JPH0245646U - - Google Patents
Info
- Publication number
- JPH0245646U JPH0245646U JP12481188U JP12481188U JPH0245646U JP H0245646 U JPH0245646 U JP H0245646U JP 12481188 U JP12481188 U JP 12481188U JP 12481188 U JP12481188 U JP 12481188U JP H0245646 U JPH0245646 U JP H0245646U
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- vicinity
- bonded
- resin
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12481188U JPH0245646U (bg) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12481188U JPH0245646U (bg) | 1988-09-22 | 1988-09-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0245646U true JPH0245646U (bg) | 1990-03-29 |
Family
ID=31374866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12481188U Pending JPH0245646U (bg) | 1988-09-22 | 1988-09-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0245646U (bg) |
-
1988
- 1988-09-22 JP JP12481188U patent/JPH0245646U/ja active Pending