JPH0242448U - - Google Patents
Info
- Publication number
- JPH0242448U JPH0242448U JP1988122049U JP12204988U JPH0242448U JP H0242448 U JPH0242448 U JP H0242448U JP 1988122049 U JP1988122049 U JP 1988122049U JP 12204988 U JP12204988 U JP 12204988U JP H0242448 U JPH0242448 U JP H0242448U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- photoelectric conversion
- conversion chip
- refractive index
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims 6
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988122049U JPH0751800Y2 (ja) | 1988-09-17 | 1988-09-17 | 光電変換素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988122049U JPH0751800Y2 (ja) | 1988-09-17 | 1988-09-17 | 光電変換素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0242448U true JPH0242448U (US07122547-20061017-C00273.png) | 1990-03-23 |
JPH0751800Y2 JPH0751800Y2 (ja) | 1995-11-22 |
Family
ID=31369614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988122049U Expired - Lifetime JPH0751800Y2 (ja) | 1988-09-17 | 1988-09-17 | 光電変換素子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0751800Y2 (US07122547-20061017-C00273.png) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55158681A (en) * | 1979-05-29 | 1980-12-10 | Matsushita Electric Ind Co Ltd | Solar cell both sides of which are illuminated |
JPS6079756U (ja) * | 1983-11-04 | 1985-06-03 | 三洋電機株式会社 | 光半導体装置 |
-
1988
- 1988-09-17 JP JP1988122049U patent/JPH0751800Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55158681A (en) * | 1979-05-29 | 1980-12-10 | Matsushita Electric Ind Co Ltd | Solar cell both sides of which are illuminated |
JPS6079756U (ja) * | 1983-11-04 | 1985-06-03 | 三洋電機株式会社 | 光半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0751800Y2 (ja) | 1995-11-22 |