性フイラーの含有率
をそれ程高く設定しなくても、また同塗膜２１形
成に際しての組成物の塗布厚をそれ程大きく設定
しなくても、充分に表面抵抗値の小さな化粧板を
製造することが可能である。いいかえれば後に化
粧板の最上層に位置することとなる導電層（前述
塗膜２１の硬化したもの）中の導電性フイラーの
含有量や導電層の層厚を小さく設定することによ
つて、導電層を半透明にすることが本発明では可
能である。 That is, first of all, in the present invention, the coating film 21 of the thermosetting resin composition containing the conductive filler is
Since a conductive layer is later formed on the uppermost layer of the decorative board, the content of the conductive filler in the coating film 21 does not have to be set so high, and the coating film 21 can be easily coated when the composition is formed. Even if the thickness is not set so large, it is possible to manufacture a decorative board with a sufficiently small surface resistance value. In other words, by setting the content of the conductive filler in the conductive layer (the cured layer of the coating film 21 described above) and the thickness of the conductive layer to be small, the conductivity can be improved. It is possible with the invention to make the layer translucent.
第２に、印刷層２２を、転写層２の第２層目と
なす場合でも、この印刷層２２は、導電性フイラ
ーを含有する熱硬化性樹脂組成物の塗膜２１と熱
硬化性樹脂含浸紙３との間に位置するため、後の
熱圧転写時に、転写層２と熱硬化性樹脂含浸紙３
との積層一体化が、印刷層２２によつて悪影響を
受けることは殆んどない。 Secondly, even when the printing layer 22 is the second layer of the transfer layer 2, the printing layer 22 is composed of a coating film 21 of a thermosetting resin composition containing a conductive filler and a thermosetting resin impregnated with a coating film 21 of a thermosetting resin composition containing a conductive filler. Because it is located between the transfer layer 2 and the thermosetting resin-impregnated paper 3, during subsequent heat-pressure transfer, the transfer layer 2 and the thermosetting resin-impregnated paper 3
The lamination integration with the printing layer 22 is hardly adversely affected by the printed layer 22.
以上の理由によつて、本発明では、転写層２と
して、第２層目の印刷層２２を有するものを使用
し、この印刷層２２の模様を、目的物である化粧
板の模様として生かすことが可能であるが、他
方、印刷層２２は、熱硬化性樹脂含浸紙３の、樹
脂含浸前の紙の表面にあらかじめ形成しておいて
もよい。 For the above reasons, in the present invention, a layer having a second printed layer 22 is used as the transfer layer 2, and the pattern of this printed layer 22 is utilized as the pattern of the decorative board that is the object. On the other hand, the printing layer 22 may be formed in advance on the surface of the thermosetting resin-impregnated paper 3 before being impregnated with the resin.
「実施例」
実施例 １
(1) 転写層を有するフイルムの作成
艷消加工された25μ厚のポリプロピレンフイ
ルム（転写用ベースフイルム）の艷消し面に次
の配合の樹脂組成物を塗布（塗布量15ｇ／m2）
し、その後乾燥して、転写層を有するフイルム
を得た。"Example" Example 1 (1) Creation of a film with a transfer layer A resin composition with the following formulation was applied to the erasable surface of a 25 μ thick polypropylene film (base film for transfer) that had been erasable (coating amount 15g/ m2 )
The film was then dried to obtain a film having a transfer layer.
樹脂組成物
硝化綿 RS１／４ 10重量％
（ポリエステル樹脂 50部（大日本インキ株
式会社バーノツクデーNo.470）酢酸エチル
50部）を混合したもの 20 〃
酸化すず系導電性粉末（触媒化成工業株式会
社ELCOM―TL―20） 30 〃
酢酸エチル 20 〃
トルエン 〃
(2) 熱硬化性樹脂含浸紙の作成
次の配合の樹脂組成物を80ｇ／m2の化粧板様
模様紙に含浸し、その後乾燥して、熱硬化性樹
脂含浸紙を得た（樹脂付着量80ｇ／m2）。 Resin composition nitrified cotton RS1/4 10% by weight (Polyester resin 50 parts (Dainippon Ink Co., Ltd. Burnout Day No. 470) Ethyl acetate
50 parts) 20 〃 Tin oxide-based conductive powder (ELCOM-TL-20, Catalysts & Chemicals Co., Ltd.) 30 〃 Ethyl acetate 20 〃 Toluene 〃 (2) Preparation of thermosetting resin impregnated paper The following composition A decorative laminate-like patterned paper was impregnated with 80 g/m 2 of the resin composition and then dried to obtain thermosetting resin-impregnated paper (resin adhesion amount: 80 g/m 2 ).
