JPH0249173A - Inspecting device for wiring board - Google Patents
Inspecting device for wiring boardInfo
- Publication number
- JPH0249173A JPH0249173A JP63198855A JP19885588A JPH0249173A JP H0249173 A JPH0249173 A JP H0249173A JP 63198855 A JP63198855 A JP 63198855A JP 19885588 A JP19885588 A JP 19885588A JP H0249173 A JPH0249173 A JP H0249173A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- pin
- socket
- wiring board
- power source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims abstract description 41
- 238000010586 diagram Methods 0.000 abstract description 9
- 239000000523 sample Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract 2
- 230000000295 complement effect Effects 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
本発明は、ケーブル配線されたユニバーサル基板やパタ
ーン配線されたプリント基板の配線検査を行なうための
配線基板の検査装置に関する。The present invention relates to a wiring board inspection device for inspecting the wiring of a universal board with cable wiring or a printed circuit board with pattern wiring.
量産しない特殊な試験装置等の製作やプリント基板化す
る前のチエツク用としてユニバーサル基板が用いられる
。このユニバーサル基板は、電源用およびグランド用の
パターンと規則正しく部品取付は用の透し孔、ランドが
形成されており、この基板上に取り付けられたＩＣソケ
ット間等の配線は、ラッピングやハンダ付けにより行な
われる。
ユニバーサル基板の配線検査は、従来、ブザーを取り付
けたテスタ棒を回路図を見ながら配線間に当てがい、−
本一本配線をチエツクしてゆく手法が一般にとられてい
る。Universal boards are used for manufacturing special test equipment that will not be mass-produced, and for checking before making printed circuit boards. This universal board has patterns for power supply and ground, as well as holes and lands for mounting components in a regular manner. Wiring between IC sockets mounted on this board can be done by wrapping or soldering. It is done. Conventionally, universal board wiring inspection involves placing a tester rod with a buzzer attached between the wires while looking at the circuit diagram.
Generally, a method is used in which each wiring is checked one by one.
【発明が解決しようとする課！１１１
ところで、基板上に搭載されるＩＣソケント数にもよる
が、一般に一枚のユニバーサル基板面に配線されるケー
ブル数は数百本にも及び、これらの配線を一本一本ブザ
ー音を頼りにチエツクしてゆくのは至難の技であり、検
査に相当の時間を要していた。
また従来の手法では、配線洩れは見つけられても、余所
配線を見つけ出すのは困難である。
このようなブザーを利用した手法とは別に、コンピュー
タを利用した検査機器があるが、この検査＠藷は主にプ
リント基板の配線検査に用いられる。
この検査機器は、プリント基板に取り付けられた全部の
Ｉｃソケットにチエツク用のコネクタを差し込んで、Ｉ
Ｃソケットの各ピン間の導通をチエツクし、自動的に配
線検査を行なうものである。
このような検査機器では、プリント基板が変わるごとに
チエツク用のコネクタを新たに用意しなければならなか
ったり、検査機器のソフト上の取扱いや操作方法などを
マスターしなければ使用できないという問題がある。
また検査機器が高価格であり、設４Ｉａ５Ｒの上昇を招
くという問題がある。
そこで、本発明はこのような従来手段の課題を解決する
ために提案されたものであり、簡単な操作で効率のよい
配線検査を行なえ、余所配線を見つけ出すのも容易であ
るとともに、大幅な装置のコストダウンを図れる配線基
板の検査装置を提供することを目的とする。
【課題を解決するための手段】
この目的を達成するために本発明により配線基板の検査
装置は、配線基板上のＩＣソケットの端子にそれぞれ接
続されろ接続ピンが下面に突出するプラグボードに、一
極のリード端子がこれら接続ピンにそれぞれ接続され他
極のリード端子が共通接続された嫂敞の発光ダイオード
を上面側に位置させて設け、このプラグボードをＩＣソ
ケットにそれぞれ装着し、発光ダイオードの他極のリー
ド端子の共通接続点に直流電源の一極をそれぞれ接続し
、この直流電源の他極を配線基板の配線接続点に順次接
触させてゆくことで、配線検査が行なわれる構成となっ
ている。[The problem that the invention tries to solve! 111 By the way, although it depends on the number of IC sockets mounted on the board, the number of cables wired on one universal board is generally several hundred, and these wires are connected one by one by the sound of a buzzer. It was extremely difficult to check the information, and the inspection required a considerable amount of time. Furthermore, with conventional methods, even if a wiring leak is found, it is difficult to find the wiring in other places. Apart from such a method using a buzzer, there is an inspection device that uses a computer, but this inspection@藷 is mainly used for inspecting the wiring of printed circuit boards. This inspection equipment inserts check connectors into all IC sockets attached to the printed circuit board, and
