JPH0248989U - - Google Patents

Info

Publication number
JPH0248989U
JPH0248989U JP12734688U JP12734688U JPH0248989U JP H0248989 U JPH0248989 U JP H0248989U JP 12734688 U JP12734688 U JP 12734688U JP 12734688 U JP12734688 U JP 12734688U JP H0248989 U JPH0248989 U JP H0248989U
Authority
JP
Japan
Prior art keywords
substrate
reflective surface
led chips
aperture
aperture provided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12734688U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12734688U priority Critical patent/JPH0248989U/ja
Publication of JPH0248989U publication Critical patent/JPH0248989U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
JP12734688U 1988-09-30 1988-09-30 Pending JPH0248989U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12734688U JPH0248989U (fr) 1988-09-30 1988-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12734688U JPH0248989U (fr) 1988-09-30 1988-09-30

Publications (1)

Publication Number Publication Date
JPH0248989U true JPH0248989U (fr) 1990-04-05

Family

ID=31379696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12734688U Pending JPH0248989U (fr) 1988-09-30 1988-09-30

Country Status (1)

Country Link
JP (1) JPH0248989U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118290A (ja) * 2000-10-11 2002-04-19 Toyoda Gosei Co Ltd 光源装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118290A (ja) * 2000-10-11 2002-04-19 Toyoda Gosei Co Ltd 光源装置及びその製造方法
JP4560936B2 (ja) * 2000-10-11 2010-10-13 豊田合成株式会社 光源装置及びその製造方法

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