JPH0246605U - - Google Patents

Info

Publication number
JPH0246605U
JPH0246605U JP12462788U JP12462788U JPH0246605U JP H0246605 U JPH0246605 U JP H0246605U JP 12462788 U JP12462788 U JP 12462788U JP 12462788 U JP12462788 U JP 12462788U JP H0246605 U JPH0246605 U JP H0246605U
Authority
JP
Japan
Prior art keywords
gate
cavity
molding device
resin
injected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12462788U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12462788U priority Critical patent/JPH0246605U/ja
Publication of JPH0246605U publication Critical patent/JPH0246605U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Description

【図面の簡単な説明】
第1図は本考案装置の要部側断面図、第2図乃
至第4図は本考案装置で作成した製品の外観斜視
図、第5図は従来装置の要部側断面図を示す。 1,2…金型、3,4…キヤビテイ、6…樹脂
、7…ゲート、8…凹部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 上下金型の衝合面にキヤビテイを形成し、前記
    キヤビテイ内にゲートを介して樹脂を注入するよ
    うにしたモールド装置において、上記ゲート部分
    の、キヤビテイ開口部分とキヤビテイ底部の間に
    ゲートと連通する凹部をもうけたことを特徴とす
    る樹脂モールド装置。
JP12462788U 1988-09-22 1988-09-22 Pending JPH0246605U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12462788U JPH0246605U (ja) 1988-09-22 1988-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12462788U JPH0246605U (ja) 1988-09-22 1988-09-22

Publications (1)

Publication Number Publication Date
JPH0246605U true JPH0246605U (ja) 1990-03-30

Family

ID=31374531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12462788U Pending JPH0246605U (ja) 1988-09-22 1988-09-22

Country Status (1)

Country Link
JP (1) JPH0246605U (ja)

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