樹脂組成物
ジアリルフタレートプレポリマー（住友化学
工業株式会社 ダポン101） 28重量％
ポリエステル樹脂（大日本インキ株式会社
ポリライトKC915） 19 〃
内部添加物（充てん材、離型剤等）
2.5 〃
ベンゾイルパーオキサイド 2.5 〃
アセトン 35 〃
トルエン 13 〃
(3) 熱圧転写
下方から上方へ、５mm厚の珪酸カルシウム
板、前記(2)で作成した熱硬化性樹脂含浸紙、前
記(1)で作成した転写層を有するフイルム、の順
に重ね合わせ、この重ね合わせた材料の上に
は、更にアルミニウム板、クツシヨン材を介し
て上プレス熱板をセツトし、同材料の下には、
クツシヨン材を介して下プレス熱板をセツト
し、温度135℃、圧力15Kg／cm2、時間７分の条
件で、プレス熱板間に重ね合わせた材料を挾圧
して化粧板を得た。 Resin composition diallyl phthalate prepolymer (Sumitomo Chemical Co., Ltd. Dapon 101) 28% by weight Polyester resin (Dainippon Ink Co., Ltd.
Polylite KC915) 19 〃 Internal additives (fillers, mold release agents, etc.)
2.5 〃 Benzoyl peroxide 2.5 〃 Acetone 35 〃 Toluene 13 〃 (3) Heat pressure transfer From bottom to top: 5 mm thick calcium silicate plate, thermosetting resin impregnated paper prepared in (2) above, paper impregnated with thermosetting resin prepared in (1) above. The films having the created transfer layer are stacked in this order, and on top of this stacked material, an upper press hot plate is further set via an aluminum plate and cushion material, and below the same material,
A lower press hot plate was set through the cushion material, and the stacked materials were pressed between the press hot plates at a temperature of 135° C., a pressure of 15 kg/cm 2 and a time of 7 minutes to obtain a decorative board.
以上、(1)、(2)、(3)の如くして得た化粧板の性能
は、次の通りであつた。 The performance of the decorative laminates obtained as described above in (1), (2), and (3) was as follows.
外観；ツヤ消フラツト表面を有し、薄青灰色半
透明の導電層を透して化粧板用模様紙の模様がか
すかに観察可能な化粧板
表面抵抗値；
100V 3.6〜4.2×108
250V 6.2〜7.8×108
500V 7.8〜1.2×108
1000V 3.8〜4.2×108
表面物性；
JAS特殊加工合板規格
１類Ｆタイプ試験合格
実施例 ２
(1) 転写層を有するフイルムの作成
艷有り加工した38μ厚のポリエチレンテレフ
タレートフイルムに次の配合の樹脂組成物を塗
布（塗布量15ｇ／m2）し、乾燥して転写層を有
するフイルムを得た。 Appearance: Decorative board with a matte flat surface, and the pattern of patterned paper for decorative board can be faintly observed through the pale blue-gray translucent conductive layer Surface resistance value: 100V 3.6 to 4.2×10 8 250V 6.2 〜7.8×10 8 500V 7.8〜1.2×10 8 1000V 3.8〜4.2×10 8Surface physical properties; Example of passing the JAS Specially Processed Plywood Standard Class 1 F Type Test 2 (1) Creation of film with transfer layer Processed with ridges A resin composition having the following formulation was coated on a 38 μm thick polyethylene terephthalate film (coating amount: 15 g/m 2 ) and dried to obtain a film having a transfer layer.
樹脂組成物
ジアリルフタレートプレポリマー（住友化学
工業株式会社 ダポン101） 20重量％
ポリエステル樹脂（大日本インキ株式会社
ポリライトKC915） 14 〃
ベンゾイルパーオキサイド ２ 〃
アセトン、トルエン混合溶剤 50 〃
酸化すず系導電性粉末（触媒化成工業株式会
社 ELCOM―TL―20） 14 〃
(2) 熱硬化性樹脂含浸紙の作成
実施例１の(2)と同様にして熱硬化性樹脂含浸
紙を得た。 Resin composition diallyl phthalate prepolymer (Sumitomo Chemical Co., Ltd. Dapon 101) 20% by weight Polyester resin (Dainippon Ink Co., Ltd.
Polylite KC915) 14 〃 Benzoyl peroxide 2 〃 Acetone, toluene mixed solvent 50 〃 Tin oxide-based conductive powder (Catalysts & Chemicals Co., Ltd. ELCOM-TL-20) 14 〃 (2) Preparation of thermosetting resin impregnated paper Example A thermosetting resin-impregnated paper was obtained in the same manner as in 1-(2).
