JPH0247236A - Aluminum alloy for joining ceramics - Google Patents
Aluminum alloy for joining ceramicsInfo
- Publication number
- JPH0247236A JPH0247236A JP19752388A JP19752388A JPH0247236A JP H0247236 A JPH0247236 A JP H0247236A JP 19752388 A JP19752388 A JP 19752388A JP 19752388 A JP19752388 A JP 19752388A JP H0247236 A JPH0247236 A JP H0247236A
- Authority
- JP
- Japan
- Prior art keywords
- ceramics
- joining
- aluminum alloy
- strength
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 45
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 26
- 238000005304 joining Methods 0.000 title claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 8
- 239000012535 impurity Substances 0.000 claims abstract description 5
- 238000009792 diffusion process Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 230000004907 flux Effects 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000007790 solid phase Substances 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 238000013001 point bending Methods 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000005097 cold rolling Methods 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- -1 high toughness Chemical class 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
この発明は、セラミックスとの接合に用いるアルミニウ
ム合金に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to an aluminum alloy used for bonding with ceramics.
従来の技術
近年、セラミックスの利用分野が益々拡大しつつあり、
その一方では、セラミックスの有する優れた特性、例え
ば断熱性や耐熱性等と、金属の有する特性、例えば高靭
性や高熱伝導性、導電性等との両者を同時に活用するべ
く、セラミックスと金属とを接合した複合部材、複合部
品が種々の分野で使用されるようになっている。Conventional technology In recent years, the fields of use of ceramics have been expanding more and more.
On the other hand, in order to utilize both the excellent properties of ceramics, such as heat insulation and heat resistance, and the properties of metals, such as high toughness, high thermal conductivity, and electrical conductivity, we are developing ceramics and metals. Bonded composite members and composite parts have come to be used in various fields.
ところで、セラミックスと金属との接合には、従来から
接着剤を用いることが行なわれているが、接着剤を用い
た場合（よ充分な接合強度が得られず、特にセラミック
スと金属との熱膨張率の差によって接合面で剥離が生じ
易い。By the way, adhesives have traditionally been used to bond ceramics and metals, but when adhesives are used, sufficient bonding strength cannot be obtained, especially due to thermal expansion between ceramics and metals. Peeling tends to occur at the joint surface due to the difference in rate.
セラミックスと金属とを強固に接するためには、接合界
面で原子レベルでの結合が行なわれること、すなわち、
いわゆる金属接合がなされることが望ましいが、セラミ
ックスは非金属であるため両者間を直接金属接合するこ
とは困難であると考えられていた。そこで、従来、比較
的高い接合強度が得られる方法として、アルミナセラミ
ックスとアルミニウムもしくはその合金との接合の場合
、アルミナセラミックスの表面に予めＣｕもしくはＡｇ
を溶射や蒸着あるいはメツキ等によってメタライジング
しておき、そのメタライジング層の表面にアルミニウム
もしくはその合金を金属接合（拡散接合）することが行
なわれている。但し、アルミニウムやその合金の表面に
は強固な酸化皮膜が生成されているのが通常であって、
その酸化皮膜が存在したままでは拡散接合することがで
きないから、塩化物とぶつ化物との混合塩のフラックス
を用いてメタライジング層に対する拡散接合処理を行な
うのが通常である。In order to firmly bond ceramics and metals, it is necessary to bond at the atomic level at the bonding interface.
Although it is desirable to perform so-called metal bonding, since ceramics are non-metallic, it has been considered difficult to directly metal bond them. Therefore, in the case of joining alumina ceramics and aluminum or its alloys, as a method for obtaining relatively high joint strength, conventionally, Cu or Ag was applied to the surface of the alumina ceramics in advance.
The metallized layer is metallized by thermal spraying, vapor deposition, plating, etc., and aluminum or its alloy is metallurgically bonded (diffusion bonded) to the surface of the metallized layer. However, a strong oxide film is usually formed on the surface of aluminum and its alloys.
Since diffusion bonding cannot be carried out with the oxide film still present, diffusion bonding treatment for the metallizing layer is normally performed using a flux of a mixed salt of chloride and chloride.
発明が解決しようとする課題
前述のような従来のアルミナセラミックスとアルミニウ
ムもしくはその合金との接合方法では、予めメタライジ
ング層を形成しておく工程が必要であるため、工程数が
多く、＾コストとなる問題があり、また、有害なフラッ
クスを用いなければならないため、作業者の安全や公害
防止等に配慮を払わなければならないという問題があっ
た。Problems to be Solved by the Invention The conventional method of bonding alumina ceramics and aluminum or its alloys as described above requires a step of forming a metallizing layer in advance, resulting in a large number of steps and a high cost. Furthermore, because hazardous flux must be used, consideration must be given to worker safety and pollution prevention.
