JPH0242448U - - Google Patents
Info
- Publication number
- JPH0242448U JPH0242448U JP1988122049U JP12204988U JPH0242448U JP H0242448 U JPH0242448 U JP H0242448U JP 1988122049 U JP1988122049 U JP 1988122049U JP 12204988 U JP12204988 U JP 12204988U JP H0242448 U JPH0242448 U JP H0242448U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- photoelectric conversion
- conversion chip
- refractive index
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims 6
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、この考案の一実施例に係るホトダイ
オードの横断面図、第２図は、同ホトダイオード
の正面図、第３図は、同ホトダイオードの外観斜
視図、第４図は、従来のホトダイオードの中央縦
断面図である。
２・３：リード、４：ホトダイオードチツプ、
６：第１の樹脂、６ａ：入射面、７：第２の樹脂
、８：境界面。
Fig. 1 is a cross-sectional view of a photodiode according to an embodiment of the invention, Fig. 2 is a front view of the photodiode, Fig. 3 is an external perspective view of the photodiode, and Fig. 4 is a conventional photodiode. FIG. 2/3: Lead, 4: Photodiode chip,
6: first resin, 6a: entrance surface, 7: second resin, 8: boundary surface.
Claims (1)
するリードと、前記光電変換チツプ及び前記リー
ド先端部とをモールドし、前記光電変換チツプ背
面側を入射面とする第１の樹脂と、この第１の樹
脂の屈折率より小さい屈折率を有し、前記第１の
樹脂をモールドする第２の樹脂とを備え、この第
１の樹脂と第２の樹脂との境界面を、前記光電変
換チツプ正面に対向する凹面とした光電変換素子
。 A first resin molded with a photoelectric conversion chip, a lead electrically connected to the photoelectric conversion chip, the photoelectric conversion chip and the tip of the lead, and whose entrance surface is the back side of the photoelectric conversion chip; a second resin having a refractive index smaller than the refractive index of the resin and molding the first resin, and an interface between the first resin and the second resin is placed in front of the photoelectric conversion chip. A photoelectric conversion element with opposing concave surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122049U JPH0751800Y2 (en) | 1988-09-17 | 1988-09-17 | Photoelectric conversion element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122049U JPH0751800Y2 (en) | 1988-09-17 | 1988-09-17 | Photoelectric conversion element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0242448U true JPH0242448U (en) | 1990-03-23 |
| JPH0751800Y2 JPH0751800Y2 (en) | 1995-11-22 |
Family
ID=31369614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988122049U Expired - Lifetime JPH0751800Y2 (en) | 1988-09-17 | 1988-09-17 | Photoelectric conversion element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751800Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55158681A (en) * | 1979-05-29 | 1980-12-10 | Matsushita Electric Ind Co Ltd | Solar cell both sides of which are illuminated |
| JPS6079756U (en) * | 1983-11-04 | 1985-06-03 | 三洋電機株式会社 | Optical semiconductor device |
-
1988
- 1988-09-17 JP JP1988122049U patent/JPH0751800Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55158681A (en) * | 1979-05-29 | 1980-12-10 | Matsushita Electric Ind Co Ltd | Solar cell both sides of which are illuminated |
| JPS6079756U (en) * | 1983-11-04 | 1985-06-03 | 三洋電機株式会社 | Optical semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0751800Y2 (en) | 1995-11-22 |