JPH0251262U - - Google Patents
Info
- Publication number
- JPH0251262U JPH0251262U JP12941488U JP12941488U JPH0251262U JP H0251262 U JPH0251262 U JP H0251262U JP 12941488 U JP12941488 U JP 12941488U JP 12941488 U JP12941488 U JP 12941488U JP H0251262 U JPH0251262 U JP H0251262U
- Authority
- JP
- Japan
- Prior art keywords
- etching apparatus
- nozzles
- etching
- etched
- equal intervals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 3
- 238000013459 approach Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
Landscapes
- ing And Chemical Polishing (AREA)
Description
第１図は本考案のエツチング装置における上部
スプレー配管及びノズル配置の底面図、第２図は
従来の底面図を示す。
１……直管、２……スプレーノズル。
FIG. 1 shows a bottom view of the upper spray piping and nozzle arrangement in the etching apparatus of the present invention, and FIG. 2 shows a conventional bottom view. 1... Straight pipe, 2... Spray nozzle.
Claims (1)
き上面に対する吹付けノズル装備の配管において
、ノズル配置を中央部において密とし周辺部にお
いて粗とすることを特徴とするエツチング装置。 ２ 水平面内にあつて相互に等間隔平行にある直
管を被エツチング板の移動方向とほぼ平行に固定
し、各直管に等間隔で設けた直下方向ノズルの間
隔を中央部で小さく両端に近いほど大きくして成
る請求項１記載のエツチング装置。 ３ 隣接する直管のノズルを互い違いとして成る
請求項２記載のエツチング装置。[Claims for Utility Model Registration] 1. An etching device characterized in that, in piping equipped with spray nozzles for spraying the etching liquid on the upper surface of a plate to be etched, the nozzles are arranged densely in the center and coarsely in the periphery. . 2 Straight pipes that are parallel to each other at equal intervals in a horizontal plane are fixed almost parallel to the moving direction of the plate to be etched, and the distance between the vertical nozzles provided at equal intervals on each straight pipe is small in the center and at both ends. 2. The etching apparatus according to claim 1, wherein the etching apparatus is made larger as the size of the etching apparatus approaches. 3. The etching apparatus according to claim 2, wherein the nozzles of adjacent straight pipes are alternated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12941488U JPH0251262U (en) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12941488U JPH0251262U (en) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0251262U true JPH0251262U (en) | 1990-04-10 |
Family
ID=31383668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12941488U Pending JPH0251262U (en) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0251262U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993881A (en) * | 1982-11-17 | 1984-05-30 | Hitachi Chem Co Ltd | Etching device |
| JPS62202087A (en) * | 1986-02-28 | 1987-09-05 | Matsushita Electric Ind Co Ltd | Etching method |
-
1988
- 1988-09-30 JP JP12941488U patent/JPH0251262U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993881A (en) * | 1982-11-17 | 1984-05-30 | Hitachi Chem Co Ltd | Etching device |
| JPS62202087A (en) * | 1986-02-28 | 1987-09-05 | Matsushita Electric Ind Co Ltd | Etching method |