It checks the continuity between each pin of the C socket and automatically performs wiring inspection. There are problems with such testing equipment, such as the need to prepare a new connector for checking every time the printed circuit board changes, and the need to master the handling and operation methods of the testing equipment software before it can be used. . There is also the problem that the inspection equipment is expensive, leading to an increase in equipment costs. Therefore, the present invention was proposed to solve the problems of the conventional means, and enables efficient wiring inspection with simple operations, makes it easy to find wiring in other places, and greatly reduces the cost. An object of the present invention is to provide a wiring board inspection device that can reduce the cost of the device. [Means for Solving the Problems] In order to achieve this object, the wiring board inspection device according to the present invention includes a plug board having connecting pins protruding from the bottom surface to be connected to the terminals of an IC socket on the wiring board, respectively. A light-emitting diode with one pole lead terminal connected to each of these connection pins and a common light-emitting diode with the lead terminals of the other pole connected to each other is placed on the top side, and this plug board is attached to each IC socket, and the light-emitting diode One pole of the DC power supply is connected to the common connection point of the lead terminals of the other pole, and the wiring inspection is performed by sequentially bringing the other pole of the DC power supply into contact with the wiring connection points of the wiring board. It has become.
上述した構成によれば、直流電源の他極の配線接続点に
順次接触させてゆく操作によ抄、配！ｆｓｒｔＲの両端
の発光ダイオードが点灯して実際に配線が行なわれてい
る箇所を表示するので、未配線、余所配線等を容易に目
視により確認することができる。According to the above-described configuration, the wiring connection point of the other pole of the DC power supply is sequentially brought into contact with the wiring connection point. Since the light emitting diodes at both ends of fsrtR light up to display the actual wiring locations, it is possible to easily visually check for unwired wiring, extra wiring, etc.
以下、本発明の実施例を図面に基づき詳細に説明する。
第１図は、本発明による一実施例の配線基板の検査装置
を構成する検査装置単体を示す。
この第１図において、ＩＣソケット用プラグ１は、個別
部品搭載用のいわゆるディスクリートプラットホームま
たはジャンパーチップとして知られており、ＤＩＰ型（
デイアル・インライン・パンケージ型）のＩＣ（インテ
グレーテッド・サーキット）が差し込まれるＩＣソケッ
トに装着して使用される。このプラグ１は、ＩＣソケッ
トのピン数に応じて各種のものが市販されている。
図示の検査装置単体Ｕは、たとえば１６ピン用のＩＣソ
ケットに装着されろプラグ１を用いて構成したものであ
る。
板状をなすこのプラグ１の下面には、第２図および第３
図に示すようにＩＣソケットの接続端子に差し込まれろ
接続ピン２が、ＩＣソケットのピン数と同数突出されて
おり、プラグ１の上面には接続ピン２と導通する部品取
付は用の取付は端子３が設けられている。
プラグ１上のこれら取付は端子３には、第４図および第
５図に示すようにＩＣの電源接続用端子である１６番ピ
ンＰ１６を除く１番ピンＰ１から１５番ピンＰＩＳまで
に発光ダイオードＬのカソードがそれぞれ接続されてお
り、これら発光ダイオードＬのアノードは共通接続され
てさらに１６番ピンＰＩ ６に接続されている。
この構成からなる検査装置単体Ｕは、検査対象となる配
線基板に取り付けられたＩＣソケッ１−と同じピン数の
ものをそれぞれ用意するのが望ましい。たと尤ば１４ピ
ンのＩＣソケットには、１４ピン型の検査装置単体を用
意し、１８ピン、２０ピン、２４ピン等についてもそれ
ぞれのピン数の検査装置単体を用意する。これらの検査
装置単体は、上述の１６ピン型の検査装置単体と同様、
電源接続用端子には発光ダイオードは取り付けず、各発
光ダイオードのアノードが共通接続される。
第６図は、上記検査装置を用いて配線検査が行なわれる
配線基板を示す。検査対象となるこの配線基板４は、ラ
ッピングまたはハンダ付けによりケーブル配線されたユ
ニバーサル基板、またはパターン配線されたプリント基
板である。この配線基板４には、複数のＩＣソケット５
が取り付けられ、これらＩＣソケット５のピン間が回路
図に基づいて配線されている。
この配線基板４の全部のＩＣソケット５には第７図に示
すように、接続方向を一致させるための指標１ｍ、６ａ
をそれぞれ合わせ、接続端子乙に接続ピン２を差し込む
ことで上記検査装置単体Ｕが装着される。
なお、ＩＣソケット５のピン数と同ピン数の検査装置単
体Ｕをそれぞれ装着するのが望ましいが、第８図に示す