この発明は以上の事情を背景としてなされたもので、メ
タライジング処理を行なったりフラックスを用いたりす
ることなく、セラミックスに対して高い接合強度で直接
接合することができるアルミニウム合金を提供すること
を目的とするものである。This invention was made against the background of the above circumstances, and the purpose is to provide an aluminum alloy that can be directly bonded to ceramics with high bonding strength without metalizing or using flux. That is.
課題を解決するだめの手段
本発明者等は、前述の目的を達成し得るアルミニウム合
金の成分１１織について鋭意実験・検討を重ねた結果、
適量のＬｉ（リチウム）および／またはＣＩＪ （銅
）を含有させることによって、高い接合強度でアルミニ
ウム合金をセラミックスに拡散接合できることを見出し
、この発明を成すに至った。Means to Solve the Problems The inventors of the present invention have conducted intensive experiments and studies on 11 aluminum alloy components that can achieve the above-mentioned objectives.
The present inventors have discovered that by containing appropriate amounts of Li (lithium) and/or CIJ (copper), it is possible to diffusion bond an aluminum alloy to ceramics with high bonding strength, and have accomplished this invention.
すなわち、この発明のセラミックス接合用アルミニウム
合金は、＠量％でＬｉ ０．５〜３％、Ｃｕ ２〜８％
のいずれか一方もしくは双方を含有し、残部がＡｌおよ
び不可避的不純物よりなることを特徴とするものである
。That is, the aluminum alloy for ceramic bonding of the present invention contains 0.5 to 3% Li and 2 to 8% Cu in terms of %.
It is characterized by containing one or both of the following, with the remainder consisting of Al and inevitable impurities.
作 用
先ずこの発明のアルミニウム合金における成分限定理由
を述べる。Function First, the reason for limiting the ingredients in the aluminum alloy of this invention will be described.
Ｃｕ：
ＣＬＩは、Ａｌの表面酸化皮膜を弱めるとともに、アル
ミニウム合金−セラミックス界面において、アルミニウ
ム合金側からセラミックス側に拡散して、界面接合強度
を高める。また、アルミニウム合金の強度を高めて、継
手強度を高める作用を果す。Ｃ（Ｉの添加量が２％未満
では上述の効果が充分に得られず、一方、８％を越えれ
ば、上述の効果が飽和するとともに、アルミニウム合金
の鋳造、圧延が困難となる。したがってＣＬＩは２〜８
％の範囲内に限定した。Cu: CLI weakens the surface oxide film of Al and diffuses from the aluminum alloy side to the ceramic side at the aluminum alloy-ceramic interface, increasing the interfacial bonding strength. It also serves to increase the strength of the aluminum alloy and the strength of the joint. If the amount of C(I added is less than 2%, the above-mentioned effects cannot be sufficiently obtained. On the other hand, if it exceeds 8%, the above-mentioned effects are saturated and it becomes difficult to cast and roll the aluminum alloy. Therefore, CLI is 2-8
% within the range.
Ｌｌ ：
１ｉはＡｌの表面酸化皮膜をポーラスにし、アルミニウ
ム合金−セラミックス界面においてアルミニウム合金側
からセラミックス側に拡散して、界面接合強度を高める
。Ｌｉの添加量が０．５％未満ては上記の効果が充分に
得られず、一方、３％を越えればアルミニウム合金の鋳
造が困難となるから、ｌｉの添加量は０．５〜３％の範
囲内とした。Ll: 1i makes the surface oxide film of Al porous, diffuses from the aluminum alloy side to the ceramic side at the aluminum alloy-ceramic interface, and increases the interfacial bonding strength. If the amount of Li added is less than 0.5%, the above effects cannot be sufficiently obtained, while if it exceeds 3%, it becomes difficult to cast an aluminum alloy, so the amount of Li added is 0.5 to 3%. was within the range of
ここで、Ｃｕ、ｌｉはいずれか一方を単独で添加しても
、また両者を同時に添加しても良い。両者を同時に添加
した場合には、それぞれの効果が重畳されて、より一層
セラミックスとの接合性の良好なアルミニウム合金を得
ることができる。Here, either one of Cu and Li may be added alone, or both may be added at the same time. When both are added at the same time, their respective effects are superimposed, making it possible to obtain an aluminum alloy with even better bondability with ceramics.
