JPH0247054U - - Google Patents
Info
- Publication number
- JPH0247054U JPH0247054U JP1988126174U JP12617488U JPH0247054U JP H0247054 U JPH0247054 U JP H0247054U JP 1988126174 U JP1988126174 U JP 1988126174U JP 12617488 U JP12617488 U JP 12617488U JP H0247054 U JPH0247054 U JP H0247054U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor elements
- housing semiconductor
- package
- registration request
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126174U JPH0247054U (enFirst) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126174U JPH0247054U (enFirst) | 1988-09-26 | 1988-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247054U true JPH0247054U (enFirst) | 1990-03-30 |
Family
ID=31377447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988126174U Pending JPH0247054U (enFirst) | 1988-09-26 | 1988-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247054U (enFirst) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0740870A (ja) * | 1993-04-01 | 1995-02-10 | Hidetoshi Nishiyama | 作業用保護カバーの係止具 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027151A (ja) * | 1983-07-25 | 1985-02-12 | Sumitomo Electric Ind Ltd | 半導体素子搭載用複合金属条 |
-
1988
- 1988-09-26 JP JP1988126174U patent/JPH0247054U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027151A (ja) * | 1983-07-25 | 1985-02-12 | Sumitomo Electric Ind Ltd | 半導体素子搭載用複合金属条 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0740870A (ja) * | 1993-04-01 | 1995-02-10 | Hidetoshi Nishiyama | 作業用保護カバーの係止具 |