JPH0241476U - - Google Patents

Info

Publication number
JPH0241476U
JPH0241476U JP1988120757U JP12075788U JPH0241476U JP H0241476 U JPH0241476 U JP H0241476U JP 1988120757 U JP1988120757 U JP 1988120757U JP 12075788 U JP12075788 U JP 12075788U JP H0241476 U JPH0241476 U JP H0241476U
Authority
JP
Japan
Prior art keywords
bumps
recess
electronic component
bump portion
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988120757U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988120757U priority Critical patent/JPH0241476U/ja
Publication of JPH0241476U publication Critical patent/JPH0241476U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1988120757U 1988-09-14 1988-09-14 Pending JPH0241476U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988120757U JPH0241476U (ko) 1988-09-14 1988-09-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988120757U JPH0241476U (ko) 1988-09-14 1988-09-14

Publications (1)

Publication Number Publication Date
JPH0241476U true JPH0241476U (ko) 1990-03-22

Family

ID=31367151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988120757U Pending JPH0241476U (ko) 1988-09-14 1988-09-14

Country Status (1)

Country Link
JP (1) JPH0241476U (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275841A (ja) * 1992-03-30 1993-10-22 Nec Corp 多層印刷配線板
WO2018042846A1 (ja) * 2016-08-30 2018-03-08 株式会社村田製作所 電子デバイス及び多層セラミック基板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275841A (ja) * 1992-03-30 1993-10-22 Nec Corp 多層印刷配線板
WO2018042846A1 (ja) * 2016-08-30 2018-03-08 株式会社村田製作所 電子デバイス及び多層セラミック基板
CN109644559A (zh) * 2016-08-30 2019-04-16 株式会社村田制作所 电子器件以及多层陶瓷基板
JPWO2018042846A1 (ja) * 2016-08-30 2019-06-24 株式会社村田製作所 電子デバイス及び多層セラミック基板

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