ように電源接続用端子を一致させてたとえば２０ピン型
の検査装置単体Ｕ、を１６ピンのＩＣソケット５等に接
続して使用してもよい。
検査装置単体Ｕを取り付けた配線基板４には、それぞれ
のＩＣソケッｌ−６の電源接続用端子と導通するエツジ
コネクタ部４Ａの電源用端子７にｔ：と又は３■の直流
電源８のプラス端子を接続する。
そして、この直流Ｔｉ源８のマイナス端子に接続される
プローブ９の先端９ａを、配線回路図を見ながら各ＩＣ
ソケッＩ−６のピンまたは検査装置単体Ｕの取付は端子
３に順次接触してゆく。この操作でＩＣソケント５上の
検査装置単体Ｕ（よ、配線基板４面て配線が行なわれて
いればその配線間の両端の発光ダイオードｌ−が点灯す
るので、ＩＣソケソ１−５間の何番ピンと何番ピンとが
実際に配線がなされているかがわかる。したがって配線
回路図と照合して、回路図通り配線が行なわれていれば
、回路図上でその配線路を色鉛筆で塗りつぶすなどして
チエツク終了を印してゆけばよい。
ここで、たとえばＩＣソケッ１−（ｆｃ、ｌの４番ピン
Ｐ４に接続される発光ダイオードＬ４、ＩＣソケッ１−
（ＩＣ２）の１番ピンＰ、および２番ピンＰ２に接続さ
れろ発光ダイオードＬ、およびＬ２が点灯したとする。
配線回路図では、ＩＣ２のＰ４とＩＣ２のＰ２とＩＣ３
のＰ、とが接続されているとすれば、ＩＣ，のＰ４とＩ
Ｃ２の２１間の配線は余所配線であり、ＩＣ，のＰ４と
ＩＣ３の２１間（よ未配線であることが容易に１４認さ
れろ。
このように上記検査装置では、簡単な構成でしかも容易
な操作により、配線検査を行なうことができろ。
なお、配線基板４の電源ラインの接続を確認したければ
、検査装置単体を１８０°反転させてＩＣソケットに装
着し、エツジコネクタ部４Ａのグランド用端子１０に直
流電源８のプラス極を接続すればよい。
また、ＩＣソケット５の全ピンに対応して発光ダイオー
ドＬをプラグ１面上に設け、共通接続された発光ダイオ
ードＬのアノードにそれぞれ直流電源８のプラス極をク
リップ付のケーブル等で接続するようにしてもよい。
また、配線基板４上のすべてのＩＣソケット５に検査装
置単体Ｕを装着するのではなく、検査終了毎に順々この
単体Ｕを検査対象となる配線路に対して差し換えてゆく
ことで配線検査を行なっていってもよい。
また、複数のＩＣソケット５に同時に差し込めろような
大きなプラグボードを用意し、このプラグボードの上面
に上述の検査装置単体と同様な構成で発光ダイオードを
取り付けろようにした検査装置も構成できる。Hereinafter, embodiments of the present invention will be described in detail based on the drawings. FIG. 1 shows a single inspection device constituting a wiring board inspection device according to an embodiment of the present invention. In FIG. 1, an IC socket plug 1 is known as a so-called discrete platform or jumper chip for mounting individual components, and is of a DIP type (
It is used by being attached to an IC socket into which a dual in-line pancage type IC (integrated circuit) is inserted. Various plugs 1 are commercially available depending on the number of pins of the IC socket. The illustrated inspection device unit U is configured using a plug 1 that is attached to, for example, a 16-pin IC socket. The lower surface of this plate-shaped plug 1 has the figures 2 and 3.
As shown in the figure, the same number of connecting pins 2 as the number of pins of the IC socket are inserted into the connecting terminal of the IC socket, and the number of connecting pins 2 protruding from the IC socket is the same as the number of pins of the IC socket. 3 is provided. As shown in Figures 4 and 5, these installations on plug 1 include light emitting diodes from pin 1 P1 to pin 15 PIS, excluding pin 16 P16, which is the IC power connection terminal, as shown in Figures 4 and 5. The cathodes of the light emitting diodes L are connected to each other, and the anodes of these light emitting diodes L are commonly connected and further connected to the 16th pin PI 6. It is preferable that each inspection device U having this configuration has the same number of pins as the IC socket 1- attached to the wiring board to be inspected. For example, a 14-pin type testing device is prepared for a 14-pin IC socket, and a testing device for each number of pins is prepared for 18-pin, 20-pin, 24-pin, etc. These inspection devices are similar to the above-mentioned 16-pin inspection device,
No light emitting diode is attached to the power supply connection terminal, and the anodes of each light emitting diode are commonly connected. FIG. 6 shows a wiring board on which wiring is inspected using the above-mentioned inspection apparatus. The wiring board 4 to be inspected is a universal board wired with a cable by wrapping or soldering, or a printed board wired in a pattern. This wiring board 4 includes a plurality of IC sockets 5.
