JPH0253873U - - Google Patents
Info
- Publication number
- JPH0253873U JPH0253873U JP13064488U JP13064488U JPH0253873U JP H0253873 U JPH0253873 U JP H0253873U JP 13064488 U JP13064488 U JP 13064488U JP 13064488 U JP13064488 U JP 13064488U JP H0253873 U JPH0253873 U JP H0253873U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder supply
- hot air
- soldering iron
- thread
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13064488U JPH0253873U (it) | 1988-10-04 | 1988-10-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13064488U JPH0253873U (it) | 1988-10-04 | 1988-10-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0253873U true JPH0253873U (it) | 1990-04-18 |
Family
ID=31385998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13064488U Pending JPH0253873U (it) | 1988-10-04 | 1988-10-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0253873U (it) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007129036A (ja) * | 2005-11-02 | 2007-05-24 | Denso Corp | レーザはんだ付け方法 |
WO2008023461A1 (fr) * | 2006-08-21 | 2008-02-28 | Mitsuo Ebisawa | fer à braser, procédé de fabrication d'UN appareil électronique en utilisant celui-ci, et équipement de fabrication |
JP2016215220A (ja) * | 2015-05-19 | 2016-12-22 | 株式会社アンド | 半田処理装置 |
JP2017074619A (ja) * | 2015-10-16 | 2017-04-20 | 株式会社アンド | 半田鏝の鏝先及び半田付け装置 |
JP2018020326A (ja) * | 2016-08-01 | 2018-02-08 | 株式会社アンド | 半田処理装置 |
-
1988
- 1988-10-04 JP JP13064488U patent/JPH0253873U/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007129036A (ja) * | 2005-11-02 | 2007-05-24 | Denso Corp | レーザはんだ付け方法 |
JP4631656B2 (ja) * | 2005-11-02 | 2011-02-16 | 株式会社デンソー | レーザはんだ付け方法 |
WO2008023461A1 (fr) * | 2006-08-21 | 2008-02-28 | Mitsuo Ebisawa | fer à braser, procédé de fabrication d'UN appareil électronique en utilisant celui-ci, et équipement de fabrication |
JP5184359B2 (ja) * | 2006-08-21 | 2013-04-17 | 満男 海老澤 | 半田鏝、それを用いて電子機器を製造する方法、及び製造装置 |
JP2013077840A (ja) * | 2006-08-21 | 2013-04-25 | Mitsuo Ebisawa | 半田鏝、それを用いて電子機器を製造する方法、及び製造装置 |
JP2016215220A (ja) * | 2015-05-19 | 2016-12-22 | 株式会社アンド | 半田処理装置 |
JP2017074619A (ja) * | 2015-10-16 | 2017-04-20 | 株式会社アンド | 半田鏝の鏝先及び半田付け装置 |
JP2018020326A (ja) * | 2016-08-01 | 2018-02-08 | 株式会社アンド | 半田処理装置 |
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