JPH0244734A - Manufacture of mis transistor - Google Patents

Manufacture of mis transistor

Info

Publication number
JPH0244734A
JPH0244734A JP19519688A JP19519688A JPH0244734A JP H0244734 A JPH0244734 A JP H0244734A JP 19519688 A JP19519688 A JP 19519688A JP 19519688 A JP19519688 A JP 19519688A JP H0244734 A JPH0244734 A JP H0244734A
Authority
JP
Japan
Prior art keywords
region
film
forming
mask
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19519688A
Other languages
Japanese (ja)
Inventor
Masataka Shingu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP19519688A priority Critical patent/JPH0244734A/en
Publication of JPH0244734A publication Critical patent/JPH0244734A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve punchthrough-breakdown strength by forming a third region with a gate electrode as a mask, then forming a first thin mask layer at least on the sidewall of the electrode in a direction for extending a semiconductor region forms a second mask layer to form a first region, and then forming a second region.
CONSTITUTION: An SiO2 film 22 is deposited on a whole Si substrate 11, and P- ions are implanted to form an n- type region 16 in a p- type region 21. In this case, since the film 22 exists, the length of the mask for the ion implantation is longer by the thickness of the film 22 than that of only a gate electrode 13 of a mask at the time of forming the region 21 at both sides of the electrode 13. Then, an SiO2 film 23 is again deposited on the whole substrate 11, the films 22, 23 are etched by RIE, sidewalls 14 of the films 22, 23 are formed, and with the electrode 13 and the sidewall 14 as masks P- ions are implanted to form an n+ type region 15. Thus, the width of a third region can be effectively obtained in a direction for extending a semiconductor region to enhance punchthrough-breakdown strength.
COPYRIGHT: (C)1990,JPO&Japio
JP19519688A 1988-08-04 1988-08-04 Manufacture of mis transistor Pending JPH0244734A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19519688A JPH0244734A (en) 1988-08-04 1988-08-04 Manufacture of mis transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19519688A JPH0244734A (en) 1988-08-04 1988-08-04 Manufacture of mis transistor

Publications (1)

Publication Number Publication Date
JPH0244734A true JPH0244734A (en) 1990-02-14

Family

ID=16337051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19519688A Pending JPH0244734A (en) 1988-08-04 1988-08-04 Manufacture of mis transistor

Country Status (1)

Country Link
JP (1) JPH0244734A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173438A (en) * 2004-12-17 2006-06-29 Yamaha Corp Method of manufacturing mos type semiconductor device
US7223663B2 (en) 2003-12-27 2007-05-29 Dongbu Electronics Co., Ltd. MOS transistors and methods of manufacturing the same
JP2007214503A (en) * 2006-02-13 2007-08-23 Yamaha Corp Manufacturing method of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7223663B2 (en) 2003-12-27 2007-05-29 Dongbu Electronics Co., Ltd. MOS transistors and methods of manufacturing the same
JP2006173438A (en) * 2004-12-17 2006-06-29 Yamaha Corp Method of manufacturing mos type semiconductor device
JP2007214503A (en) * 2006-02-13 2007-08-23 Yamaha Corp Manufacturing method of semiconductor device

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