JPH0249233A - Production of optical disk substrate - Google Patents
Production of optical disk substrateInfo
- Publication number
- JPH0249233A JPH0249233A JP20064888A JP20064888A JPH0249233A JP H0249233 A JPH0249233 A JP H0249233A JP 20064888 A JP20064888 A JP 20064888A JP 20064888 A JP20064888 A JP 20064888A JP H0249233 A JPH0249233 A JP H0249233A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- stamper
- radiation
- spacer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 72
- 230000003287 optical effect Effects 0.000 title claims description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000011347 resin Substances 0.000 claims abstract description 47
- 229920005989 resin Polymers 0.000 claims abstract description 47
- 239000011521 glass Substances 0.000 claims abstract description 27
- 125000006850 spacer group Chemical group 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims description 3
- 238000003892 spreading Methods 0.000 claims description 3
- 238000003847 radiation curing Methods 0.000 abstract description 9
- 230000000740 bleeding effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000005510 radiation hardening Methods 0.000 description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
[概要]
光ディスク基板の製造方法に関し、
放射線硬化樹脂をスタンバとガラス基板間に充填させる
際、該放射線硬化樹脂がはみ出してパリを形成すること
のない光ディスク基板の製造方法を目的とし、
スタンパ上の最外円周上近傍にスペーサを周設する工程
と、
該スタンパ上に放射線硬化樹脂を環状に垂下した後にガ
ラス基板を該放射線硬化樹脂および該スペーサ上に載置
する工程と、
該ガラス基板を加圧し、少なくともスタンパ状のグルー
プパターンが刻まれている領域(グループ領域)のほぼ
全域が被覆されるように放射硬化樹脂を押し拡げる工程
と、
該スペーサを抜き、該ガラス基板の自重によって、該放
射線硬化樹脂を該ガラス基板の最外円周近傍まで押し拡
げる工程とを含み構成する。[Detailed Description of the Invention] [Summary] Regarding a method for manufacturing an optical disc substrate, the present invention relates to a method for manufacturing an optical disc substrate in which the radiation-curable resin does not protrude and form a gap when the radiation-curable resin is filled between a standby bar and a glass substrate. For the purpose of this, the process includes the step of providing a spacer around the outermost circumference of the stamper, and placing a glass substrate on the radiation-curable resin and the spacer after hanging the radiation-curable resin in an annular shape on the stamper. a step of applying pressure to the glass substrate to spread the radiation-curing resin so as to cover at least almost the entire region in which the stamper-like group pattern is engraved (group region); and a step of removing the spacer and removing the spacer. The method includes a step of pushing and spreading the radiation-cured resin to the vicinity of the outermost circumference of the glass substrate by the weight of the glass substrate.
[産業上の利用分野]
本発明は光ディスク基板の製造方法に関し、さらに詳し
く説明すれば、書き込み可能な記憶媒体としての光ディ
スク基板の製造法に関する。[Industrial Field of Application] The present invention relates to a method of manufacturing an optical disc substrate, and more specifically, to a method of manufacturing an optical disc substrate as a writable storage medium.
[従来の技術]
従来、光ディスク基板の製造方法として、スタンパ上の
微細なグループパターンを転写する方法つまりフォトポ
リマ法(以下2P法という、)がある。[Prior Art] Conventionally, as a method of manufacturing an optical disk substrate, there is a method of transferring a fine group pattern on a stamper, that is, a photopolymer method (hereinafter referred to as 2P method).
第3図(a)〜(d)は、従来例に係る2P法によるグ
ループパターン転写の工程説明図である。FIGS. 3(a) to 3(d) are process explanatory diagrams of group pattern transfer by the 2P method according to a conventional example.
図において、1はトラ−2り・セクタの識別データおよ
び約数万本のトラック案内溝よりなるグループパターン
が凹凸により記録されたスタンパ。In the figure, reference numeral 1 denotes a stamper on which track 2 sector identification data and a group pattern consisting of approximately tens of thousands of track guide grooves are recorded by concavities and convexities.
2はガラス等の基板、3はスタンパ上のグループパター
ンを写し取る放射線硬化樹脂、6は放射線の1つである
紫外線である。2 is a substrate such as glass, 3 is a radiation curing resin for copying the group pattern on the stamper, and 6 is an ultraviolet ray which is a type of radiation.