また上記のｌｉ、Ｑｕのほか、結晶粒微測化のため、Ｍ
ｎ、Ｃｒ、Ｖ、Ｚｒのうちの１種または２種以上を各々
０．５０％未満添加することもある。In addition to the above li and Qu, M
One or more of n, Cr, V, and Zr may be added in an amount of less than 0.50% each.
以上の各成分のほかはＡｌおよび不可避的不純物とすれ
ば良い。不可避的不純物としてのｌ”ｅは１．０％未満
、ｚｎは０．５０％未満、Ｍｑは０．１０％未満、３ｉ
は０．５０％未満であれば特に支障はない。In addition to the above-mentioned components, Al and inevitable impurities may be used. l"e as unavoidable impurities is less than 1.0%, zn is less than 0.50%, Mq is less than 0.10%, 3i
There is no particular problem if it is less than 0.50%.
そのほか、アルミニウム台金鋳塊の製造においては、一
般に鋳塊結晶粒の微細化のためにＴｉ、またはＴｉおよ
びＢを添加することが多いが、この発明の合金の場合も
Ｔｉ１またはｌｉおよびＢが添加されていてもよい。但
しその添加量は、Ｔ＋ ０．２％以下、８０．０４％以
下が望ましい。In addition, in the production of aluminum base metal ingots, generally Ti or Ti and B are often added to refine the ingot crystal grains, but in the case of the alloy of this invention, Ti1 or li and B are also added. May be added. However, the amount added is preferably T+ 0.2% or less and 80.04% or less.
前述のように、この発明のアルミニウム合金は、１ｉお
よび／またはＱｕを含有しているために表面酸化皮膜が
脆弱となるかまたはポーラスとなり、セラミックスとの
接合時にはｌｉ、Ｑｕが界面においてセラミックス側へ
拡散して固相拡散接合が行なわれ、したがってセラミッ
クスと強固に接合することができる。As mentioned above, since the aluminum alloy of the present invention contains 1i and/or Qu, the surface oxide film becomes brittle or porous, and when bonded to ceramics, li and Qu move toward the ceramic side at the interface. Solid-phase diffusion bonding is performed by diffusion, and therefore it is possible to firmly bond to ceramics.
なお、この発明のアルミニウム合金を製造するにあたっ
ては、先ず常法にしたがって鋳造する。In manufacturing the aluminum alloy of the present invention, it is first cast according to a conventional method.
この鋳造方法としては半速Ｒ鋳造法（ＤＣ鋳造法）が一
般的であるが、省エネルギや耐軟化性の向上等の観点か
ら薄板連続鋳造法（連続鋳造圧延法）を適用してもよい
。The half-speed R casting method (DC casting method) is generally used as this casting method, but continuous thin plate casting method (continuous casting and rolling method) may also be applied from the viewpoint of energy saving and improvement of softening resistance. .
得られた鋳塊に対しては、均熱処理（均質化処理）およ
び熱間圧延を行ない、必要に応じて冷間圧延を行なって
所望の板厚に仕上げる。ここで、冷間圧延の前、後、途
中のいずれかにおいて焼鈍を施すこともある。但し、薄
板連続鋳造法の場合は、これらの工程のうち熱間圧延ま
での工程を省賂することができる。The obtained ingot is subjected to soaking treatment (homogenization treatment) and hot rolling, and if necessary, cold rolling is performed to finish it to a desired thickness. Here, annealing may be performed before, after, or during cold rolling. However, in the case of continuous thin plate casting, the steps up to hot rolling can be omitted.
また、この発明のアルミニウム合金をセラミックスと接
合するにあたっては、アルミニウム合金表面を平滑に仕
上げた後、セラミックスと重ね合せて真空雰囲気等の非
酸化性雰囲気にて加圧・加熱すればよい。この時の加熱
温度は特に限定しないが、通常は３００〜６５０℃程度
が好ましい。In addition, in joining the aluminum alloy of the present invention with ceramics, the surface of the aluminum alloy may be smoothed, and then the aluminum alloy may be laminated with ceramics and pressurized and heated in a non-oxidizing atmosphere such as a vacuum atmosphere. The heating temperature at this time is not particularly limited, but is usually preferably about 300 to 650°C.
