JPH0245680U - - Google Patents

Info

Publication number
JPH0245680U
JPH0245680U JP12456788U JP12456788U JPH0245680U JP H0245680 U JPH0245680 U JP H0245680U JP 12456788 U JP12456788 U JP 12456788U JP 12456788 U JP12456788 U JP 12456788U JP H0245680 U JPH0245680 U JP H0245680U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
electronic components
thermoplastic sheet
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12456788U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12456788U priority Critical patent/JPH0245680U/ja
Publication of JPH0245680U publication Critical patent/JPH0245680U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP12456788U 1988-09-22 1988-09-22 Pending JPH0245680U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12456788U JPH0245680U (fr) 1988-09-22 1988-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12456788U JPH0245680U (fr) 1988-09-22 1988-09-22

Publications (1)

Publication Number Publication Date
JPH0245680U true JPH0245680U (fr) 1990-03-29

Family

ID=31374414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12456788U Pending JPH0245680U (fr) 1988-09-22 1988-09-22

Country Status (1)

Country Link
JP (1) JPH0245680U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015228421A (ja) * 2014-05-31 2015-12-17 布施真空株式会社 保護処理を施した回路基板、及び回路基板の保護処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015228421A (ja) * 2014-05-31 2015-12-17 布施真空株式会社 保護処理を施した回路基板、及び回路基板の保護処理方法

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