(3) 熱圧転写
下方から上方へ、不織布、前記(2)で作成した
熱硬化性樹脂含浸紙、前記(1)で作成した転写層
を有するフイルム、の順に重ね合わせ、この重
ね合わせた材料の上には、更にエンボス模様型
板、、クツシヨン材を介して上プレス熱板をセ
ツトし、同材料の下には、アルミニウム板、ク
ツシヨン材を介して下プレス熱板をセツトし、
温度140℃、圧力20Kg／cm2、時間８分の条件で、
プレス熱板間に重ね合わせた材料を挾圧して化
粧板を得た。(3) Heat-pressure transfer Layer the nonwoven fabric, the thermosetting resin-impregnated paper prepared in (2) above, and the film with the transfer layer prepared in (1) above in this order from bottom to top, and transfer the layered materials. An upper press hot plate is further set on top of the embossed pattern plate through a cushion material, and a lower press hot plate is set under the same material through an aluminum plate and a cushion material.
Under the conditions of temperature 140℃, pressure 20Kg/cm 2 and time 8 minutes,
A decorative board was obtained by pressing the stacked materials between press hot plates.
以上(1)、(2)、(3)の如くして得た化粧板の性能
は、次の通りであつた。 The performance of the decorative laminates obtained as described above in (1), (2), and (3) was as follows.
外観；艷のあるエンボス表面を有し、薄青灰色
半透明の導電層を透過して化粧板用模様紙の模様
が観察可能な化粧板
表面抵抗値；
100V ６〜10×108
250V ４〜８×108
500V ８〜10×108
1000V ２〜８×108
表面物性；
JAS特殊加工合板規格
FWタイプ合格
「発明の効果」
本発明の化粧板は、最上層に導電層を有するた
め、導電層中の導電性フイラーの含有量や導電層
の層厚を、導電層の透明性が失なわれない程度に
小さく設定した場合であつても、表面抵抗が108
前後の小さなものとなる。そのため導電層の透明
性を生かし、各種の印刷模様を施した化粧板を提
供することができる。 Appearance: Decorative board with an embossed surface with ribs, allowing the pattern of decorative board pattern paper to be observed through the light blue-gray translucent conductive layer Surface resistance value: 100V 6~10×10 8 250V 4~ 8 x 10 8 500V 8 - 10 x 10 8 1000V 2 - 8 x 10 8 Surface physical properties; Passed JAS Specially Processed Plywood Standard FW Type "Effects of the Invention" Since the decorative board of the present invention has a conductive layer on the top layer, Even if the content of the conductive filler in the conductive layer and the layer thickness of the conductive layer are set to be small enough not to lose the transparency of the conductive layer, the surface resistance will be 10 8
The front and back will be small. Therefore, by taking advantage of the transparency of the conductive layer, decorative boards with various printed patterns can be provided.
この様に、本発明で表面導電性の優れた化粧板
が得られるのは、最上層に導電層を形成しうる製
法上の特徴に負うところが多いが、本発明者の実
験によれば、導電層表面の抵抗は、導電層硬化前
の表面抵抗―いいかえれば、導電性フイラーを含
有する熱硬化性樹脂組成物の塗膜の表面抵抗―よ
りも更に小さなものとなつていることが確認され
ている。 As described above, the fact that a decorative board with excellent surface conductivity can be obtained by the present invention is largely due to the characteristics of the manufacturing method that allows the formation of a conductive layer on the top layer.According to the experiments conducted by the present inventors, It has been confirmed that the resistance of the layer surface is even smaller than the surface resistance before the conductive layer is cured - in other words, the surface resistance of the coating film of the thermosetting resin composition containing the conductive filler. There is.
本発明は、以上の如く、表面導電性の優れた化
粧板の製法として有利なものであるが、他方、各
層の積層一体化を、熱硬化性樹脂の硬化を利用し
て一挙におこなうため、耐熱性、耐溶剤性、機械
的強度等においても優れた化粧板を容易に提供し
うるものである。 As described above, the present invention is advantageous as a method for manufacturing a decorative board with excellent surface conductivity, but on the other hand, since the lamination and integration of each layer is carried out at once by utilizing curing of a thermosetting resin, A decorative board with excellent heat resistance, solvent resistance, mechanical strength, etc. can be easily provided.
