JPH0243745A - Manufacture of photoelectric conversion element molded with transparent resin - Google Patents
Manufacture of photoelectric conversion element molded with transparent resinInfo
- Publication number
- JPH0243745A JPH0243745A JP63194903A JP19490388A JPH0243745A JP H0243745 A JPH0243745 A JP H0243745A JP 63194903 A JP63194903 A JP 63194903A JP 19490388 A JP19490388 A JP 19490388A JP H0243745 A JPH0243745 A JP H0243745A
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric conversion
- transparent resin
- tape
- conversion element
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 50
- 229920005989 resin Polymers 0.000 title claims abstract description 50
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 230000002093 peripheral effect Effects 0.000 abstract description 7
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ホトトランジスタ等の光電変換素子とその
周辺回路とから構成された半導体集積回路素子を透明樹
脂でモールドしてパフケージとするものに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a puff cage made by molding a semiconductor integrated circuit element composed of a photoelectric conversion element such as a phototransistor and its peripheral circuit with a transparent resin. .
（従来の技術〕
第３図は従来の技術例の断面図、第４図は異る従来の技
術例の断面図である。(Prior Art) FIG. 3 is a sectional view of a conventional technique, and FIG. 4 is a sectional view of a different conventional technique.
これらの図面において、マウント部１と外部リード２と
からなるリードフレーム３のマウント部１には光電変換
素子とその周辺回路とからなる半導体集積回路素子４が
装着されている。この半導体集積回路素子４は金属線５
で外部リード２に接続され、全体が透明樹脂６でモール
ドされてパッケニジとなる。矢印は光線を示し、センサ
部である光電変換素子が正面から受光すべき本来の光の
ほかに様々な方向からも受光する。In these drawings, a semiconductor integrated circuit element 4 comprising a photoelectric conversion element and its peripheral circuit is mounted on a mount part 1 of a lead frame 3 comprising a mount part 1 and external leads 2. This semiconductor integrated circuit element 4 has a metal wire 5
It is connected to external leads 2, and the whole is molded with transparent resin 6 to form a package. The arrows indicate light rays, and the photoelectric conversion element, which is the sensor section, receives light from various directions in addition to the original light that should be received from the front.
後者の従来の技術例では図示するように透明樹脂６の裏
面に黒色被膜７を施して裏面からの無駄な受光をさえぎ
っている。In the latter conventional technique, as shown in the figure, a black film 7 is applied to the back surface of the transparent resin 6 to block unnecessary light reception from the back surface.
また特に図示しないが、半導体集積回路素子を透明樹脂
でモールドし、その外表面のうち、センサ部である光電
変換素子部分に対応する受光面のみを透明で平滑にし、
その他の表面を梨地加工するものもある。梨地加工した
表面から入射する光を減少させるためである。Although not particularly shown, the semiconductor integrated circuit element is molded with transparent resin, and only the light-receiving surface corresponding to the photoelectric conversion element part, which is the sensor part, is made transparent and smooth among its outer surfaces.
Others have a satin finish on the surface. This is to reduce the amount of light that enters from the satin finished surface.
前記の従来の技術において、センサ部である光電変換素
子が正面から受光すべき本来の光取外の光は、迷光又は
乱光ともいわれて光電変換作用の感度の低下や、誤動作
をもたらすことがある。これは光電変換素子の周辺にあ
る周辺回路に光が当る時にも生じることがある。従って
前記のようにパッケージを透明樹脂でモールドするもの
は、様々な方向からの迷光又は乱光が光電変換特性の低
下や、誤動作の原因となる。そして裏面に黒色被膜を施
しても、或は受光面を透明で平滑にして他の外面を梨地
加工しても大幅な改善にならない。In the above-mentioned conventional technology, the light that is supposed to be received from the front by the photoelectric conversion element, which is the sensor section, is also called stray light or scattered light, which may reduce the sensitivity of the photoelectric conversion effect or cause malfunctions. be. This may also occur when light hits peripheral circuits around the photoelectric conversion element. Therefore, in the case where the package is molded with transparent resin as described above, stray light or scattered light from various directions causes deterioration of photoelectric conversion characteristics and malfunction. Even if a black film is applied to the back surface, or the light-receiving surface is made transparent and smooth and the other outer surfaces are treated with a satin finish, no significant improvement is achieved.
この発明の目的は、センサ部である光電変換素子の受光
面以外からの迷光や乱光を確実に防止し、光電変換特性
を向上させることにある。An object of the present invention is to reliably prevent stray light and scattered light from sources other than the light-receiving surface of a photoelectric conversion element, which is a sensor section, and to improve photoelectric conversion characteristics.
この発明は、マウント部に装着して外部リードに接続を
施した光電変換素子を透明樹脂でモールドするものにお
いて、前記光電変換素子の受光面に対応する前記透明樹
脂の表面に剥離性のあるテープを貼り付け、このテープ
ごと前記透明樹脂の外表面に不透光性の樹脂膜を薄く被
着し、その後に前記テープをこのテープの表面に被着し
た樹脂膜とともに剥離して前記受光面に開口部を形成す
るものである。In the present invention, in which a photoelectric conversion element mounted on a mount part and connected to an external lead is molded with a transparent resin, a peelable tape is attached to a surface of the transparent resin corresponding to a light receiving surface of the photoelectric conversion element. A thin non-transparent resin film is applied to the outer surface of the transparent resin together with this tape, and then the tape is peeled together with the resin film applied to the surface of the tape to cover the light-receiving surface. It forms an opening.
光電変換素子をモールドした透明樹脂６の外表面に被着
された不透光性の薄い樹脂膜９．９ａはテープ８を剥離
すると、このテープ８の表面に被着した樹脂膜９ａのみ
がテープ８とともに剥離して受光面に対応した開口部１
０が形成され、透明樹脂６の他の面は不透光性の樹脂膜
９で依然層われて迷光・乱光の入射が確実に防止される
。When the tape 8 is peeled off, only the resin film 9a that is attached to the surface of the tape 8 is the thin non-transparent resin film 9.9a that is attached to the outer surface of the transparent resin 6 in which the photoelectric conversion element is molded. Opening part 1 corresponding to the light-receiving surface by peeling off with 8
0 is formed, and the other surface of the transparent resin 6 is still covered with an opaque resin film 9 to reliably prevent the incidence of stray light and scattered light.
第１図は実施例の断面図、第２図は第１図の平面図であ
る。FIG. 1 is a sectional view of the embodiment, and FIG. 2 is a plan view of FIG. 1.
図面において、前述の従来の技術を示す図面と同一符号
を付したものはおよそ同一機能を持つ。In the drawings, the same reference numerals as in the drawings showing the above-mentioned conventional technology have approximately the same functions.
すなわちマウント部１と外部リード２とからなるノード
フレーム３のマウント部１には光電変換素子とその周辺
回路とからなる半導体集積回路素子４が装着され、金属
線５で接続後に透明樹脂６でモールドされる。なお、バ
ンブを持った素子をフレキシブルなテープにボンディン
グするテープアセンブリの方法で装着するなど他の装着
方法を用いてもよい。次に前記の透明樹脂６でモールド
した半導体集積回路素子４の外部リード２をフレキシブ
ルプリント基板２ａにはんだ付けする。That is, a semiconductor integrated circuit element 4 consisting of a photoelectric conversion element and its peripheral circuit is mounted on the mount part 1 of a node frame 3 consisting of a mount part 1 and external leads 2, and is molded with a transparent resin 6 after being connected with metal wires 5. be done. Note that other mounting methods may be used, such as mounting by a tape assembly method in which an element with bumps is bonded to a flexible tape. Next, the external leads 2 of the semiconductor integrated circuit element 4 molded with the transparent resin 6 are soldered to the flexible printed circuit board 2a.
さて、半導体集積回路素子４の表面は、例えばそのごく
一部が光電変換素子とされ、他の大部分が周辺回路とさ
れ、光電変換素子に対応する受光面にのみ光を照射する
ことが望ましい。そこで前記透明樹脂６の受光面に対応
する表面に受光面と同一の形状のテープ８を貼り付け、
このテープ８ごと透明樹脂６の表面に黒又は他の色で着
色した不透光性の樹脂膜９を薄く被着する。前記テープ
８は粘着テープのように剥離性があり、また樹脂膜９は
樹脂液を滴下させて対象物の表面に被着させるポツティ
ングの技術が適するが、フレキシブルプリント基板２ａ
を持たないもの等の場合には樹脂液に消すデイピング又
は粉体塗装、噴霧塗装等の公知の技術が使用できる。樹
脂膜９の硬化又は半硬化後に前記テープ８をこのテープ
の表面の樹脂膜９ａとともに剥離して受光面に対応する
開口部ｌＯを透明樹脂６の表面に形成する。Now, it is preferable that the surface of the semiconductor integrated circuit element 4 is such that only a small part thereof is used as a photoelectric conversion element, and the other part is used as a peripheral circuit, and that light is irradiated only on the light-receiving surface corresponding to the photoelectric conversion element. . Therefore, a tape 8 having the same shape as the light receiving surface is attached to the surface of the transparent resin 6 corresponding to the light receiving surface.
An opaque resin film 9 colored black or another color is thinly applied to the surface of the transparent resin 6 along with the tape 8. The tape 8 is removable like an adhesive tape, and the resin film 9 is suitable for a potting technique in which resin liquid is dropped onto the surface of the object.
In the case of a material that does not have a resin, known techniques such as dipping in resin liquid, powder coating, and spray coating can be used. After the resin film 9 is cured or semi-cured, the tape 8 is peeled together with the resin film 9a on the surface of the tape to form an opening 10 on the surface of the transparent resin 6 corresponding to the light receiving surface.
この発明は、マウント部に装着して外部リードに接続を
施した光電変換素子を透明樹脂でモールドするものにお
いて、前記光電変換素子の受光面に対応する前記透明樹
脂の表面に剥離性のあるテープを貼り付け、このテープ
ごと前記透明樹脂の外表面に不透光性の樹脂膜を薄く被
着し、その後に前記テープをこのテープの表面に被着し
た樹脂膜とともに剥離して前記受光面に開口部を形成す
るようにしたので、半導体集積回路素子は周辺回路を除
くセンサ部である光電変換素子に対応した受光面のみか
ら受光して、迷光又は乱光の入射が確実に防止されると
いう効果があり、経済的な工程によって感度の低下や誤
動作が阻止されて光電変換特性が向上するという効果が
ある。In the present invention, in which a photoelectric conversion element mounted on a mount part and connected to an external lead is molded with a transparent resin, a peelable tape is attached to a surface of the transparent resin corresponding to a light receiving surface of the photoelectric conversion element. A thin non-transparent resin film is applied to the outer surface of the transparent resin together with this tape, and then the tape is peeled together with the resin film applied to the surface of the tape to cover the light-receiving surface. Since the opening is formed, the semiconductor integrated circuit element receives light only from the light-receiving surface corresponding to the photoelectric conversion element, which is the sensor part, excluding peripheral circuits, thereby reliably preventing stray light or scattered light from entering. This is an effective and economical process that prevents a decrease in sensitivity and malfunctions and improves photoelectric conversion characteristics.
第１図は実施例の断面図、第２図は第１図の平面図であ
り第３図は従来の技術例の断面図、第４図は異る従来の
技術例の断面図である。
１・・・マウント部、３・・・リードフレーム、４・・
・半導体集積回路素子、６・・・透明樹脂、８・・・テ
ープ、９・・・樹脂膜、１０・・・開口部。1 is a sectional view of the embodiment, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a sectional view of a conventional technique, and FIG. 4 is a sectional view of a different conventional technique. 1...Mount part, 3...Lead frame, 4...
- Semiconductor integrated circuit element, 6... Transparent resin, 8... Tape, 9... Resin film, 10... Opening.
Claims (1)
電変換素子を透明樹脂でモールドするものにおいて、前
記光電変換素子の受光面に対応する前記透明樹脂の表面
に剥離性のあるテープを貼り付け、このテープごと前記
透明樹脂の外表面に不透光性の樹脂膜を薄く被着し、そ
の後に前記テープをこのテープの表面に被着した樹脂膜
とともに、剥離して前記受光面に開口部を形成すること
を特徴とする透明樹脂でモールドした光電変換素子の製
造方法。1) In a device in which a photoelectric conversion element mounted on a mount part and connected to an external lead is molded with a transparent resin, a peelable tape is pasted on the surface of the transparent resin corresponding to the light receiving surface of the photoelectric conversion element. A thin non-transparent resin film is applied to the outer surface of the transparent resin together with this tape, and then the tape is peeled off along with the resin film applied to the surface of the tape to form an opening on the light receiving surface. 1. A method of manufacturing a photoelectric conversion element molded with a transparent resin, the method comprising: forming a transparent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63194903A JPH0243745A (en) | 1988-08-04 | 1988-08-04 | Manufacture of photoelectric conversion element molded with transparent resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63194903A JPH0243745A (en) | 1988-08-04 | 1988-08-04 | Manufacture of photoelectric conversion element molded with transparent resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0243745A true JPH0243745A (en) | 1990-02-14 |
Family
ID=16332253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63194903A Pending JPH0243745A (en) | 1988-08-04 | 1988-08-04 | Manufacture of photoelectric conversion element molded with transparent resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0243745A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6911353B2 (en) * | 1997-03-10 | 2005-06-28 | Sanyo Electric Co., Ltd. | Semiconductor device and method of manufacturing same |
-
1988
- 1988-08-04 JP JP63194903A patent/JPH0243745A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6911353B2 (en) * | 1997-03-10 | 2005-06-28 | Sanyo Electric Co., Ltd. | Semiconductor device and method of manufacturing same |
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