JPH0254667B2 - - Google Patents

Info

Publication number
JPH0254667B2
JPH0254667B2 JP57007237A JP723782A JPH0254667B2 JP H0254667 B2 JPH0254667 B2 JP H0254667B2 JP 57007237 A JP57007237 A JP 57007237A JP 723782 A JP723782 A JP 723782A JP H0254667 B2 JPH0254667 B2 JP H0254667B2
Authority
JP
Japan
Prior art keywords
wire
alloy
semiconductor devices
strength
aluminum alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57007237A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58124235A (ja
Inventor
Sadahiko Sanki
Yasuhiko Myake
Koichi Tamura
Osamu Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP57007237A priority Critical patent/JPS58124235A/ja
Publication of JPS58124235A publication Critical patent/JPS58124235A/ja
Publication of JPH0254667B2 publication Critical patent/JPH0254667B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/07551—
    • H10W72/07555—
    • H10W72/5363—
    • H10W72/551—
    • H10W72/5524—
    • H10W72/59—

Landscapes

  • Wire Bonding (AREA)
JP57007237A 1982-01-20 1982-01-20 半導体装置用アルミ合金極細線 Granted JPS58124235A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57007237A JPS58124235A (ja) 1982-01-20 1982-01-20 半導体装置用アルミ合金極細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57007237A JPS58124235A (ja) 1982-01-20 1982-01-20 半導体装置用アルミ合金極細線

Publications (2)

Publication Number Publication Date
JPS58124235A JPS58124235A (ja) 1983-07-23
JPH0254667B2 true JPH0254667B2 (enExample) 1990-11-22

Family

ID=11660383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57007237A Granted JPS58124235A (ja) 1982-01-20 1982-01-20 半導体装置用アルミ合金極細線

Country Status (1)

Country Link
JP (1) JPS58124235A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208770A (ja) * 1983-05-12 1984-11-27 Hitachi Ltd ボ−ルボンデイング用アルミ合金極細線
US4845543A (en) * 1983-09-28 1989-07-04 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
JPH0674479B2 (ja) * 1986-10-09 1994-09-21 スカイアルミニウム株式会社 リードフレーム、コネクタもしくはスイッチ用導電圧延材料
US5393703A (en) * 1993-11-12 1995-02-28 Motorola, Inc. Process for forming a conductive layer for semiconductor devices
US5851920A (en) * 1996-01-22 1998-12-22 Motorola, Inc. Method of fabrication of metallization system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164542A (en) * 1981-04-01 1982-10-09 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS58124235A (ja) 1983-07-23

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