JPH0254244U - - Google Patents
Info
- Publication number
- JPH0254244U JPH0254244U JP1988133115U JP13311588U JPH0254244U JP H0254244 U JPH0254244 U JP H0254244U JP 1988133115 U JP1988133115 U JP 1988133115U JP 13311588 U JP13311588 U JP 13311588U JP H0254244 U JPH0254244 U JP H0254244U
- Authority
- JP
- Japan
- Prior art keywords
- bending
- leads
- semiconductor device
- lead
- lead forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988133115U JPH0254244U (enExample) | 1988-10-12 | 1988-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988133115U JPH0254244U (enExample) | 1988-10-12 | 1988-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254244U true JPH0254244U (enExample) | 1990-04-19 |
Family
ID=31390693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988133115U Pending JPH0254244U (enExample) | 1988-10-12 | 1988-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254244U (enExample) |
-
1988
- 1988-10-12 JP JP1988133115U patent/JPH0254244U/ja active Pending