以下、図を参照しながら、従来例に係る光ディスク基板
の製造工程について説明する。Hereinafter, the manufacturing process of an optical disk substrate according to a conventional example will be described with reference to the drawings.
まず、スタンパlを低速で回転させながら、スタンパ1
上に放射線硬化樹脂を垂下させて環状に供給する(第3
図(a))。First, while rotating stamper 1 at low speed,
The radiation-cured resin is suspended above and supplied in an annular manner (third
Figure (a)).
次に、ガラス基板2を降下させて該放射線硬化樹脂3に
接触させた後、押圧して該放射線硬化樹脂を徐々に拡げ
、スタンパ1のグループ領域(r=55mmの円とr=
95mmの円で囲まれる領域)の全域にわたって充填さ
せる。その後、基板側から紫外線6を照射して該放射線
硬化樹脂を硬化させる(第3図(b))、そしてスタン
パlからガラス基板2を剥離して、グループパターンを
有する光ディスク基板を作成していた(第3図(c)
) 。Next, the glass substrate 2 is lowered and brought into contact with the radiation-cured resin 3, and then pressed to gradually spread the radiation-cured resin to form a group area of the stamper 1 (a circle of r=55 mm and a circle of r=55 mm).
Fill the entire area (area surrounded by a 95 mm circle). Thereafter, the radiation curing resin was cured by irradiating ultraviolet rays 6 from the substrate side (FIG. 3(b)), and the glass substrate 2 was peeled off from the stamper 1 to create an optical disk substrate having a group pattern. (Figure 3(c)
).
なお、この後グループパターンを転写した放射線硬化樹
脂上に、記録材料(例えば’rb−5iOz保護膜でサ
ンドしたTbFeCoの金属)の薄膜を形成し、2枚の
光ディスクを接着剤により全面貼合わせすることにより
、書換え可能な光ディスクが完成する。After this, a thin film of a recording material (for example, TbFeCo metal sandwiched with a 'rb-5iOz protective film) is formed on the radiation-cured resin onto which the group pattern has been transferred, and the two optical discs are bonded together on the entire surface with an adhesive. As a result, a rewritable optical disc is completed.
[発明が解決しようとする課題]
しかし、従来の2P法ではスタンパ1とガラス基板2と
゛の間に放射線硬化樹脂を充填させる際、スタンパ上の
グループパターンは半径55mmから半径95mmの間
に刻まれているので、この領域(グループ領域)を完全
に充填させようとすると、該放射線硬化樹脂が基板の最
外円周上(半径100mm)をはみ出しパリを形成して
しまうことがある(第3図(C))、そして該パリが硬
化すると、パリの小片が分離し易くなり1分離したとき
にはスタンパ上か、又はガラス基板の硬化した放射線硬
化樹脂上に付着して残る。[Problems to be Solved by the Invention] However, in the conventional 2P method, when filling the space between the stamper 1 and the glass substrate 2 with radiation-curable resin, the group pattern on the stamper is carved between a radius of 55 mm and a radius of 95 mm. Therefore, if you try to completely fill this area (group area), the radiation-cured resin may protrude beyond the outermost circumference (radius 100 mm) of the substrate, forming a gap (see Figure 3). C)) When the Paris hardens, small pieces of Paris tend to separate and remain attached to the stamper or the hardened radiation-cured resin of the glass substrate after one separation.
スタンパ側に該パリが残る場合は、次に別の基板にグル
ープパターンを転写するとき、パリの上に基板がのり、
2Pが広がらなくなるという問題がある。一方、ガラス
基板側の硬化した放射線硬化樹脂上に付着して残る場合
は、次の工程で記録材料の薄膜を形成しようとしたとき
、該パリの付着した部分が成膜できなかったりして、デ
ータの書き込み、又は読み出しエラーの原因になり、良
品歩留りが悪化するという問題がある。If the pads remain on the stamper side, the next time the group pattern is transferred to another substrate, the substrate will be placed on top of the pads.
There is a problem that 2P will not spread. On the other hand, if it remains on the hardened radiation-cured resin on the glass substrate side, when trying to form a thin film of the recording material in the next step, the part to which the paris has adhered may not be able to be formed. There is a problem in that it causes data writing or reading errors, and the yield of non-defective products deteriorates.
