JPH0254246U - - Google Patents
Info
- Publication number
- JPH0254246U JPH0254246U JP13398488U JP13398488U JPH0254246U JP H0254246 U JPH0254246 U JP H0254246U JP 13398488 U JP13398488 U JP 13398488U JP 13398488 U JP13398488 U JP 13398488U JP H0254246 U JPH0254246 U JP H0254246U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminals
- semiconductor device
- package
- led out
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13398488U JPH0254246U (it) | 1988-10-13 | 1988-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13398488U JPH0254246U (it) | 1988-10-13 | 1988-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254246U true JPH0254246U (it) | 1990-04-19 |
Family
ID=31392351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13398488U Pending JPH0254246U (it) | 1988-10-13 | 1988-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254246U (it) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62266855A (ja) * | 1986-05-15 | 1987-11-19 | Matsushita Electronics Corp | 半導体パツケ−ジと実装方法 |
-
1988
- 1988-10-13 JP JP13398488U patent/JPH0254246U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62266855A (ja) * | 1986-05-15 | 1987-11-19 | Matsushita Electronics Corp | 半導体パツケ−ジと実装方法 |