JPH0248639B2 - ZENJIDOMETSUKISOCHI - Google Patents

ZENJIDOMETSUKISOCHI

Info

Publication number
JPH0248639B2
JPH0248639B2 JP10229786A JP10229786A JPH0248639B2 JP H0248639 B2 JPH0248639 B2 JP H0248639B2 JP 10229786 A JP10229786 A JP 10229786A JP 10229786 A JP10229786 A JP 10229786A JP H0248639 B2 JPH0248639 B2 JP H0248639B2
Authority
JP
Japan
Prior art keywords
liquid
tank
liquid tank
horizontally
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP10229786A
Other languages
Japanese (ja)
Other versions
JPS6324097A (en
Inventor
Mitsuzo Odagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP10229786A priority Critical patent/JPH0248639B2/en
Publication of JPS6324097A publication Critical patent/JPS6324097A/en
Publication of JPH0248639B2 publication Critical patent/JPH0248639B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、棒状の被メツキ物を全自動でメツキ
する装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a device for fully automatically plating a rod-shaped object to be plated.

[従来の技術] 従来、バレルを用いないで棒状の被メツキ物を
自動でメツキする自動メツキ装置としては、エレ
ベータ式のものが一般的である。
[Prior Art] Conventionally, an elevator-type automatic plating device for automatically plating a rod-shaped object to be plated without using a barrel has generally been used.

エレベータ式自動メツキ装置は、昇降、横行の
2動作により、通常U字形に配置した多数の液槽
に、垂直に吊持した棒状の被メツキ物を間欠連続
的に浸漬し、前処理、メツキ、後処理を行うもの
である。
Elevator-type automatic plating equipment performs pre-treatment, plating, This is for post-processing.

[発明が解決しようとする問題点] しかし、上記従来のエレベータ式自動メツキ装
置によれば、棒状の被メツキ物をメツキする場
合、被メツキ物を垂直に把持し、昇降により各液
槽への浸漬、引上げを行うため、エレベータの高
さ及び液槽の深さを大きくせざるを得ず、自動化
を行つても走行が間欠的となり、処理能力に限界
が存在する問題がある。
[Problems to be Solved by the Invention] However, according to the above-mentioned conventional elevator-type automatic plating device, when plating a rod-shaped object to be plated, the object to be plated is held vertically and moved up and down into each liquid tank. In order to carry out immersion and lifting, the height of the elevator and the depth of the liquid tank must be increased, and even with automation, the running becomes intermittent and there is a problem that there is a limit to processing capacity.

また、液槽の深さが大きいため、薬液等の濃度
及び温度の変化や劣化に対する対応を運転中に的
確に行い得ず、ラインを一旦停止せざるを得ない
問題がある。
Furthermore, since the depth of the liquid tank is large, it is difficult to respond appropriately to changes in the concentration and temperature of the chemical liquid, or to deterioration thereof, during operation, resulting in the problem that the line has to be temporarily stopped.

そこで、本発明は、液槽に対して浸漬、引上げ
される棒状被メツキ物の昇降行程を小さくし、被
メツキ物の連続的な水平走行を可能として処理能
力を向上し得ると共に、液槽の底浅化及び薬液等
の濃度等の自動調整を可能とする全自動メツキ装
置を提供しようとするものである。
Therefore, the present invention reduces the lifting and lowering stroke of the rod-shaped object to be plated that is immersed in and pulled up from the liquid tank, and enables continuous horizontal movement of the object to be plated, thereby improving the throughput of the liquid tank. The present invention aims to provide a fully automatic plating device that enables shallowing of the bottom and automatic adjustment of the concentration of chemical solutions, etc.