本発明はかかる従来の問題点に鑑みて創作されたもので
あり、放射線硬化樹脂が基板とスタンパとの間からはみ
出して生成されるパリの発生の防止が可能な光ディスク
基板の製造方法の提供を目的とする。The present invention was created in view of such conventional problems, and it is an object of the present invention to provide a method for manufacturing an optical disk substrate that can prevent the occurrence of flakes caused by the radiation-cured resin protruding from between the substrate and the stamper. purpose.
[課題を解決するための手段]
第1図は本発明の一実施例に係る光ディスク基板製造工
程の原理説明図である。[Means for Solving the Problems] FIG. 1 is a diagram illustrating the principle of an optical disc substrate manufacturing process according to an embodiment of the present invention.
図中、1はトラック・セクタの識別データおよび約数万
本のトラック案内溝よりなるグループパターンが凹凸に
より記録されたスタンパ、2はガラス等の基板、3はス
タンパ上のグループパターンを写し取る放射線硬化樹脂
、4はスタンパ上の最外円周近傍に周設したスペーサで
、通常3個用いるが、これ以上であってもよい。In the figure, 1 is a stamper on which track/sector identification data and a group pattern consisting of about tens of thousands of track guide grooves are recorded by unevenness, 2 is a substrate such as glass, and 3 is radiation hardening that copies the group pattern on the stamper. The resin 4 is a spacer provided around the outermost circumference of the stamper, and usually three spacers are used, but more than this may be used.
[作用]
本発明の光ディスク基板の製造方法では、スタンパ1の
最外円周近傍にスペーサ4を周設し、該スタンパを回転
させながら放射線硬化樹脂3をスタンパ上の適切な位置
に垂下させて供給する。[Function] In the method for manufacturing an optical disk substrate of the present invention, a spacer 4 is provided around the outermost circumference of the stamper 1, and the radiation-cured resin 3 is suspended at an appropriate position on the stamper while rotating the stamper. supply
次いで、基板2を降下させてスペーサ4および放射線硬
化樹脂3に接触させる。Next, the substrate 2 is lowered to contact the spacers 4 and the radiation-cured resin 3.
このとき、基板の自重だけでは放射線硬化樹脂の不充填
領域が生じるので、基板の上に例えば別の基板を載せて
加圧し、面上、均一に充填させる。At this time, because the weight of the substrate alone causes unfilled areas with the radiation-cured resin, for example, another substrate is placed on top of the substrate and pressure is applied to uniformly fill the entire surface.
ところで、スタンパ上のグループパターンは半径55m
mから半径95mmの間に刻まれており、この領域(グ
ループ領域)は、完全に充填させる必要がある。このこ
とに注意して加圧する。By the way, the group pattern on the stamper has a radius of 55m.
m to a radius of 95 mm, and this area (group area) needs to be completely filled. Pay attention to this when applying pressure.
その後、スペーサ4を抜くと、ガラス基板の自重により
、放射線硬化樹脂3はガラス基板の最外円周(半径10
0mm)近傍まで、つまり半径95mmから半径100
mmの間まで均一に、かつほぼ同心円上に充填できるよ
うになる。このため、従来のように、ガラス基板の最外
円周をはみ出して形成されるパリはほとんどなくなる。After that, when the spacer 4 is removed, the radiation curing resin 3 is transferred to the outermost circumference of the glass substrate (radius 10
0mm), that is, from a radius of 95mm to a radius of 100mm
It becomes possible to fill uniformly and approximately concentrically up to a distance of 1 mm. For this reason, unlike the conventional method, there are almost no holes formed protruding from the outermost circumference of the glass substrate.
[実施例]
第2図(a)〜(d)は、本発明の一実施例に係る光デ
ィスク基板製造工程の説明図である。[Example] FIGS. 2(a) to 2(d) are explanatory diagrams of an optical disc substrate manufacturing process according to an example of the present invention.
図中、1はトラック・セクタの識別データおよび約数五
本のトラック案内溝によりなるグループパターンが凹凸
により記録されたスタンパ、2はガラス等の基板、3は
スタンパ上のグループパターンを写し取る放射線硬化樹
脂、4はスタンパ上の最外円周近傍に周設したスペーサ
、5は基板に加圧手段を用いない場合にできる放射線硬
化樹脂の不充填領域である。In the figure, 1 is a stamper on which a group pattern consisting of track/sector identification data and about five track guide grooves is recorded by unevenness, 2 is a substrate such as glass, and 3 is radiation hardening that copies the group pattern on the stamper. 4 is a spacer provided around the outermost circumference of the stamper, and 5 is an unfilled area of the radiation-cured resin that is formed when no pressure means is used on the substrate.
