JPH02500005U - - Google Patents
Info
- Publication number
- JPH02500005U JPH02500005U JP1989600020U JP60002089U JPH02500005U JP H02500005 U JPH02500005 U JP H02500005U JP 1989600020 U JP1989600020 U JP 1989600020U JP 60002089 U JP60002089 U JP 60002089U JP H02500005 U JPH02500005 U JP H02500005U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/905,903 US4691265A (en) | 1986-09-10 | 1986-09-10 | Semiconductor mounting assembly |
| PCT/US1987/002118 WO1988002184A1 (en) | 1986-09-10 | 1987-08-31 | Semiconducteur mounting assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02500005U true JPH02500005U (US08158827-20120417-C00028.png) | 1990-03-01 |
| JPH0447962Y2 JPH0447962Y2 (US08158827-20120417-C00028.png) | 1992-11-12 |
Family
ID=25421663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989600020U Expired JPH0447962Y2 (US08158827-20120417-C00028.png) | 1986-09-10 | 1987-08-31 |
Country Status (5)
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0652831B2 (ja) * | 1987-09-30 | 1994-07-06 | 株式会社日立製作所 | 自動車用電子回路装置の密封構造 |
| US5057903A (en) * | 1989-07-17 | 1991-10-15 | Microelectronics And Computer Technology Corporation | Thermal heat sink encapsulated integrated circuit |
| DE9007439U1 (de) * | 1990-06-29 | 1991-11-14 | IXYS Semiconductor GmbH, 68623 Lampertheim | Leistungshalbleitermodul mit integrierter Ansteuerungs- und Fehlerschutzplatine |
| DE69329501T2 (de) * | 1992-07-17 | 2001-05-03 | Vlt Corp | Verpackung für elektronische Komponenten |
| US5728600A (en) * | 1994-11-15 | 1998-03-17 | Vlt Corporation | Circuit encapsulation process |
| US5945130A (en) | 1994-11-15 | 1999-08-31 | Vlt Corporation | Apparatus for circuit encapsulation |
| US6316737B1 (en) | 1999-09-09 | 2001-11-13 | Vlt Corporation | Making a connection between a component and a circuit board |
| US6262512B1 (en) * | 1999-11-08 | 2001-07-17 | Jds Uniphase Inc. | Thermally actuated microelectromechanical systems including thermal isolation structures |
| US6549409B1 (en) | 2000-08-21 | 2003-04-15 | Vlt Corporation | Power converter assembly |
| US7443229B1 (en) | 2001-04-24 | 2008-10-28 | Picor Corporation | Active filtering |
| US6985341B2 (en) * | 2001-04-24 | 2006-01-10 | Vlt, Inc. | Components having actively controlled circuit elements |
| US7511967B2 (en) * | 2007-02-20 | 2009-03-31 | United Technologies Corporation | Avionics enclosure |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3895267A (en) * | 1974-03-11 | 1975-07-15 | Analogic Corp | Electronic circuit module with printed circuit board and grounding means |
| US4069497A (en) * | 1975-08-13 | 1978-01-17 | Emc Technology, Inc. | High heat dissipation mounting for solid state devices and circuits |
| US4342068A (en) * | 1980-11-10 | 1982-07-27 | Teknational Industries Inc. | Mounting assembly for semiconductor devices and particularly power transistors |
| US4484381A (en) * | 1981-07-24 | 1984-11-27 | Marconi Avionics Limited | Clamp arrangements |
| DE3335377A1 (de) * | 1983-09-29 | 1985-04-11 | Siemens AG, 1000 Berlin und 8000 München | Einrichtung zum festhalten eines kuehlkoerpers auf einem integrierten baustein |
| IT1213139B (it) * | 1984-02-17 | 1989-12-14 | Ates Componenti Elettron | Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione. |
| DE3409037A1 (de) * | 1984-03-13 | 1985-09-19 | Robert Bosch Gmbh, 7000 Stuttgart | Elektrisches schaltgeraet |
-
1986
- 1986-09-10 US US06/905,903 patent/US4691265A/en not_active Expired - Fee Related
-
1987
- 1987-08-31 JP JP1989600020U patent/JPH0447962Y2/ja not_active Expired
- 1987-08-31 EP EP87906329A patent/EP0324766B1/en not_active Expired - Lifetime
- 1987-08-31 DE DE8787906329T patent/DE3784247T2/de not_active Expired - Fee Related
- 1987-08-31 WO PCT/US1987/002118 patent/WO1988002184A1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| US4691265A (en) | 1987-09-01 |
| JPH0447962Y2 (US08158827-20120417-C00028.png) | 1992-11-12 |
| DE3784247T2 (de) | 1993-08-26 |
| DE3784247D1 (de) | 1993-03-25 |
| EP0324766A1 (en) | 1989-07-26 |
| EP0324766B1 (en) | 1993-02-17 |
| WO1988002184A1 (en) | 1988-03-24 |
