JPH0252471U - - Google Patents

Info

Publication number
JPH0252471U
JPH0252471U JP13215988U JP13215988U JPH0252471U JP H0252471 U JPH0252471 U JP H0252471U JP 13215988 U JP13215988 U JP 13215988U JP 13215988 U JP13215988 U JP 13215988U JP H0252471 U JPH0252471 U JP H0252471U
Authority
JP
Japan
Prior art keywords
motherboard
foot portion
integrated circuit
circuit device
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13215988U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0642371Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13215988U priority Critical patent/JPH0642371Y2/ja
Publication of JPH0252471U publication Critical patent/JPH0252471U/ja
Application granted granted Critical
Publication of JPH0642371Y2 publication Critical patent/JPH0642371Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
JP13215988U 1988-10-07 1988-10-07 混成集積回路装置 Expired - Lifetime JPH0642371Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13215988U JPH0642371Y2 (ja) 1988-10-07 1988-10-07 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13215988U JPH0642371Y2 (ja) 1988-10-07 1988-10-07 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPH0252471U true JPH0252471U (US07860544-20101228-C00003.png) 1990-04-16
JPH0642371Y2 JPH0642371Y2 (ja) 1994-11-02

Family

ID=31388869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13215988U Expired - Lifetime JPH0642371Y2 (ja) 1988-10-07 1988-10-07 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPH0642371Y2 (US07860544-20101228-C00003.png)

Also Published As

Publication number Publication date
JPH0642371Y2 (ja) 1994-11-02

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