実施例
第１表に示す成分組成の各合金Ｎｏ、 １〜瀬６を鋳造
し、熱間圧延および冷間圧延により３Ｍ厚まで圧延した
。この圧延板をパフ研磨により鏡面に仕上げ、供試材と
した。各供試材について、次のようにしてセラミックス
との接合強度を調べた。すなわち、接合相手材のセラミ
ックスとしては、Ａｌ２Ｏ３もしくはＺｒＯ２またはＡ
ＩＮを選んだ。そのセラミックスの寸法は、２Ｃ）＋Ｉ
ｎＸ２０ｓＸ２０ｓとし、予め接合面をラッピングによ
り窺面に仕上げた。そして、２枚のセラミックスの間に
前記圧延板をサンドインチ状に挾み、真空度１０棒ｔｏ
ｒｒの雰囲気にて、温度的６００℃、加重５ ＭＰａで
加熱・加圧して接合した。その接合時の詳細な温度−加
重−時間曲線を第１図に示す。Examples Alloys Nos. 1 to 6 having the compositions shown in Table 1 were cast and rolled to a thickness of 3M by hot rolling and cold rolling. This rolled plate was finished to a mirror finish by puff polishing and used as a test material. For each sample material, the bonding strength with ceramics was investigated in the following manner. That is, as the ceramic material to be joined, Al2O3, ZrO2 or A
I chose IN. The dimensions of the ceramic are 2C)+I
nX20sX20s, and the bonded surface was finished in advance by lapping to give a diagonal surface. Then, the rolled plate was sandwiched between two ceramics in a sandwich shape, and the vacuum level was 10 bars.
Bonding was carried out by heating and pressurizing at a temperature of 600° C. and a load of 5 MPa in an atmosphere of RR. A detailed temperature-load-time curve at the time of bonding is shown in FIG.
以上のようにして得られた接合部材から第２図に示すよ
うな接合強度試験片１を切出した。なお、第２図におい
て２．３はセラミックス、４はアルミニウム合金圧延板
である。この試験片１について、第３図に示すような４
点曲げ試験用治具を用いて４点曲げ試験を行ない、接合
強度として曲げ強度を調べた。第３図において、５は上
部治具、６は下部治具、７は加圧支点としての丸棒であ
る。A bonding strength test piece 1 as shown in FIG. 2 was cut out from the bonded member obtained as described above. In addition, in FIG. 2, 2.3 is a ceramic, and 4 is an aluminum alloy rolled plate. Regarding this test piece 1, as shown in FIG.
A four-point bending test was conducted using a point bending test jig, and bending strength was examined as joint strength. In FIG. 3, 5 is an upper jig, 6 is a lower jig, and 7 is a round bar serving as a pressurizing fulcrum.
このようにして曲げ試験を行なった結果を第２表に示す
。なお、第２表中には、接合相手材として用いたセラミ
ックスの種類も併せて示す。Table 2 shows the results of the bending test conducted in this manner. Note that Table 2 also shows the types of ceramics used as the mating material.
（この頁以下余白）
第１ａ：供試材の化学成分（ｗｔ％）
第２表：接合部材の試験結果
第２表に示す結果から、この発明のアルミニウム合金を
セラミックスどの接合に用いた場合の接合強度が著しく
高いことが明らかである。(Margins below this page) Part 1a: Chemical composition of sample material (wt%) Table 2: Test results of joining members From the results shown in Table 2, it is clear that the aluminum alloy of this invention is used for joining ceramics. It is clear that the bond strength is significantly high.
なお、以上の実施例では接合相手材のごラミックスとし
てＡｌ ２０３．ＡＩ Ｎ、ＺｒＯ２を用いた例につい
て示したが、これらに限らず、他のセラミックスとの接
合の場合に６高い接合強１旦が得られることは勿論であ
る。In the above examples, Al 203. Although examples using AIN and ZrO2 have been shown, it goes without saying that a 6 higher bonding strength can be obtained when bonding with other ceramics.
また、この発明のアルミニウム合金は、他の金属をセラ
ミックスと接合づる場合に、その金属とセラミックスと
の間におけるインサータとして用いることもできる。Further, the aluminum alloy of the present invention can also be used as an inserter between another metal and ceramics when the other metal is joined to the ceramics.
