JPS6033440U - ワイヤボンディング用電気ト−チ対極 - Google Patents

ワイヤボンディング用電気ト−チ対極

Info

Publication number
JPS6033440U
JPS6033440U JP12470283U JP12470283U JPS6033440U JP S6033440 U JPS6033440 U JP S6033440U JP 12470283 U JP12470283 U JP 12470283U JP 12470283 U JP12470283 U JP 12470283U JP S6033440 U JPS6033440 U JP S6033440U
Authority
JP
Japan
Prior art keywords
counter electrode
electric torch
wire bonding
electrode
discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12470283U
Other languages
English (en)
Inventor
敦 上條
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP12470283U priority Critical patent/JPS6033440U/ja
Publication of JPS6033440U publication Critical patent/JPS6033440U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す斜視図。 １・・・電気トーチ対極、２・・・放電電極、３・・・
雰囲気ガス流入パイプ、４・・・キャピラリ、５・・・
金属細線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属線と放電電極間に放電を生じさせ、金属細線の先端
    部にボールを形成するワイヤボンディング用電気トーチ
    対極において、電気トーチ対極内に雰囲気ガスを流すこ
    とのできる通路が放電室電極の位置まで設けられ１．該
    電気トーチ対極内の放電電極部分の上面及び側面の一部
    に相当する前記電気トーチ対極の部分が切除された構造
    を有することを特徴とするワイヤボンディング用電気ト
    ーチ対極。
JP12470283U 1983-08-11 1983-08-11 ワイヤボンディング用電気ト−チ対極 Pending JPS6033440U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12470283U JPS6033440U (ja) 1983-08-11 1983-08-11 ワイヤボンディング用電気ト−チ対極

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12470283U JPS6033440U (ja) 1983-08-11 1983-08-11 ワイヤボンディング用電気ト−チ対極

Publications (1)

Publication Number Publication Date
JPS6033440U true JPS6033440U (ja) 1985-03-07

Family

ID=30284172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12470283U Pending JPS6033440U (ja) 1983-08-11 1983-08-11 ワイヤボンディング用電気ト−チ対極

Country Status (1)

Country Link
JP (1) JPS6033440U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7658313B2 (en) 2006-07-03 2010-02-09 Kabushiki Kaisha Shinkawa Ball forming device in a bonding apparatus and ball forming method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7658313B2 (en) 2006-07-03 2010-02-09 Kabushiki Kaisha Shinkawa Ball forming device in a bonding apparatus and ball forming method

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