JPH025487U - - Google Patents
Info
- Publication number
- JPH025487U JPH025487U JP8153188U JP8153188U JPH025487U JP H025487 U JPH025487 U JP H025487U JP 8153188 U JP8153188 U JP 8153188U JP 8153188 U JP8153188 U JP 8153188U JP H025487 U JPH025487 U JP H025487U
- Authority
- JP
- Japan
- Prior art keywords
- base
- chip
- thin
- cylindrical metal
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 11
- 239000010432 diamond Substances 0.000 claims description 11
- 239000010953 base metal Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 7
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Earth Drilling (AREA)
Description
第1図〜第3図は、この考案の第1実施例を示
し、第1図は一部省略せる薄肉ダイヤモンドビツ
トの分解図、第2図は同組立図、第3図は同平面
図、第4図〜第6図は、第2実施例を示し、第4
図は一部省略せる分解図、第5図は同組立図、第
6図は同平面図、第7図は第2実施例の薄肉ダイ
ヤモンドビツトの平面図、第8図は同正面図、第
9図は従来の薄肉ダイヤモンドビツトの斜視図で
ある。
10,20……台金、11,21……凹溝、1
1a,21a……ボルト取付孔、12,22……
上端部、13,23……チツプ、14,24……
チツプ基台、15,25……基台、15a,25
a……上面、15b,25b……下面、15c,
25c……ボルト孔、16,26……首部、17
……ボルト。
Figures 1 to 3 show a first embodiment of this invention, with Figure 1 being an exploded view of a thin diamond bit that can be partially omitted, Figure 2 being an assembled view of the same, and Figure 3 being a plan view of the same. Figures 4 to 6 show the second embodiment;
The figures are exploded views that can be partially omitted, FIG. 5 is an assembled view, FIG. 6 is a plan view, FIG. 7 is a plan view of the thin diamond bit of the second embodiment, FIG. FIG. 9 is a perspective view of a conventional thin-walled diamond bit. 10,20...base metal, 11,21...concave groove, 1
1a, 21a... Bolt mounting hole, 12, 22...
Upper end, 13, 23... Chip, 14, 24...
Chip base, 15, 25... base, 15a, 25
a...Top surface, 15b, 25b...Bottom surface, 15c,
25c... Bolt hole, 16, 26... Neck, 17
……bolt.
Claims (1)
溝にチツプ基台の下部を嵌合すると共に、チツプ
基台を円筒状金属台金に螺着した薄肉ダイヤモン
ドビツト。 2 円筒状金属台金の上端部に凹溝を設け、また
チツプ基台の下面に突起部を形成し、該突起部を
前記円筒状金属台金の凹溝に嵌合すると共にチツ
プ基台を円筒状金属台金に螺着した薄肉ダイヤモ
ンドビツト。 3 チツプ基台の一部を嵌合する円筒状金属台金
の凹溝が該台金の上端部を円周方向に方形波状に
切り欠いた凹溝からなる請求項1及び2記載の薄
肉ダイヤモンドビツト。 4 チツプ基台の下面に設けた突起部が該基台の
中央部下面に突出して設けられている請求項2記
載の薄肉ダイヤモンドビツト。 5 チツプ基台は基台上面部に首部を有し、該首
部がチツプ基台を前記台金を嵌合したときに台金
上面より突出している請求項1及び2記載の薄肉
ダイヤモンドビツト。 6 チツプ基台の首部の上部にダイヤモンドチツ
プを配設した請求項1及び2記載の薄肉ダイヤモ
ンドビツト。 7 チツプ基台は円筒状金属台金より硬い材質で
形成されている請求項1及び2記載の薄肉ダイヤ
モンドビツト。[Scope of Claim for Utility Model Registration] 1. A groove is provided at the upper end of the cylindrical metal base, the lower part of the chip base is fitted into the groove, and the chip base is screwed onto the cylindrical metal base. Thin-walled diamond bit. 2. A groove is provided at the upper end of the cylindrical metal base, and a protrusion is formed on the lower surface of the chip base, and the protrusion is fitted into the groove of the cylindrical metal base, and the chip base is A thin diamond bit screwed onto a cylindrical metal base. 3. The thin-walled diamond according to claims 1 and 2, wherein the groove of the cylindrical metal base into which the part of the chip base is fitted is a groove formed by cutting out the upper end of the base metal in a rectangular wave shape in the circumferential direction. Bit. 4. The thin diamond bit according to claim 2, wherein the protrusion provided on the lower surface of the chip base projects from the central lower surface of the base. 5. The thin-walled diamond bit according to claim 1, wherein the chip base has a neck portion on the top surface of the base, and the neck portion protrudes from the top surface of the base metal when the chip base is fitted with the base metal. 6. The thin-walled diamond bit according to claims 1 and 2, wherein the diamond chip is disposed at the upper part of the neck of the chip base. 7. The thin diamond bit according to claims 1 and 2, wherein the chip base is made of a harder material than the cylindrical metal base.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8153188U JPH025487U (en) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8153188U JPH025487U (en) | 1988-06-20 | 1988-06-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH025487U true JPH025487U (en) | 1990-01-16 |
Family
ID=31306310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8153188U Pending JPH025487U (en) | 1988-06-20 | 1988-06-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH025487U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0485661U (en) * | 1990-11-30 | 1992-07-24 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS565088B2 (en) * | 1973-05-15 | 1981-02-03 |
-
1988
- 1988-06-20 JP JP8153188U patent/JPH025487U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS565088B2 (en) * | 1973-05-15 | 1981-02-03 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0485661U (en) * | 1990-11-30 | 1992-07-24 |
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