発明の効果
この発明のアルミニウム台金は、セラミックスと接合す
るにあたって、予めヒラミックスの表面にＣｕやＡｃ＋
等のメタライジング層を形成しておくことなく、かつ有
害なフラックスを用いることなく、直接セラミックスと
ひ１相拡散接合により、高い接合強度で強固に接合づる
ことができる。したがって、この発明のアルミニウム合
金にＪ：れば、セラミックスとアルミニウム合金とが強
固に結合−休止した部材を、低コストでかつ安全や公害
上の問題を＋ａ＜ことな（得ることができる。Effects of the Invention When the aluminum base metal of this invention is bonded to ceramics, Cu or Ac+ is applied to the surface of Hiramix in advance.
It is possible to firmly bond with high bonding strength directly to ceramics by single-phase diffusion bonding without forming a metallizing layer or using harmful flux. Therefore, by using the aluminum alloy of the present invention, a member in which ceramics and aluminum alloy are firmly bonded and suspended can be obtained at low cost and without any safety or pollution problems.
第１図は実施例における接合時の温度−荷重−時間曲線
を示す線図、第２図は実施例におりる４点曲げ試験用の
試験片を示す斜視図、第３図は実施例における４点曲げ
試験用治具を示す正面図である。Fig. 1 is a diagram showing the temperature-load-time curve during welding in the example, Fig. 2 is a perspective view showing a test piece for the four-point bending test in the example, and Fig. 3 is a diagram showing the test piece for the four-point bending test in the example. FIG. 3 is a front view showing a jig for a four-point bending test.
Claims (1)
方もしくは双方を含有し、残部がＡｌおよび不可避的不
純物よりなることを特徴とするセラミックス接合用アル
ミニウム合金。An aluminum alloy for joining ceramics, which contains either or both of 0.5 to 3% Li and 2 to 8% Cu by weight, with the balance being Al and inevitable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63197523A JP2651847B2 (en) | 1988-08-08 | 1988-08-08 | Aluminum alloy for ceramic joining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63197523A JP2651847B2 (en) | 1988-08-08 | 1988-08-08 | Aluminum alloy for ceramic joining |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0247236A true JPH0247236A (en) | 1990-02-16 |
| JP2651847B2 JP2651847B2 (en) | 1997-09-10 |
Family
ID=16375883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63197523A Expired - Lifetime JP2651847B2 (en) | 1988-08-08 | 1988-08-08 | Aluminum alloy for ceramic joining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2651847B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018172281A (en) * | 2011-11-30 | 2018-11-08 | コンポーネント リ−エンジニアリング カンパニー インコーポレイテッド | Method for joining materials, plate and shaft device, and multilayer plate formed therewith |
| US10991616B2 (en) | 2011-11-30 | 2021-04-27 | Watlow Electric Manufacturing Company | High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using same |
| US11091397B2 (en) | 2011-11-30 | 2021-08-17 | Watlow Electric Manufacturing Company | Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices |
| US11229968B2 (en) | 2011-11-30 | 2022-01-25 | Watlow Electric Manufacturing Company | Semiconductor substrate support with multiple electrodes and method for making same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55116682A (en) * | 1979-03-05 | 1980-09-08 | Hitachi Ltd | Soldering material for ceranic conjunction |
| JPS61291943A (en) * | 1985-06-19 | 1986-12-22 | Masaaki Naga | Alloy for metallizing |
| JPS63220987A (en) * | 1987-03-06 | 1988-09-14 | Natl Res Inst For Metals | Diffused joining method for aluminum to alumina ceramics |
-
1988
- 1988-08-08 JP JP63197523A patent/JP2651847B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55116682A (en) * | 1979-03-05 | 1980-09-08 | Hitachi Ltd | Soldering material for ceranic conjunction |
| JPS61291943A (en) * | 1985-06-19 | 1986-12-22 | Masaaki Naga | Alloy for metallizing |
| JPS63220987A (en) * | 1987-03-06 | 1988-09-14 | Natl Res Inst For Metals | Diffused joining method for aluminum to alumina ceramics |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018172281A (en) * | 2011-11-30 | 2018-11-08 | コンポーネント リ−エンジニアリング カンパニー インコーポレイテッド | Method for joining materials, plate and shaft device, and multilayer plate formed therewith |
| US10991616B2 (en) | 2011-11-30 | 2021-04-27 | Watlow Electric Manufacturing Company | High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using same |
| US11091397B2 (en) | 2011-11-30 | 2021-08-17 | Watlow Electric Manufacturing Company | Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices |
| US11229968B2 (en) | 2011-11-30 | 2022-01-25 | Watlow Electric Manufacturing Company | Semiconductor substrate support with multiple electrodes and method for making same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2651847B2 (en) | 1997-09-10 |
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