JPH0254244U - - Google Patents
Info
- Publication number
- JPH0254244U JPH0254244U JP13311588U JP13311588U JPH0254244U JP H0254244 U JPH0254244 U JP H0254244U JP 13311588 U JP13311588 U JP 13311588U JP 13311588 U JP13311588 U JP 13311588U JP H0254244 U JPH0254244 U JP H0254244U
- Authority
- JP
- Japan
- Prior art keywords
- bending
- leads
- semiconductor device
- lead
- lead forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13311588U JPH0254244U (sv) | 1988-10-12 | 1988-10-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13311588U JPH0254244U (sv) | 1988-10-12 | 1988-10-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0254244U true JPH0254244U (sv) | 1990-04-19 |
Family
ID=31390693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13311588U Pending JPH0254244U (sv) | 1988-10-12 | 1988-10-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0254244U (sv) |
-
1988
- 1988-10-12 JP JP13311588U patent/JPH0254244U/ja active Pending