JPH0254234U - - Google Patents
Info
- Publication number
- JPH0254234U JPH0254234U JP13336788U JP13336788U JPH0254234U JP H0254234 U JPH0254234 U JP H0254234U JP 13336788 U JP13336788 U JP 13336788U JP 13336788 U JP13336788 U JP 13336788U JP H0254234 U JPH0254234 U JP H0254234U
- Authority
- JP
- Japan
- Prior art keywords
- bare chip
- mounting board
- wire bonding
- chip mounting
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13336788U JPH0254234U (US20030157376A1-20030821-M00001.png) | 1988-10-14 | 1988-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13336788U JPH0254234U (US20030157376A1-20030821-M00001.png) | 1988-10-14 | 1988-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254234U true JPH0254234U (US20030157376A1-20030821-M00001.png) | 1990-04-19 |
Family
ID=31391161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13336788U Pending JPH0254234U (US20030157376A1-20030821-M00001.png) | 1988-10-14 | 1988-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254234U (US20030157376A1-20030821-M00001.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010124001A (ja) * | 2010-03-08 | 2010-06-03 | Rohm Co Ltd | 半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59101857A (ja) * | 1982-12-02 | 1984-06-12 | Toshiba Corp | 半導体装置 |
| JPS62185332A (ja) * | 1986-02-10 | 1987-08-13 | Sumitomo Electric Ind Ltd | 半導体装置 |
-
1988
- 1988-10-14 JP JP13336788U patent/JPH0254234U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59101857A (ja) * | 1982-12-02 | 1984-06-12 | Toshiba Corp | 半導体装置 |
| JPS62185332A (ja) * | 1986-02-10 | 1987-08-13 | Sumitomo Electric Ind Ltd | 半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010124001A (ja) * | 2010-03-08 | 2010-06-03 | Rohm Co Ltd | 半導体装置 |
