JPH0242471U - - Google Patents
Info
- Publication number
- JPH0242471U JPH0242471U JP12122588U JP12122588U JPH0242471U JP H0242471 U JPH0242471 U JP H0242471U JP 12122588 U JP12122588 U JP 12122588U JP 12122588 U JP12122588 U JP 12122588U JP H0242471 U JPH0242471 U JP H0242471U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- wiring board
- printed wiring
- soldered
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000012808 vapor phase Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａおよびｂは本考案の一実施例を示す平
面図およびＸ―Ｘ線断面図である。 １……印刷配線板、２……穴、３……ＩＣ、４
……ペースト状はんだ。
面図およびＸ―Ｘ線断面図である。 １……印刷配線板、２……穴、３……ＩＣ、４
……ペースト状はんだ。
Claims (1)
- 集積回路を搭載しベーパーフエイズソルダリン
グ装置においてリフロー方式によつて前記集積回
路のリードを配線パターンにはんだ付けする印刷
配線板において、前記集積回路を搭載する位置に
上下に貫通するガス排出用穴を設けたことを特徴
とする印刷配線板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12122588U JPH0242471U (ja) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12122588U JPH0242471U (ja) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242471U true JPH0242471U (ja) | 1990-03-23 |
Family
ID=31368038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12122588U Pending JPH0242471U (ja) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242471U (ja) |
-
1988
- 1988-09-16 JP JP12122588U patent/JPH0242471U/ja active Pending