JPH0244398U - - Google Patents

Info

Publication number
JPH0244398U
JPH0244398U JP1988122851U JP12285188U JPH0244398U JP H0244398 U JPH0244398 U JP H0244398U JP 1988122851 U JP1988122851 U JP 1988122851U JP 12285188 U JP12285188 U JP 12285188U JP H0244398 U JPH0244398 U JP H0244398U
Authority
JP
Japan
Prior art keywords
shield
insulating layer
layer
conductors
jumper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988122851U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988122851U priority Critical patent/JPH0244398U/ja
Priority to AU40974/89A priority patent/AU4097489A/en
Priority to EP19890309507 priority patent/EP0360558A3/en
Publication of JPH0244398U publication Critical patent/JPH0244398U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/771—Details
    • H01R12/775—Ground or shield arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Multi-Conductor Connections (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例を示す正面図、
第２図は同実施例の側面図、第３図はピンと導体
との接続状態を説明する一部を切り欠いた斜視図
である。 （主要部分の符号の説明）、１……導体、１０
，１１……リード、２……第１の絶縁層、３……
シールド層、４……ピン、４１……接続部、４２
……脚部。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 一定の間隔を置いて並設する複数の導体１と
    、 該複数の導体をそのリード部分１０，１１を除
    いて被覆する第１の絶縁層２と 該第１の絶縁層の少なくとも片側の面に重ねた
    薄い導電性のシールド層３と 該シールド層の外側から該シールド層と前記第
    １の絶縁層とを貫通して前記複数の導体の少なく
    とも一本に接続する接続部４１と、該接続部によ
    つて接続された導体のリードに重なる脚部４２と
    を有する接地用のピン４とからなる、 シールド・ジヤンパー。 ２ 請求項第１項に記載のシールド・ジヤンパー
    において、前記シールド層に重ねて薄い第２の絶
    縁層５を設けた、シールド・ジヤンパー。 ３ 請求項第１項に記載のシールド・ジヤンパー
    において、前記導体の各々は、前記第１の絶縁層
    に被覆される部分をフラツト状に形成し、かつ前
    記接地用のピンは、該フラツト状の導体部分と接
    続することを特徴とするシールド・ジヤンパー。
JP1988122851U 1988-09-21 1988-09-21 Pending JPH0244398U (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1988122851U JPH0244398U (ja) 1988-09-21 1988-09-21
AU40974/89A AU4097489A (en) 1988-09-21 1989-08-31 Shielded jumper
EP19890309507 EP0360558A3 (en) 1988-09-21 1989-09-19 Shielded jumper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988122851U JPH0244398U (ja) 1988-09-21 1988-09-21

Publications (1)

Publication Number Publication Date
JPH0244398U true JPH0244398U (ja) 1990-03-27

Family

ID=14846211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988122851U Pending JPH0244398U (ja) 1988-09-21 1988-09-21

Country Status (3)

Country Link
EP (1) EP0360558A3 (ja)
JP (1) JPH0244398U (ja)
AU (1) AU4097489A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006331682A (ja) * 2005-05-23 2006-12-07 Yazaki Corp シールド処理方法、シールドタイプフラット回路体及びワイヤハーネス

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697925A (en) * 1970-07-22 1972-10-10 Amp Inc Termination means for flat cable
DE2259858A1 (de) * 1972-12-07 1974-06-12 Kabel Metallwerke Ghh Verfahren zum kontaktieren der abschirmung von geschirmten flachleiterbandleitungen

Also Published As

Publication number Publication date
AU4097489A (en) 1990-03-29
EP0360558A2 (en) 1990-03-28
EP0360558A3 (en) 1990-10-17

Similar Documents

Publication Publication Date Title
JPH01133701U (ja)
JPH0449485U (ja)
JPH0244398U (ja)
JPH0442090U (ja)
JPH0436722U (ja)
JPH0379511U (ja)
JPH0337718U (ja)
JPS61158910U (ja)
JPH0288269U (ja)
JPH02138810U (ja)
JPS6265898U (ja)
JPS61145415U (ja)
JPH0313667U (ja)
JPH0333912U (ja)
JPS611213U (ja) 平型絶縁電線
JPH0384513U (ja)
JPH01177873U (ja)
JPS61136579U (ja)
JPH01179316U (ja)
JPH02143712U (ja)
JPH0297720U (ja)
JPH0379510U (ja)
JPH0374469U (ja)
JPH0236207U (ja)
JPS6372856U (ja)