JPH0254263U - - Google Patents

Info

Publication number
JPH0254263U
JPH0254263U JP13312688U JP13312688U JPH0254263U JP H0254263 U JPH0254263 U JP H0254263U JP 13312688 U JP13312688 U JP 13312688U JP 13312688 U JP13312688 U JP 13312688U JP H0254263 U JPH0254263 U JP H0254263U
Authority
JP
Japan
Prior art keywords
semiconductor laser
heat dissipation
lead frame
position setting
dissipation fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13312688U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13312688U priority Critical patent/JPH0254263U/ja
Publication of JPH0254263U publication Critical patent/JPH0254263U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図は本考案による樹脂モールド型半導体レ
ーザ装置の一例の略線的拡大斜視図、第2図はそ
の半導体チツプの構成を示す略線的断面図、第3
図は本考案装置の他の例の略線的斜視図である。 1は半導体レーザー、2はリードフレーム、3
は位置設定兼放熱フイン、4は樹脂モールドであ
る。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体レーザーが配置されるリードフレームに
    、半導体レーザーと所定の位置関係に設定された
    位置設定兼放熱フインが設けられ、該位置設定兼
    放熱フインの少くとも一部が上記リードフレーム
    上の半導体レーザーに対して施された樹脂モール
    ドの側壁から突出するようになされた樹脂モール
    ド型半導体レーザー装置。
JP13312688U 1988-10-12 1988-10-12 Pending JPH0254263U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13312688U JPH0254263U (ja) 1988-10-12 1988-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13312688U JPH0254263U (ja) 1988-10-12 1988-10-12

Publications (1)

Publication Number Publication Date
JPH0254263U true JPH0254263U (ja) 1990-04-19

Family

ID=31390711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13312688U Pending JPH0254263U (ja) 1988-10-12 1988-10-12

Country Status (1)

Country Link
JP (1) JPH0254263U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002007275A1 (fr) * 2000-07-17 2002-01-24 Sanyo Electric Co., Ltd. Dispositif laser a semi-conducteur

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002007275A1 (fr) * 2000-07-17 2002-01-24 Sanyo Electric Co., Ltd. Dispositif laser a semi-conducteur

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