are attached, and the pins of these IC sockets 5 are wired based on a circuit diagram. As shown in FIG. 7, all the IC sockets 5 of this wiring board 4 have marks 1m and 6a for matching the connection direction.
The above-mentioned inspection device unit U is installed by aligning them and inserting the connecting pin 2 into the connecting terminal B. Although it is preferable to mount each test device U having the same number of pins as the IC socket 5, for example, a 20-pin test device U can be installed by matching the power supply connection terminals as shown in FIG. , may be used by connecting it to a 16-pin IC socket 5 or the like. On the wiring board 4 to which the inspection device unit U is attached, the power supply terminal 7 of the edge connector part 4A, which is electrically connected to the power supply connection terminal of each IC socket 1-6, is connected to the positive terminal of the DC power supply 8 of t: or 3■. Connect the terminals. Then, while looking at the wiring circuit diagram, connect the tip 9a of the probe 9 connected to the negative terminal of the DC Ti source 8 to each IC.
The pins of the socket I-6 or the mounting of the testing device unit U come into contact with the terminals 3 in sequence. With this operation, if the wiring is done on the inspection device unit U on the IC socket 5 (4 sides of the wiring board), the light-emitting diodes L- at both ends between the wiring will light up, so what happens between the IC sockets 1 and 5? You can see which pin is actually wired to which pin. Therefore, check it with the wiring circuit diagram, and if the wiring is done according to the circuit diagram, you can fill in the wiring path on the circuit diagram with a colored pencil. All you have to do is mark the completion of the check.Here, for example, the light emitting diode L4 connected to the 4th pin P4 of the IC socket 1-(fc,l),
Assume that the light emitting diodes L and L2 connected to the first pin P and the second pin P2 of (IC2) are lit. In the wiring circuit diagram, P4 of IC2, P2 of IC2, and IC3
If P, of IC, is connected, P4 of IC, and I
The wiring between 21 of C2 is extra wiring, and it is easy to see that there is no wiring between P4 of IC and 21 of IC3.In this way, the above inspection device has a simple configuration. The wiring can be inspected with easy operation.If you want to check the connection of the power line of the wiring board 4, turn the inspection device 180 degrees and attach it to the IC socket, and then connect the edge connector part 4A. It is sufficient to connect the positive pole of the DC power supply 8 to the ground terminal 10.In addition, light emitting diodes L are provided on one side of the plug corresponding to all pins of the IC socket 5, and the anodes of the commonly connected light emitting diodes L are connected to each other. The positive terminal of each DC power supply 8 may be connected with a cable with a clip, etc.Also, instead of attaching the single inspection device U to all the IC sockets 5 on the wiring board 4, the Wiring inspection may be carried out by sequentially replacing these single units U with the wiring paths to be inspected.Also, prepare a large plug board that can be inserted into multiple IC sockets 5 at the same time, It is also possible to construct an inspection device in which a light emitting diode is attached to the top surface of this plug board in the same configuration as the above-mentioned inspection device alone.
以上説明したように本発明によれば、各ピンに対応して
発光ダイオードを取り付けたプラグを配線基板上の３＋
ｃソケツトに装着し、直流電源の−ｉを発光ダイオード
の他極の共通接続点に接続して、この直流電源の他極を
配線基板の配線接続点に接触させてゆくことで配線検査
を行なうようにしている。
したがって、発光ダイオードの点灯を目視することで未
配線、余所配線等を容易に発見することができ、簡単な
操作で効率よく配線検査を行なうことができる。また装
置の構成も簡単であるから従来の検査機器に比べて大幅
なコストダウンを図れる。As explained above, according to the present invention, a plug with a light emitting diode attached corresponding to each pin is connected to the 3+ on the wiring board.