[問題点を解決するための手段] 本発明の全自動メツキ装置は、前記問題点を解
決するため、オーバーフロー堰を有する比較的浅
い多数の液槽を直線状に水平に配列した液槽群
と、各液槽からのオーバーフロー液を貯溜すべく
それぞれの液槽の下方に配置され、貯溜した液体
を上方の液槽の底部に緩やかに循環させるように
なした多数の貯溜槽からなる貯溜槽群と、液槽群
の両側上方に沿つてループ状をなして配置され、
ループの下方側が隣接する液槽間を通過する際に
昇降するようにしてほぼ水平に駆動される1対の
チエーンと、両側のチエーン間に電気的に絶縁し
て横架した多数の支持棒と、各支持棒がチエーン
の下方側に位置した際に棒状の被メツキ物を水平
に支持するようにしてそれぞれの支持棒に固着し
た少なくとも1対のL字形引掛ケと、両側のL字
形引掛ケに摺接して給電すべく電極が収容された
液槽の両側上方に配置した給電端子とから構成し
たものである。
[Means for Solving the Problems] In order to solve the above-mentioned problems, the fully automatic plating device of the present invention has a liquid tank group in which a large number of relatively shallow liquid tanks each having an overflow weir are arranged horizontally in a straight line. , a storage tank group consisting of a large number of storage tanks arranged below each tank to store the overflow liquid from each tank, so that the stored liquid is gently circulated to the bottom of the upper tank. and are arranged in a loop along both sides of the liquid tank group,
A pair of chains that are driven almost horizontally so that the lower side of the loop moves up and down as it passes between adjacent liquid tanks, and a number of support rods that are electrically insulated and suspended horizontally between the chains on both sides. , at least one pair of L-shaped hooks fixed to each support rod so as to horizontally support a rod-shaped object to be plated when each support rod is positioned on the lower side of the chain; and L-shaped hooks on both sides. and power supply terminals disposed above both sides of a liquid tank in which electrodes are housed in order to supply power by sliding into contact with the liquid tank.

[作用] 各液槽のオーバーフロー堰からオーバーフロー
する薬液等の液体は、下方の貯溜槽に貯溜された
後、ポンプ等を介して上方の液槽の底部に緩やか
に循環される。このため、上方の液槽内において
は、液槽の液面が常時一定に保たれ、かつ液体の
緩やかな上向流により液体の濃度及び温度の均一
化がなされる。
[Operation] Liquids such as chemicals overflowing from the overflow weir of each liquid tank are stored in the lower storage tank and then gently circulated to the bottom of the upper liquid tank via a pump or the like. Therefore, in the upper liquid tank, the liquid level in the liquid tank is always kept constant, and the concentration and temperature of the liquid are made uniform due to the gentle upward flow of the liquid.

一方、液槽群の一端において供給され、ループ
の下方側に位置するL字形引掛ケに水平に支持さ
れた棒状の被メツキ物は、隣接する液槽間をまた
ぐ場合を除き、水平に移動しながら各液槽に必要
な時間浸漬され、前処理、給電端子からの給電を
受けながらのメツキ処理及び後処理を施され、液
槽群の他端においてL字形引掛ケから製品として
取出される。
On the other hand, the rod-shaped object to be plated, which is supplied at one end of the liquid tank group and supported horizontally on the L-shaped hook located at the lower side of the loop, cannot move horizontally unless it straddles between adjacent liquid tanks. The product is immersed in each liquid tank for the required time, subjected to pre-treatment, plating treatment while receiving power from the power supply terminal, and post-treatment, and then taken out as a product from an L-shaped hook at the other end of the liquid tank group.

[実施例] 本発明の全自動メツキ装置の一実施例を図面に
より説明する。
[Example] An example of the fully automatic plating device of the present invention will be described with reference to the drawings.

第1図、第2図は棒状の被メツキ物W(第3図
参照)に亜鉛メツキを施す全自動メツキ装置1の
側面図、平面図である。
FIGS. 1 and 2 are a side view and a plan view of a fully automatic plating apparatus 1 for galvanizing a rod-shaped object W to be plated (see FIG. 3).

全自動メツキ装置1は、直線状をなすものであ
り、一端(図において左端)に被メツキ物を自動
的に供給する自動供給装置2が付設され、かつ他
端に図示しないメツキ物(製品)を自動的に取出
して乾燥する自動取出・乾燥装置3が付設されて
いる。
The fully automatic plating device 1 is linear, and has an automatic supply device 2 attached to one end (the left end in the figure) for automatically supplying the object to be plated, and a plated object (product) not shown at the other end. An automatic take-out/drying device 3 is attached for automatically taking out and drying.

4は直線状をなすフレームで、フレーム4は、
第1図〜第3図に示すように、相対する複数対の
側柱5a,5bと、両側の側柱5a,5bの下部
間を連結する基板6と、両側の側柱5a,5bの
中間部間を連結する棚板7と、各側の側柱5a,
5bの上部を連結する桁板8a,8bとから構成
されている。
4 is a linear frame; frame 4 is
As shown in FIGS. 1 to 3, a plurality of opposing pairs of side columns 5a, 5b, a base plate 6 connecting the lower portions of both side columns 5a, 5b, and an intermediate between the side columns 5a, 5b on both sides. A shelf board 7 connecting the sections, side pillars 5a on each side,
It is composed of girder plates 8a and 8b that connect the upper part of 5b.

棚板7上には、正面又は側面にオーバーフロー
堰9を有する比較的浅い多数(本実施例において
は11)の液槽10a,10b,10c…からな
る液槽群10が載置されている。各液槽10a,
10b,10c…は、脱脂、水洗等の前処理、メ
ツキ処理及び水洗、ユニクロム等の後処理に対応
する溶剤や、水やメツキ浴等を収容するもので、
それぞれの処理時間と対応する長さを有してお
り、かつフレーム4の長手方向(第1図、第2図
において左右方向)へ適宜に離隔されている。
On the shelf board 7 is placed a liquid tank group 10 consisting of a large number (11 in this embodiment) of relatively shallow liquid tanks 10a, 10b, 10c, . . . having an overflow weir 9 on the front or side surface. Each liquid tank 10a,
10b, 10c... accommodate solvents, water, plating baths, etc. for pre-treatments such as degreasing, washing with water, plating processing, washing with water, post-processing such as Unichrome, etc.
It has a length corresponding to each processing time, and is appropriately spaced apart in the longitudinal direction of the frame 4 (the left-right direction in FIGS. 1 and 2).

一方、基板6上には、液槽群10の各液槽10
a,10b,10c…からのオーバーフロー液を
貯溜する多数の貯溜槽11a,11b,11c…
からなる貯溜槽群11が載置されている。各貯溜
槽11a,11b,11c…は、各液槽10a,
10b,10c…と同様の長さと間隔を保持して
おり、かつ貯溜した液体(オーバーフロー液)を
対応する液槽10a,10b,10c…の底部に
緩やかに循環させるポンプ(図示せず)等を有し
ている。
On the other hand, each liquid tank 10 of the liquid tank group 10 is placed on the substrate 6.
A large number of storage tanks 11a, 11b, 11c... that store overflow liquid from a, 10b, 10c...
A storage tank group 11 consisting of the following is placed. Each storage tank 11a, 11b, 11c... is connected to each liquid tank 10a,
A pump (not shown) or the like is provided, which maintains the same length and spacing as the liquid tanks 10b, 10c, etc., and gently circulates the stored liquid (overflow liquid) to the bottom of the corresponding liquid tank 10a, 10b, 10c,... have.

フレーム4の一端及び他端の両側には、第1
図、第2図及び側柱5a,5b等を省略した第4
図に示すように、従動スプロケツト12及び原動
スプロケツト13が取付けられている。従動スプ
ロケツト12は、後述するチエーンの緊張度等を
調整すべく移動可能に設けられており、又、原動
スプロケツト13は、図示しないモータ等の原動
機と適宜に連動されている。各側の従動スプロケ
ツト12と原動スプロケツト13との間には、ル
ープ状のチエーン14がそれぞれ巻回されてい
る。各チエーン14の上方側及び下方側は、第3
図並びにその要部を拡大した第5a,b及び第6
図に示すように、アングル材15を介し各桁板8
a,8bの内側に取付けた上部ガイドレール16
a,16b及び下部ガイドレール17a,17b
に円滑に案内されている。下部ガイドレール17
a,17bは、第3図中において一点鎖線を境に
し、被メツキ物Wの浸漬状態を右側、非浸漬状態
を左側に示すように、チエーン14の下方側が各
液槽10a,10b,10c,…の上方を通過す
る際には、被メツキ物Wが液体中に浸漬され、
又、チエーン14の下方側が隣接する液槽10
a,10b,10c,…間の上方を通過する際に
は、被メツキ物Wが液槽10a,10b,10
c,…と接触することのないように、第4図にに
示すチエーン14の移動軌跡に倣わせ、隣接する
液槽10a,10b,10c,…間で上方へ円弧
状に湾曲させて高低差を設けてある。
On both sides of one end and the other end of the frame 4, first
Fig. 2 and the fourth diagram omitting the side columns 5a, 5b, etc.
As shown in the figure, a driven sprocket 12 and a driving sprocket 13 are attached. The driven sprocket 12 is movably provided to adjust the tension of the chain, which will be described later, and the driving sprocket 13 is appropriately linked to a prime mover such as a motor (not shown). A loop-shaped chain 14 is wound between the driven sprocket 12 and the driving sprocket 13 on each side. The upper and lower sides of each chain 14 are
Figures 5a, b and 6 with enlarged main parts
As shown in the figure, each girder plate 8 is inserted through the angle material 15.
Upper guide rail 16 attached to the inside of a and 8b
a, 16b and lower guide rails 17a, 17b
You will be guided smoothly. Lower guide rail 17
a, 17b are bordered by a dashed line in FIG. 3, and the lower side of the chain 14 is each liquid tank 10a, 10b, 10c, as shown in FIG. When passing above..., the object W to be plated is immersed in the liquid,
Also, the lower side of the chain 14 is adjacent to the liquid tank 10.
When the object W to be plated passes above the liquid tanks 10a, 10b, 10
In order to avoid contact with the liquid tanks 10a, 10b, 10c, . . ., the chain 14 follows the movement locus shown in FIG. is provided.

両側のチエーン14間には、ステンレス製の多
数の支持棒18が、チエーン14に取付けたL金
具19及び硬質プラスチツク製の角形絶縁ブロツ
ク20(第5図a,b、第6図参照)により、電
気的に絶縁されて水平に横架されている。各支持
棒18には、第3図、第7図a,bに示すよう
に、砲金製の少なくとも1対(実施例においては
間隔を違えた5個)のL字形引掛ケ21が、支持
棒18がチエーン14の下方側に位置した際に棒
状の被メツキ物Wを一端(第7図a,bにおいて
は下端)の支持部21aにより水平に支持するよ
うにし、他端の嵌合孔22を介して嵌着されてい
る。両側(最外側)のL字形引掛ケ21における
中間部付近の外側には、後述する給電端子と摺接
する摺接面23が突設されている。そして、両側
のL字形引掛ケ21間に存する他のL字形引掛ケ
21は、それぞれの中間部付近を連結する銅製の
接続棒24により両側のL字形引掛ケ21と電気
的に接続されている。
Between the chains 14 on both sides, a large number of support rods 18 made of stainless steel are supported by L fittings 19 attached to the chains 14 and rectangular insulating blocks 20 made of hard plastic (see FIGS. 5a and 6). It is electrically insulated and suspended horizontally. As shown in FIGS. 3 and 7a and 7b, each support rod 18 has at least one pair (in the embodiment, five L-shaped hooks 21 at different intervals) of L-shaped hooks 21 made of gunmetal. 18 is located below the chain 14, the rod-shaped object W to be plated is horizontally supported by the support portion 21a at one end (the lower end in FIGS. 7a and 7b), and the fitting hole 22 at the other end It is fitted through. A sliding contact surface 23 that comes into sliding contact with a power supply terminal, which will be described later, is protrudingly provided on the outer side of the L-shaped hook 21 on both sides (outermost side) near the middle part. The other L-shaped hooks 21 existing between the L-shaped hooks 21 on both sides are electrically connected to the L-shaped hooks 21 on both sides by a copper connecting rod 24 that connects the respective intermediate portions. .

一方、電解用及びメツキ用の液槽10e及び1
0hと対応する側柱5a,5bの内側には、第3
図に示すように、端子支持台25a,25bがほ
ぼ水平に突設されており、両側の端子支持台25
a,25bの先端には、給電端子26(第8図参
照)が取付けられている。給電端子26は、被メ
ツキ物Wを支持して電解用及びメツキ用の液槽1
0e及び10h内を移動する両側のL字形引掛ケ
21に給電するためのもので、端子支持台25
a,25bの先端に、電気的に絶縁し、かつチエ
ーン14の移動方向(第8図においては上下方
向)へ水平離隔して植設した2本のリードパイプ
27と、キヤツプ状のナツト28により離脱を防
止して各リードパイプ27の先端に摺動可能に挿
着した可動ボルト29と、両可動ボルト29の先
端間に取付けた摺接板30と、摺接板30を最外
側のL字形引掛ケ21の摺接面23に押圧すべく
各リードパイプ27内に弾装したバネ31とから
構成されている。そして、電解用及びメツキ用の
液槽10e及び10h内の底部には、電極となる
被メツキ物と対応するもう一方の電極(図示せ
ず)が収容されている。
On the other hand, liquid tanks 10e and 1 for electrolysis and plating
On the inside of the side pillars 5a and 5b corresponding to 0h, there is a third
As shown in the figure, the terminal support stands 25a and 25b are provided to protrude almost horizontally, and the terminal support stands 25a and 25b on both sides
A power supply terminal 26 (see FIG. 8) is attached to the tips of a and 25b. The power supply terminal 26 supports the object W to be plated and connects it to the liquid tank 1 for electrolysis and plating.
This is for supplying power to the L-shaped hooks 21 on both sides that move within 0e and 10h, and is connected to the terminal support stand 25.
Two lead pipes 27, which are electrically insulated and horizontally spaced apart in the moving direction of the chain 14 (in the vertical direction in FIG. 8) are installed at the ends of the leads a and 25b, and a cap-shaped nut 28. A movable bolt 29 is slidably inserted into the tip of each lead pipe 27 to prevent separation, a sliding plate 30 is attached between the tips of both the movable bolts 29, and the sliding plate 30 is attached to the outermost L-shape. It is composed of a spring 31 elastically loaded inside each lead pipe 27 to press against the sliding surface 23 of the hook 21. The other electrode (not shown) corresponding to the object to be plated is housed at the bottom of the electrolytic and plating liquid tanks 10e and 10h.

上記構成の全自動メツキ装置により棒状の被メ
ツキ物Wを亜鉛メツキするには、まず、各液槽1
0a,10b,10c…のオーバーフロー堰9か
らオーバーフローして下方の貯溜槽11a,11
b,11c…に貯溜したオーバーフロー液をポン
プ等により上方の各液槽10a,10b,10c
…の底部に緩やかに循環させながら、原動機を作
動して両側のチエーン14を約1m/minの一定
速度で走行させる。
In order to galvanize a bar-shaped object W to be plated using the fully automatic plating apparatus configured as described above, first, each liquid tank 1
0a, 10b, 10c... overflow from the overflow weir 9 and lower storage tanks 11a, 11
The overflow liquid stored in b, 11c... is pumped to each upper liquid tank 10a, 10b, 10c.
The motor is operated to run the chains 14 on both sides at a constant speed of about 1 m/min while circulating gently to the bottom of the...

ついで、自動供給装置2により棒状の被メツキ
物Wをフレーム4の一端においてチエーン14の
下方側に位置するL字形引掛ケ21の支持部21
a上に順次載せる。L字形引掛ケ21に水平に支
持された棒状の被メツキ物Wは、チエーン14の
走行に伴つて隣接する液槽10a,10b,10
c…間をまたぐ場合を除き、下部ガイドレール1
7a,17bに案内されて水平に移動しながら各
液槽10a〜10gに順次必要な時間浸漬されて
脱脂、水洗、酸洗、電解、水洗及び酸中和の前処
理を施された後メツキ用の液槽10hに浸漬され
てメツキ処理を施され、更に液槽10i〜10k
に浸漬されて水洗い、ユニクロム及び水洗の後処
理を施される。
Next, the automatic supply device 2 moves the rod-shaped object W to be plated onto the supporting portion 21 of the L-shaped hook 21 located on the lower side of the chain 14 at one end of the frame 4.
Place them one after another on a. As the chain 14 moves, the rod-shaped object W to be plated horizontally supported by the L-shaped hook 21 is moved to the adjacent liquid tanks 10a, 10b, 10.
c...Unless it straddles the lower guide rail 1
7a and 17b while moving horizontally, they are sequentially immersed in each liquid tank 10a to 10g for the required time and are subjected to pre-treatments such as degreasing, water washing, pickling, electrolysis, water washing, and acid neutralization, and are then used for plating. It is immersed in a liquid tank 10h and subjected to plating treatment, and then further immersed in a liquid tank 10i to 10k.
It is soaked in water, washed with water, and then subjected to post-treatment of Unichrome and water washing.

このメツキ処理の間、被メツキ物W外径は、第
7図a,bに示すように、L字形引掛ケ21の支
持部21aとほぼ同じ大きさであるため、移動す
ることはない。
During this plating process, the outer diameter of the object W to be plated is approximately the same size as the support portion 21a of the L-shaped hook 21, as shown in FIGS. 7a and 7b, and therefore does not move.

ここで、上記電解処理及びメツキ処理中におい
ては、最外側のL字形引掛ケ21の摺接面23に
給電端子26の摺接板30が圧接されて一方の電
極である被メツキ物Wに給電され、電解用及びメ
ツキ用の液槽10e及び10h内の底部に収容し
たもう一方の電極との間で電解処理及びメツキ処
理が行われる。
During the electrolytic treatment and plating process, the sliding contact plate 30 of the power supply terminal 26 is pressed against the sliding surface 23 of the outermost L-shaped hook 21, and power is supplied to the object W to be plated, which is one electrode. Then, electrolytic treatment and plating treatment are performed with the other electrode housed at the bottom of the electrolytic and plating liquid tanks 10e and 10h.

そして、メツキ処理が完了した製品は、フレー
ム4の他端において自動取出し・乾燥装置3によ
りチエーン14の下方側に位置するL字形引掛ケ
21から自動的に取出され、かつ乾燥される。
The product that has been plated is automatically taken out from the L-shaped hook 21 located below the chain 14 by the automatic take-out/drying device 3 at the other end of the frame 4 and dried.

なお、上記実施例は、棒状の被メツキ物Wに亜
鉛メツキする場合について述べたが、銅メツキ
物、クロムメツキその他のメツキをする場合にも
適用できる。
In addition, although the above-mentioned embodiment described the case where the bar-shaped object W to be plated is galvanized, it can also be applied to cases where copper plating, chrome plating, and other types of plating are performed.

[発明の効果] 以上のように本発明の全自動メツキ装置によれ
ば、従来技術に比し次の効果が得られる。
[Effects of the Invention] As described above, the fully automatic plating device of the present invention provides the following effects compared to the prior art.

(1) 棒状の被メツキ物を水平に支持するようにし
たので、被メツキ物の昇降行程が小さくなり、
被メツキ物を連続的に水平走行することがで
き、ひいては処理能力、すなわち生産量を大幅
に増大することができる。
(1) Since the rod-shaped object to be plated is supported horizontally, the lifting distance of the object to be plated is shortened.
The object to be plated can be moved horizontally continuously, and as a result, the processing capacity, that is, the production amount can be greatly increased.

(2) また、棒状の被メツキ物を水平に支持するよ
うにしたので、液槽の深さを浅くすることがで
きると共に、薬液等の液量を少なくすることが
できる。
(2) Furthermore, since the rod-shaped object to be plated is supported horizontally, the depth of the liquid tank can be made shallow, and the amount of liquid such as chemical liquid can be reduced.

(3) 各液槽にオーバーフロー堰を設け、オーバー
フロー堰からオーバーフローした液体を下方の
貯溜槽に一旦貯溜し、貯溜液をポンプ等により
上方の液槽に緩やかに循環させるようにしたの
で、各液槽の液面を常時一定に保持することが
できると共に、緩やかな上向流により液体の濃
度及び温度の均一化が図れ、ひいてはメツキ厚
さの均一化、スラツジの除去及び濃度等の自動
調整が可能となる。
(3) An overflow weir is installed in each liquid tank, and the liquid that overflows from the overflow weir is temporarily stored in the lower storage tank, and the stored liquid is gently circulated to the upper liquid tank using a pump, etc., so that each liquid The liquid level in the tank can be kept constant at all times, and the gentle upward flow can equalize the concentration and temperature of the liquid, making it possible to equalize the plating thickness, remove sludge, and automatically adjust the concentration, etc. It becomes possible.

(4) 装置の両端に自動供給装置及び自動取出・乾
燥装置を付設することにより、装置の完全無人
運転が可能となる。
(4) Completely unmanned operation of the device is possible by installing an automatic feeding device and automatic unloading/drying device at both ends of the device.

【図面の簡単な説明】[Brief explanation of drawings]

図は本発明の全自動メツキ装置の一実施例を示
すもので、第1図、第2図は全自動メツキ装置の
側面図、平面図、第3図は第1図における−
線拡大断面図、第4図は側柱等を省略した全自動
メツキ装置の側面図、第5図aは第3図における
V部分の拡大図で、第5図bはその側面図、第6
図は第3図における部分の拡大図、第7図a及
びbはL字形引掛ケの側面図及び正面図、第8図
は給電端子の平面図である。 4……フレーム、5a,5b……側柱、6……
基板、7……棚板、8a,8b……桁板、9……
オーバーフロー堰、10……液槽群、10a〜1
0k……液槽、11……貯溜槽群、11a〜11
k……貯溜槽、14……チエーン、16a,16
b……上部ガイドレール、17a,17b……下
部ガイドレール、18……支持棒、20……角形
絶縁ブロツク、21……L字形引掛ケ、23……
摺接面、25a,25b……端子支持台、26…
…給電端子、27……リードパイプ、28……ナ
ツト、29……可動ボルト、30……摺接板、3
1……バネ、W……被メツキ物。
The figures show one embodiment of the fully automatic plating device of the present invention, and FIGS. 1 and 2 are side views and plan views of the fully automatic plating device, and FIG. 3 is the same as in FIG. 1.
4 is a side view of the fully automatic plating device with side columns etc. omitted; FIG. 5a is an enlarged view of the V section in FIG. 3; FIG. 5b is a side view thereof;
The figure is an enlarged view of the portion shown in FIG. 3, FIGS. 7a and 7b are a side view and a front view of the L-shaped hook, and FIG. 8 is a plan view of the power supply terminal. 4... Frame, 5a, 5b... Side pillar, 6...
Board, 7... Shelf board, 8a, 8b... Girder board, 9...
Overflow weir, 10...Liquid tank group, 10a-1
0k...Liquid tank, 11...Storage tank group, 11a-11
k...Storage tank, 14...Chain, 16a, 16
b... Upper guide rail, 17a, 17b... Lower guide rail, 18... Support rod, 20... Square insulation block, 21... L-shaped hook, 23...
Sliding surface, 25a, 25b...terminal support stand, 26...
... Power supply terminal, 27 ... Lead pipe, 28 ... Nut, 29 ... Movable bolt, 30 ... Sliding contact plate, 3
1...Spring, W...Object to be plated.

Claims (1)

【特許請求の範囲】[Claims] 1 オーバーフロー堰を有する比較的浅い多数の
液槽を直線状に水平に配列した液槽群と、各液槽
からのオーバーフロー液を貯溜すべくそれぞれの
液槽の下方に配置され、貯溜した液体を上方の液
槽の底部に緩やかに循環させるようになした多数
の貯溜槽からなる貯溜槽群と、液槽群の両側上方
に沿つてループ状をなして配置され、ループの下
方側が隣接する液槽間を通過する際に昇降するよ
うにしてほぼ水平に駆動される1対のチエーン
と、両側のチエーン間に電気的に絶縁して横架し
た多数の支持棒と、各支持棒がチエーンの下方側
に位置した際に棒状の被メツキ物を水平に支持す
るようにしてそれぞれの支持棒に固着した少なく
とも1対のL字形引掛ケと、両側のL字形引掛ケ
に摺接して給電すべく電極が収容された液槽の両
側上方に配置した給電端子とから構成したことを
特徴とする全自動メツキ装置。
1 A liquid tank group in which a large number of relatively shallow liquid tanks each having an overflow weir are arranged horizontally in a straight line, and a liquid tank is placed below each tank to store the overflow liquid from each tank. A storage tank group consisting of a large number of storage tanks that are arranged to be gently circulated at the bottom of the upper liquid tank, and a storage tank group that is arranged in a loop shape along both sides of the tank group, and the lower side of the loop is connected to the adjacent liquid. A pair of chains are driven almost horizontally to move up and down when passing between tanks, and a number of support rods are electrically insulated and suspended horizontally between the chains on both sides, and each support rod is connected to the chain. At least one pair of L-shaped hooks are fixed to each support rod so as to horizontally support the bar-shaped object to be plated when positioned on the lower side, and the L-shaped hooks on both sides are slidably contacted to supply power. A fully automatic plating device characterized by comprising power supply terminals arranged above both sides of a liquid tank in which an electrode is housed.
JP10229786A 1986-05-02 1986-05-02 ZENJIDOMETSUKISOCHI Expired - Lifetime JPH0248639B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10229786A JPH0248639B2 (en) 1986-05-02 1986-05-02 ZENJIDOMETSUKISOCHI

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10229786A JPH0248639B2 (en) 1986-05-02 1986-05-02 ZENJIDOMETSUKISOCHI

Publications (2)

Publication Number Publication Date
JPS6324097A JPS6324097A (en) 1988-02-01
JPH0248639B2 true JPH0248639B2 (en) 1990-10-25

Family

ID=14323681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10229786A Expired - Lifetime JPH0248639B2 (en) 1986-05-02 1986-05-02 ZENJIDOMETSUKISOCHI

Country Status (1)

Country Link
JP (1) JPH0248639B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1746023B1 (en) 2004-04-30 2014-04-09 The Yokohama Rubber Co., Ltd. Flexible buoy

Also Published As

Publication number Publication date
JPS6324097A (en) 1988-02-01

Similar Documents

Publication Publication Date Title
US4534843A (en) Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like
CN102851722A (en) Surface treatment system and workpiece-holding jig
CN1119436C (en) Method and device for surface treatment of parts
CN112746308B (en) Production equipment and process for rack plating zinc plating
US9238874B2 (en) Method and apparatus for electroplating metal parts
US5985106A (en) Continuous rack plater
US5711806A (en) Printed circuit board processing apparatus
US4828878A (en) Device for and method of treating objects, particularly printed circuit boards
JPH0248639B2 (en) ZENJIDOMETSUKISOCHI
US3643670A (en) Apparatus for liquid treatment of flat materials
JP4890493B2 (en) Horizontal suspension jig, surface treatment apparatus, and surface treatment method for long material
CA2918137C (en) System and method for electropolishing or electroplating conveyor belts
US1959764A (en) Apparatus for plating
JP4842082B2 (en) Horizontal suspension jig, surface treatment apparatus, and surface treatment method for long material
USRE28174E (en) Apparatus for liquid treatment of flat materials
CN219174663U (en) Electrolytic degreasing tank for electroplating production line
KR100633043B1 (en) Copper plating apparatus
EP0950730B1 (en) A system for galvanic treatment or finishing of pieces, and corresponding method
US3573187A (en) Apparatus for processing articles
KR850001862B1 (en) Method for continuously electroplating wire
US3200052A (en) Method of and apparatus for plating loom drop wires
US9157160B2 (en) System and method for electropolishing or electroplating conveyor belts
JPH09195092A (en) Continuous electrolytic device
JP2526221B2 (en) Surface treatment equipment
JP2555262B2 (en) Surface treatment equipment

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees