JPH0244375U - - Google Patents
Info
- Publication number
- JPH0244375U JPH0244375U JP12280888U JP12280888U JPH0244375U JP H0244375 U JPH0244375 U JP H0244375U JP 12280888 U JP12280888 U JP 12280888U JP 12280888 U JP12280888 U JP 12280888U JP H0244375 U JPH0244375 U JP H0244375U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- circuit board
- adhesive layer
- solder
- melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000006071 cream Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12280888U JPH0244375U (lm) | 1988-09-21 | 1988-09-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12280888U JPH0244375U (lm) | 1988-09-21 | 1988-09-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0244375U true JPH0244375U (lm) | 1990-03-27 |
Family
ID=31371082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12280888U Pending JPH0244375U (lm) | 1988-09-21 | 1988-09-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0244375U (lm) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08172258A (ja) * | 1994-12-16 | 1996-07-02 | Sony Chem Corp | 電子部品の実装方法 |
-
1988
- 1988-09-21 JP JP12280888U patent/JPH0244375U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08172258A (ja) * | 1994-12-16 | 1996-07-02 | Sony Chem Corp | 電子部品の実装方法 |