JPH02500005U - - Google Patents

Info

Publication number
JPH02500005U
JPH02500005U JP1989600020U JP60002089U JPH02500005U JP H02500005 U JPH02500005 U JP H02500005U JP 1989600020 U JP1989600020 U JP 1989600020U JP 60002089 U JP60002089 U JP 60002089U JP H02500005 U JPH02500005 U JP H02500005U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989600020U
Other versions
JPH0447962Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPH02500005U publication Critical patent/JPH02500005U/ja
Application granted granted Critical
Publication of JPH0447962Y2 publication Critical patent/JPH0447962Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1989600020U 1986-09-10 1987-08-31 Expired JPH0447962Y2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/905,903 US4691265A (en) 1986-09-10 1986-09-10 Semiconductor mounting assembly
PCT/US1987/002118 WO1988002184A1 (en) 1986-09-10 1987-08-31 Semiconducteur mounting assembly

Publications (2)

Publication Number Publication Date
JPH02500005U true JPH02500005U (ja) 1990-03-01
JPH0447962Y2 JPH0447962Y2 (ja) 1992-11-12

Family

ID=25421663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989600020U Expired JPH0447962Y2 (ja) 1986-09-10 1987-08-31

Country Status (5)

Country Link
US (1) US4691265A (ja)
EP (1) EP0324766B1 (ja)
JP (1) JPH0447962Y2 (ja)
DE (1) DE3784247T2 (ja)
WO (1) WO1988002184A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0652831B2 (ja) * 1987-09-30 1994-07-06 株式会社日立製作所 自動車用電子回路装置の密封構造
US5057903A (en) * 1989-07-17 1991-10-15 Microelectronics And Computer Technology Corporation Thermal heat sink encapsulated integrated circuit
DE9007439U1 (ja) * 1990-06-29 1991-11-14 Abb-Ixys Semiconductor Gmbh, 6840 Lampertheim, De
DE69329501T2 (de) * 1992-07-17 2001-05-03 Vlt Corp Verpackung für elektronische Komponenten
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US5945130A (en) 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6262512B1 (en) * 1999-11-08 2001-07-17 Jds Uniphase Inc. Thermally actuated microelectromechanical systems including thermal isolation structures
US6549409B1 (en) 2000-08-21 2003-04-15 Vlt Corporation Power converter assembly
US6985341B2 (en) * 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
US7511967B2 (en) * 2007-02-20 2009-03-31 United Technologies Corporation Avionics enclosure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3895267A (en) * 1974-03-11 1975-07-15 Analogic Corp Electronic circuit module with printed circuit board and grounding means
US4069497A (en) * 1975-08-13 1978-01-17 Emc Technology, Inc. High heat dissipation mounting for solid state devices and circuits
US4342068A (en) * 1980-11-10 1982-07-27 Teknational Industries Inc. Mounting assembly for semiconductor devices and particularly power transistors
US4484381A (en) * 1981-07-24 1984-11-27 Marconi Avionics Limited Clamp arrangements
DE3335377A1 (de) * 1983-09-29 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum festhalten eines kuehlkoerpers auf einem integrierten baustein
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
DE3409037A1 (de) * 1984-03-13 1985-09-19 Robert Bosch Gmbh, 7000 Stuttgart Elektrisches schaltgeraet

Also Published As

Publication number Publication date
JPH0447962Y2 (ja) 1992-11-12
US4691265A (en) 1987-09-01
DE3784247D1 (de) 1993-03-25
WO1988002184A1 (en) 1988-03-24
DE3784247T2 (de) 1993-08-26
EP0324766B1 (en) 1993-02-17
EP0324766A1 (en) 1989-07-26

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