以下、第1図(a)〜(b)と、第2図(a)〜(d)
を参照しながら光ディスク基板の製造工程について説明
する。Below, Figures 1 (a) to (b) and Figures 2 (a) to (d)
The manufacturing process of the optical disc substrate will be explained with reference to .
まず、スタンパ1の最外円周近傍に35pm厚さのスペ
ーサ4を周設しく3箇所)スタンパを低速で回転させて
、大体半径70mmの位置(第1図(a))に0.8g
の放射線硬化樹脂3(例えば粘度1ポアズのアクリル酸
エステル)を環状に供給する(第2図(a))。First, spacers 4 with a thickness of 35 pm are placed around the outermost circumference of the stamper 1 at 3 locations), and the stamper is rotated at low speed, and 0.8 g
A radiation-curable resin 3 (for example, an acrylic acid ester having a viscosity of 1 poise) is fed in a circular manner (FIG. 2(a)).
次いで直径200mmのガラス基板2を降下させ、スペ
ーサ4と接触させる。このとき基板2の自重だけで放射
線硬化樹脂3を拡げたので、放射線硬化樹脂の不充填領
域5ができてしまう(第2図(b))。Next, the glass substrate 2 with a diameter of 200 mm is lowered and brought into contact with the spacer 4. At this time, since the radiation-cured resin 3 was expanded only by the weight of the substrate 2, an unfilled region 5 of the radiation-cured resin was created (FIG. 2(b)).
ところで、スタンパ上のグループパターンは半径55m
mと半径95mmの間に刻まれており。By the way, the group pattern on the stamper has a radius of 55m.
It is carved between m and radius 95mm.
この領域(グループ領域)は完全に充填させる必要があ
る。そこで、例えば別の基板などを載せて十分に加圧し
て、放射線硬化樹脂3を全体的に押し拡げる(第2図(
(C))、このとき、スペーサ4の介在によって基板2
の円周端部の下面とスタンパ1の上面とは一定の間隔を
もって離れているので、放射線硬化樹脂3は基板2の外
側にまでは達しない。This area (group area) must be completely filled. Therefore, for example, place another board or the like and apply sufficient pressure to spread the radiation-cured resin 3 as a whole (see Figure 2).
(C)), at this time, the substrate 2 is
Since the lower surface of the circumferential end of the stamper 1 is separated from the upper surface of the stamper 1 by a certain distance, the radiation-cured resin 3 does not reach the outside of the substrate 2.
なお、放射線硬化樹脂3がスペーサ4に達して接触する
ときは、やはりパリの原因となるので、スペーサ4にも
達しないことが望ましい、これは放射線硬化樹脂3の滴
下量およびスペーサ4の高さとを適宜選択・調整するこ
とによって、容易に可能である。Note that when the radiation curing resin 3 reaches and contacts the spacer 4, it is desirable that it does not reach the spacer 4 as well, as this may cause cracks. This is easily possible by appropriately selecting and adjusting.
その後、スペーサ4を抜き、ガラス基板2の自重によっ
て放射線硬化樹脂を押し拡げる。これにより、該放射線
硬化樹脂はガラス基板2の最外円周(半径100mm)
近傍まで均一でほぼ同心円上に充填される。Thereafter, the spacer 4 is removed, and the radiation-cured resin is pushed and spread by the weight of the glass substrate 2. As a result, the radiation curing resin is applied to the outermost circumference (radius 100 mm) of the glass substrate 2.
Filling is uniform and almost concentric to the vicinity.
この後、紫外線を照射して放射線硬化樹脂3を硬化させ
、スタンパlからガラス基板2を剥離すると、グループ
パターンを有する光ディスク基板が作成される。Thereafter, the radiation curing resin 3 is cured by irradiation with ultraviolet rays, and the glass substrate 2 is peeled off from the stamper 1, thereby producing an optical disk substrate having a group pattern.
実際、このようにして作成した基板2では、放射線硬化
樹脂のはみ出しがなく、パリは全く認められなかった。In fact, in the substrate 2 prepared in this manner, there was no protrusion of the radiation-cured resin, and no particles were observed at all.
