JPH0247081U - - Google Patents
Info
- Publication number
- JPH0247081U JPH0247081U JP12642088U JP12642088U JPH0247081U JP H0247081 U JPH0247081 U JP H0247081U JP 12642088 U JP12642088 U JP 12642088U JP 12642088 U JP12642088 U JP 12642088U JP H0247081 U JPH0247081 U JP H0247081U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- electronic components
- lead
- wiring pattern
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12642088U JPH0247081U (es) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12642088U JPH0247081U (es) | 1988-09-27 | 1988-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0247081U true JPH0247081U (es) | 1990-03-30 |
Family
ID=31377928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12642088U Pending JPH0247081U (es) | 1988-09-27 | 1988-09-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0247081U (es) |
-
1988
- 1988-09-27 JP JP12642088U patent/JPH0247081U/ja active Pending