JPH0251247B2 - - Google Patents
Info
- Publication number
- JPH0251247B2 JPH0251247B2 JP10107184A JP10107184A JPH0251247B2 JP H0251247 B2 JPH0251247 B2 JP H0251247B2 JP 10107184 A JP10107184 A JP 10107184A JP 10107184 A JP10107184 A JP 10107184A JP H0251247 B2 JPH0251247 B2 JP H0251247B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- insulating plate
- resin
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 20
- 229910052782 aluminium Inorganic materials 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 15
- 239000011888 foil Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007743 anodising Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10107184A JPS60245122A (ja) | 1984-05-18 | 1984-05-18 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10107184A JPS60245122A (ja) | 1984-05-18 | 1984-05-18 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60245122A JPS60245122A (ja) | 1985-12-04 |
| JPH0251247B2 true JPH0251247B2 (US07321065-20080122-C00020.png) | 1990-11-06 |
Family
ID=14290870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10107184A Granted JPS60245122A (ja) | 1984-05-18 | 1984-05-18 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60245122A (US07321065-20080122-C00020.png) |
-
1984
- 1984-05-18 JP JP10107184A patent/JPS60245122A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60245122A (ja) | 1985-12-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |