JPH0248284U - - Google Patents
Info
- Publication number
- JPH0248284U JPH0248284U JP12765488U JP12765488U JPH0248284U JP H0248284 U JPH0248284 U JP H0248284U JP 12765488 U JP12765488 U JP 12765488U JP 12765488 U JP12765488 U JP 12765488U JP H0248284 U JPH0248284 U JP H0248284U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- electrode
- water
- cooled
- bonding materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12765488U JPH0248284U (cs) | 1988-09-29 | 1988-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12765488U JPH0248284U (cs) | 1988-09-29 | 1988-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0248284U true JPH0248284U (cs) | 1990-04-03 |
Family
ID=31380276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12765488U Pending JPH0248284U (cs) | 1988-09-29 | 1988-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0248284U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023107002A (ja) * | 2022-01-21 | 2023-08-02 | 愛知産業株式会社 | アタッチメント |
-
1988
- 1988-09-29 JP JP12765488U patent/JPH0248284U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023107002A (ja) * | 2022-01-21 | 2023-08-02 | 愛知産業株式会社 | アタッチメント |
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