JPH025501Y2 - - Google Patents
Info
- Publication number
- JPH025501Y2 JPH025501Y2 JP1984109232U JP10923284U JPH025501Y2 JP H025501 Y2 JPH025501 Y2 JP H025501Y2 JP 1984109232 U JP1984109232 U JP 1984109232U JP 10923284 U JP10923284 U JP 10923284U JP H025501 Y2 JPH025501 Y2 JP H025501Y2
- Authority
- JP
- Japan
- Prior art keywords
- plug
- coaxial
- jack
- conductor
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 50
- 239000012212 insulator Substances 0.000 description 10
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000010974 bronze Substances 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 210000001114 tooth apex Anatomy 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984109232U JPS6124982U (ja) | 1984-07-19 | 1984-07-19 | 同軸コネクタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984109232U JPS6124982U (ja) | 1984-07-19 | 1984-07-19 | 同軸コネクタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6124982U JPS6124982U (ja) | 1986-02-14 |
| JPH025501Y2 true JPH025501Y2 (lt) | 1990-02-09 |
Family
ID=30668392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984109232U Granted JPS6124982U (ja) | 1984-07-19 | 1984-07-19 | 同軸コネクタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6124982U (lt) |
-
1984
- 1984-07-19 JP JP1984109232U patent/JPS6124982U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6124982U (ja) | 1986-02-14 |
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