JPH0251059U - - Google Patents
Info
- Publication number
- JPH0251059U JPH0251059U JP12821788U JP12821788U JPH0251059U JP H0251059 U JPH0251059 U JP H0251059U JP 12821788 U JP12821788 U JP 12821788U JP 12821788 U JP12821788 U JP 12821788U JP H0251059 U JPH0251059 U JP H0251059U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- holding
- holder
- holding plate
- grindstone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 2
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12821788U JPH0251059U (me) | 1988-09-29 | 1988-09-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12821788U JPH0251059U (me) | 1988-09-29 | 1988-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0251059U true JPH0251059U (me) | 1990-04-10 |
Family
ID=31381347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12821788U Pending JPH0251059U (me) | 1988-09-29 | 1988-09-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0251059U (me) |
-
1988
- 1988-09-29 JP JP12821788U patent/JPH0251059U/ja active Pending