Connect the -i terminal of the DC power supply to the common connection point of the other pole of the light emitting diode, and test the wiring by bringing the other pole of the DC power supply into contact with the wiring connection point of the wiring board. That's what I do. Therefore, by visually observing the lighting of the light emitting diodes, it is possible to easily discover unwired wires, wires in other places, etc., and wiring inspection can be performed efficiently with simple operations. Furthermore, since the configuration of the device is simple, costs can be significantly reduced compared to conventional inspection equipment.
第１図は本発明による配線基板の検査装置を構成する検
査装置単体の斜視図、第２図は上記検査装置単体の側面
図、第３図は上記検査装置単体の背面図、第４図は上記
検査装置単体の平面図、第５図は上記検査装置単体の回
路図、第６図は検査対象となる配線基板の平面図、第７
図は上記検査装置単体を装着した配線基板の平面図、第
８図は上記検査装置単体の装着例を示す側面図である。
１ ・プラグ、 Ｉｓ、５ａ・・・指標。
２・接続ピン、 ３・・取付はピン。
４・・配線基板、 ５・・・ＩＣソケット。
６・接続ジ１を子。
電源用端子。
直流電源。
プローブ。
グランド用端子FIG. 1 is a perspective view of a single inspection device constituting the wiring board inspection device according to the present invention, FIG. 2 is a side view of the above inspection device, FIG. 3 is a rear view of the above inspection device, and FIG. FIG. 5 is a plan view of the above inspection device alone, FIG. 5 is a circuit diagram of the above inspection device itself, FIG. 6 is a plan view of the wiring board to be inspected, and FIG.
The figure is a plan view of a wiring board on which the above-mentioned inspection device alone is mounted, and FIG. 8 is a side view showing an example of mounting the above-mentioned inspection device itself. 1 ・Plug, Is, 5a...Indicator. 2. Connection pin, 3. Installation is pin. 4...Wiring board, 5...IC socket. 6. Connect 1 to child. Power terminal. DC power supply. probe. Ground terminal
Claims (1)
間の配線を検査するための配線基板の検査装置において
、上記ＩＣソケットの端子にそれぞれ接続される接続ピ
ンが下面に突出するプラグボードの上面に、一極のリー
ド端子がこれら接続ピンにそれぞれ接続され他極のリー
ド端子が共通接続された複数の発光ダイオードを設け、
上記プラグボードを上記配線基板上の上記ＩＣソケット
にそれぞれ装着し、上記発光ダイオードの他極のリード
端子の共通接続点に直流電源の一極をそれぞれ接続し、
この直流電源の他極を上記配線の接続点に順次接触させ
てゆくことで、上記配線基板の配線の検査が行なわれる
ことを特徴とする配線基板の検査装置。In a wiring board inspection device for inspecting the wiring between each terminal of a plurality of IC sockets attached to a wiring board, the connection pins connected to the terminals of the IC sockets are mounted on the top surface of a plug board protruding from the bottom surface. , a plurality of light emitting diodes each having a lead terminal of one pole connected to each of these connection pins and a lead terminal of the other pole being commonly connected;
Each of the plug boards is attached to the IC socket on the wiring board, and one pole of the DC power supply is connected to a common connection point of the lead terminal of the other pole of the light emitting diode,
A wiring board inspection apparatus characterized in that the wiring of the wiring board is inspected by sequentially bringing the other pole of the DC power supply into contact with the connection points of the wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63198855A JPH0249173A (en) | 1988-08-11 | 1988-08-11 | Inspecting device for wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63198855A JPH0249173A (en) | 1988-08-11 | 1988-08-11 | Inspecting device for wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0249173A true JPH0249173A (en) | 1990-02-19 |
Family
ID=16398030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63198855A Pending JPH0249173A (en) | 1988-08-11 | 1988-08-11 | Inspecting device for wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249173A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05237554A (en) * | 1991-08-23 | 1993-09-17 | Hashimoto Forming Ind Co Ltd | Device for bending regular size material to be bent |
| JP2011185833A (en) * | 2010-03-10 | 2011-09-22 | Chugoku Electric Power Co Inc:The | Pct conduction checker and conduction check method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58165065A (en) * | 1982-03-26 | 1983-09-30 | Casio Comput Co Ltd | Wire inspector for printed circuit board |
-
1988
- 1988-08-11 JP JP63198855A patent/JPH0249173A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58165065A (en) * | 1982-03-26 | 1983-09-30 | Casio Comput Co Ltd | Wire inspector for printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05237554A (en) * | 1991-08-23 | 1993-09-17 | Hashimoto Forming Ind Co Ltd | Device for bending regular size material to be bent |
| JP2011185833A (en) * | 2010-03-10 | 2011-09-22 | Chugoku Electric Power Co Inc:The | Pct conduction checker and conduction check method |
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