第１図及び第２図は、本発明の熱圧転写工程前
における各層の積層状態を表わす断面図、第３図
は従来の化粧板における各層の積層状態を表わす
断面図である。
第１図及び第２図中、１…転写用ベースフイル
ム、２…転写層、２１…導電性フイラーを含有す
る熱硬化性樹脂組成物の塗膜、２２…印刷層、３
…熱硬化性樹脂含浸紙、４…基材、第３図中、３
…熱硬化性樹脂含浸紙、３１…紙、３２…印刷
層、３３…熱硬化性樹脂、４…基材。
1 and 2 are cross-sectional views showing the laminated state of each layer before the heat-pressure transfer process of the present invention, and FIG. 3 is a cross-sectional view showing the laminated state of each layer in a conventional decorative board. In FIG. 1 and FIG. 2, 1... base film for transfer, 2... transfer layer, 21... coating film of thermosetting resin composition containing conductive filler, 22... printing layer, 3...
...Thermosetting resin impregnated paper, 4...Base material, 3 in Figure 3
...Thermosetting resin impregnated paper, 31...Paper, 32...Printing layer, 33...Thermosetting resin, 4...Base material.
Claims (1)
を含有する熱硬化性樹脂組成物の塗膜を第１層目
とする転写層を形成し、この転写層を、基材上に
あらかじめ重ね合わせた熱硬化性樹脂含浸紙の上
面へ熱圧転写することにより、転写と同時に基材
と熱硬化性樹脂含浸紙との積層一体化をなすこと
を特徴とする、最上層に導電層を有する化粧板の
製造法。1. A transfer layer is formed on the surface of the base film for transfer, the first layer being a coating film of a thermosetting resin composition containing a conductive filler, and this transfer layer is layered in advance on the base material. A decorative board having a conductive layer as the top layer, characterized in that the base material and the thermosetting resin-impregnated paper are laminated and integrated at the same time as the transfer by heat-pressure transfer onto the upper surface of the curable resin-impregnated paper. Manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60143307A JPS623952A (en) | 1985-06-29 | 1985-06-29 | Manufacture of decorative board, uppermost layer thereof hasconductive layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60143307A JPS623952A (en) | 1985-06-29 | 1985-06-29 | Manufacture of decorative board, uppermost layer thereof hasconductive layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS623952A JPS623952A (en) | 1987-01-09 |
| JPH0255224B2 true JPH0255224B2 (en) | 1990-11-26 |
Family
ID=15335716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60143307A Granted JPS623952A (en) | 1985-06-29 | 1985-06-29 | Manufacture of decorative board, uppermost layer thereof hasconductive layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS623952A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0684066B2 (en) * | 1985-07-16 | 1994-10-26 | 大日本印刷株式会社 | Method for manufacturing decorative board having conductivity |
| JP2630402B2 (en) * | 1987-08-12 | 1997-07-16 | 鈴木総業株式会社 | Method for imparting conductivity to plastic moldings |
| JPS6447477A (en) * | 1987-08-14 | 1989-02-21 | Cubic Eng Kk | Method for imparting electric conductivity to plastic molded body |
-
1985
- 1985-06-29 JP JP60143307A patent/JPS623952A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS623952A (en) | 1987-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0550986B2 (en) | ||
| US4256793A (en) | Embossing assembly for high pressure laminate surfaces | |
| JPH0255224B2 (en) | ||
| TW440528B (en) | Laminated board and process for production thereof | |
| KR101121959B1 (en) | Laminated panel | |
| JPH04191040A (en) | Thermosetting resin decorative laminated sheet | |
| JP3124096B2 (en) | Film composite thermosetting resin decorative board | |
| JPH02133440A (en) | Production of electrical laminate | |
| JPS6321609B2 (en) | ||
| JPS5921774B2 (en) | Manufacturing method of cyanate resin laminate | |
| JP2558078B2 (en) | A template used for forming a decorative laminated sheet having a Japanese paper-like appearance and a method for producing a decorative laminated sheet having a Japanese paper-like appearance | |
| JPH05124148A (en) | Laminated sheet and production thereof | |
| JPH0524167A (en) | Manufacture of thermoplastic resin decorative panel | |
| JPS62234697A (en) | Cushion material for molding press | |
| JPH02133439A (en) | Production of electrical laminate | |
| JP3376907B2 (en) | Manufacturing method of laminated board | |
| JPS6054860B2 (en) | Copper-clad phenolic resin laminate | |
| JPS5923249B2 (en) | Method for manufacturing embossed decorative sheet and decorative board | |
| JPH01202441A (en) | Laminate for electrical apparatus | |
| JPS60190347A (en) | Laminated board for electricity | |
| JPH01225519A (en) | Manufacture of laminate | |
| JPH0771839B2 (en) | Laminated board manufacturing method | |
| JPS62127242A (en) | Manufacture of composite decorative sheet | |
| JPS5989495A (en) | Method of producing multilayer board | |
| JP2000124611A (en) | Manufacture of multilayer printed wiring board |