[発明の効果]
以上説明したように、本発明によれば放射線硬化樹脂を
基板の最外円周近傍まで均一に、かつほぼ同心円状に充
填させることにより、該放射線硬化樹脂のはみ出しがな
く、極めてパリの少ない基板を作成することができる。[Effects of the Invention] As explained above, according to the present invention, by filling the radiation curable resin uniformly and almost concentrically to the vicinity of the outermost circumference of the substrate, the radiation curable resin does not protrude. It is possible to create a substrate with extremely few particles.
これにより、パリがスタンパ上に付着して残る場合には
、次の工程で別の基板にグループパターンを転写すると
き、パリの上に基板がのり、2Pが広がらなくなるとか
、あるいはパリがガラス基板の硬化した放射線樹脂上に
付着して残る場合には、次の工程で記録材料の薄膜を形
成しようとしたとき、該パリの付着した部分で記録用の
薄膜が成膜できなくなったりする従来の問題点を解決で
きるので、光ディスク基板の良品歩留り向上に寄与する
ところが大きい。As a result, if the Paris remains on the stamper, when the group pattern is transferred to another substrate in the next step, the substrate may be placed on top of the Paris, preventing the 2P from spreading, or the Paris may remain on the glass substrate. If the particles remain on the cured radiation resin, when trying to form a thin film of recording material in the next step, it may become impossible to form a recording thin film on the areas where the particles have adhered. Since the problem can be solved, it greatly contributes to improving the yield of non-defective optical disk substrates.
第1図は1本発明の一実施例に係る光ディスク基板製造
工程の原理説明図、
第2図は1本発明の一実施例に係る光ディスク基板製造
工程の説明図、
第3図は、従来例に係るzP法による光ディスク基板製
造工程の説明図である。
(符号の説明)
1・・・スタンパ、
?・・・ガラス基板、
3・・・放射線硬化樹脂、
4・・・スペーサ、
5・・・放射線硬化樹脂不充填領域、
6・・・紫外線、
7・・・パリ。1 is an explanatory diagram of the principle of an optical disk substrate manufacturing process according to an embodiment of the present invention; FIG. 2 is an explanatory diagram of an optical disc substrate manufacturing process according to an embodiment of the present invention; FIG. 3 is a conventional example FIG. 2 is an explanatory diagram of an optical disc substrate manufacturing process using the zP method. (Explanation of codes) 1... Stamper, ? ...Glass substrate, 3. Radiation curable resin, 4. Spacer, 5. Radiation curable resin unfilled area, 6. Ultraviolet rays, 7. Paris.
Claims (1)
程と、 該スタンパ上に放射線硬化樹脂を環状に垂下した後にガ
ラス基板を該放射線硬化樹脂および該スペーサ上に載置
する工程と、 該ガラス基板を加圧し、少なくともスタンパ状のグルー
プパターンが刻まれている領域(グループ領域)のほぼ
全域が被覆されるように放射線硬化樹脂を押し拡げる工
程と、 該スペーサを抜き、該ガラス基板の自重によって、該放
射線硬化樹脂を該ガラス基板の最外円周近傍まで押し拡
げる工程とを含むことを特徴とする光ディスク基板の製
造方法。[Claims] A step of providing a spacer around the outermost circumference of the stamper, and placing a glass substrate on the radiation-curable resin and the spacer after hanging the radiation-curable resin in an annular shape on the stamper. a step of applying pressure to the glass substrate to spread the radiation-curable resin so as to cover at least almost the entire region in which the stamper-like group pattern is engraved (group region); and a step of removing the spacer. . A method of manufacturing an optical disk substrate, comprising the steps of: pushing and spreading the radiation-cured resin to the vicinity of the outermost circumference of the glass substrate by the weight of the glass substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20064888A JPH0249233A (en) | 1988-08-10 | 1988-08-10 | Production of optical disk substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20064888A JPH0249233A (en) | 1988-08-10 | 1988-08-10 | Production of optical disk substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0249233A true JPH0249233A (en) | 1990-02-19 |
Family
ID=16427894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20064888A Pending JPH0249233A (en) | 1988-08-10 | 1988-08-10 | Production of optical disk substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0249233A (en) |
-
1988
- 1988-08-10 JP JP20064888A patent/JPH0249233A/en active Pending
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